SICK SIM2000ST Operating Instructions Manual

SIM2000ST
Sensor Integration Machine

O P E R A T I N G I N S T R U C T I O N S

Described product
SIM2000ST
Manufacturer
SICK AG Erwin-Sick-Str. 1 79183 Waldkirch Germany
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be reserved for SICK AG. Reproduction of this document or parts of this document is only permissible within the limits of the legal determination of Copyright Law. Any modifica‐ tion, abridgment or translation of this document is prohibited without the express writ‐ ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
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Contents

CONTENTS
1 About this document........................................................................ 5
1.1 Information on the operating instructions.............................................. 5
1.2 Explanation of symbols............................................................................ 5
1.3 Further information................................................................................... 6
1.4 Customer service...................................................................................... 6
2 Safety information............................................................................ 7
2.1 General safety notes................................................................................ 7
2.2 Intended use............................................................................................. 7
2.3 Improper use............................................................................................. 7
2.4 IP technology............................................................................................. 8
2.5 Limitation of liability................................................................................. 8
2.6 Modifications and conversions................................................................ 8
2.7 Requirements for skilled persons and operating personnel.................. 9
2.8 Operational safety and particular hazards.............................................. 9
3 Product description........................................................................... 11
3.1 Device view................................................................................................ 11
3.2 Functionality.............................................................................................. 11
3.3 SICK AppSpace......................................................................................... 13
3.4 Preset ETHERNET interfaces................................................................... 13
4 Transport and storage....................................................................... 14
4.1 Transport................................................................................................... 14
4.2 Transport inspection................................................................................. 14
4.3 Storage...................................................................................................... 14
5 Mounting............................................................................................. 15
5.1 Overview of mounting procedure............................................................. 15
5.2 Scope of delivery....................................................................................... 15
5.3 Preparing for mounting............................................................................. 15
5.4 Mounting the device................................................................................. 16
5.5 Mounting the device (at a critical ambient temperature of max.
50 °C)........................................................................................................ 18
6 Electrical installation........................................................................ 20
6.1 Important information.............................................................................. 20
6.2 Preparing the electrical installation......................................................... 20
6.3 Assembling the cables (optional)............................................................ 20
6.4 Pin allocation of the connections............................................................ 21
6.5 Connecting peripheral devices................................................................ 25
6.6 Connecting voltage supply....................................................................... 26
7 Commissioning.................................................................................. 27
7.1 Preparatory commissioning..................................................................... 27
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CONTENTS
8 Operation............................................................................................ 28
8.1 Status LEDs............................................................................................... 28
9 Maintenance...................................................................................... 31
9.1 Cleaning..................................................................................................... 31
9.2 Maintenance............................................................................................. 31
10 Decommissioning............................................................................. 32
10.1 Disposal..................................................................................................... 32
11 Technical data.................................................................................... 33
11.1 Features.................................................................................................... 33
11.2 Interfaces.................................................................................................. 33
11.3 Mechanics and electronics...................................................................... 34
11.4 Ambient data............................................................................................. 35
12 Annex.................................................................................................. 36
12.1 Dimensional drawings.............................................................................. 36
12.2 Licenses.................................................................................................... 37
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1 About this document

1.1 Information on the operating instructions

These operating instructions provide important information on how to use devices from SICK AG.
Prerequisites for safe work are:
Compliance with all safety notes and handling instructions supplied.
Compliance with local work safety regulations and general safety regulations for
device applications
The operating instructions are intended to be used by qualified personnel and electrical specialists.
NOTE
Read these operating instructions carefully before starting any work on the device, in order to familiarize yourself with the device and its functions.
The instructions constitute an integral part of the product and are to be stored in the immediate vicinity of the device so they remain accessible to staff at all times. Should the device be passed on to a third party, these operating instructions should be handed over with it.
ABOUT THIS DOCUMENT 1
These operating instructions do not provide information on operating the machine or system in which the device is integrated. For information about this, refer to the operat‐ ing instructions of the specific machine.

1.2 Explanation of symbols

Warnings and important information in this document are labeled with symbols. The warnings are introduced by signal words that indicate the extent of the danger. These warnings must be observed at all times and care must be taken to avoid accidents, per‐ sonal injury, and material damage.
DANGER
… indicates a situation of imminent danger, which will lead to a fatality or serious inju‐ ries if not prevented.
WARNING
… indicates a potentially dangerous situation, which may lead to a fatality or serious injuries if not prevented.
CAUTION
… indicates a potentially dangerous situation, which may lead to minor/slight injuries if not prevented.
NOTICE
… indicates a potentially harmful situation, which may lead to material damage if not prevented.
NOTE
… highlights useful tips and recommendations as well as information for efficient and trouble-free operation.
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1 ABOUT THIS DOCUMENT

1.3 Further information

NOTE
All the documentation available for the device can be found on the online product page at:
www.sick.com/SIM2000
b
The following information is available for download there:
Model-specific online data sheets for device variants, containing technical data,
dimensional drawings and diagrams EU declaration of conformity for the product family
Dimensional drawings and 3D CAD dimension models in various electronic for‐
mats These operating instructions, available in English and German, and in other lan‐
guages if necessary Other publications related to the devices described here
Publications dealing with accessories

1.4 Customer service

If you require any technical information, our customer service department will be happy to help. To find your representative, see the final page of this document.
NOTE
Before calling, make a note of all type label data such as type code, serial number, etc., to ensure faster processing.
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2 Safety information

2.1 General safety notes

The following safety notes must always be observed regardless of specific application conditions:
The device must only be mounted, commissioned, operated, and maintained by
professionally qualified safety personnel. Electrical connections with peripheral devices must only be made when the volt‐
age supply is disconnected. The device is only to be operated when mounted in a fixed position.
The device voltage supply must be protected in accordance with the specifications.
The specified ambient conditions must be observed at all times.
The electrical connections to peripheral devices must be screwed on or clamped
correctly. The cooling fins must not be covered or restricted in their functionality.
The pin assignment of pre-assembled cables must be checked and adjusted if
necessary. These operating instructions must be made available to the operating personnel
and kept ready to hand.
SAFETY INFORMATION 2

2.2 Intended use

The device is a programmable control and evaluation unit for sensors and image proc‐ essing devices. The device also acts as a link between system and plant controls, and the connected terminal devices. The device is mainly used in an industrial environment in production, testing, and control. Other applications are possible depending on the device-specific properties.
The device is programmed on a PC by using the development environment software SICK AppSpace. Depending on the application, a browser-based, graphical user inter‐ face (HMI) can be created, which provides opportunities defined by the application developer to influence an application at operator level.
The device connection to the peripherals is established by means of a range of indus‐ trial fieldbuses and other interfaces.
The device offers various interfaces for controlling, programming, and operating pur‐ poses, which can be activated as necessary via development environments, control sys‐ tems (programmable logic controllers), or applications.
However, configuration, programming, and control requires various technical skills, depending on how the device is connected and used.

2.3 Improper use

Any use outside of the stated areas, in particular use outside of the technical specifica‐ tions and the requirements for intended use, will be deemed to be incorrect use.
The device does not constitute a safety-relevant device according to the EC Machi‐
nery Directive (2006/42/EC). The device must not be used in explosion-hazardous areas, in corrosive environ‐
ments or under extreme environmental conditions. Any use of accessories not specifically approved by SICK AG is at your own risk.
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2 SAFETY INFORMATION
WARNING Danger due to improper use!
Any improper use can result in dangerous situations.
Therefore, observe the following information:

2.4 IP technology

NOTE
SICK uses standard IP technology in its products. The emphasis is placed on availability of products and services.
SICK always assumes the following prerequisites:
Device should be used only in accordance with its intended use. All information in these operating instructions must be strictly observed.
The customer ensures the integrity and confidentiality of the data and rights affected by its own use of the aforementioned products. In all cases, the customer implements the appropriate security measures, such as network separation, firewalls, virus protection, and patch management.

2.5 Limitation of liability

Applicable standards and regulations, the latest state of technological development, and our many years of knowledge and experience have all been taken into account when assembling the data and information contained in these operating instructions. The manufacturer accepts no liability for damage caused by:
Failing to observe the operating instructions
Incorrect use
Use by untrained personnel
Unauthorized conversions
Technical modifications
Use of unauthorized spare parts, consumables, and accessories
With special variants, where optional extras have been ordered, or owing to the latest technical changes, the actual scope of delivery may vary from the features and illustra‐ tions shown here.

2.5.1 Programmable device

The Sensor Integration Machine (SIM) is a programmable device.
Therefore the respective programmer is responsible for his/her programming perform‐ ance and the resulting working principle of the device.
The liability and warranty of SICK AG is limited to the device specification (hardware functionality and any programming interfaces) according to the agreed conditions.
2.6
8
Therefore, SICK AG is not liable, among other things, for damages that are caused by programming of the customer or third parties.

Modifications and conversions

NOTICE
Modifications and conversions to the device may result in unforeseeable dangers.
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Interrupting or modifying the device or SICK software will invalidate any warranty claims against SICK AG. This applies in particular to opening the housing, even as part of mounting and electrical installation.

2.7 Requirements for skilled persons and operating personnel

WARNING Risk of injury due to insufficient training.
Improper handling of the device may result in considerable personal injury and material damage.
All work must only ever be carried out by the stipulated persons.
The operating instructions state the following qualification requirements for the various areas of work:
Instructed personnel have been briefed by the operator about the tasks assigned to them and about potential dangers arising from improper action.
Skilled personnel have the specialist training, skills, and experience, as well as knowledge of the relevant regulations, to be able to perform tasks delegated to them and to detect and avoid any potential dangers independently.
Electricians have the specialist training, skills, and experience, as well as knowl‐ edge of the relevant standards and provisions to be able to carry out work on elec‐ trical systems and to detect and avoid any potential dangers independently. In Ger‐ many, electricians must meet the specifications of the BGV A3 Work Safety Regu‐ lations (e.g. Master Electrician). Other relevant regulations applicable in other countries must be observed.
SAFETY INFORMATION 2
The following qualifications are required for various activities:
Table 1: Activities and technical requirements
Activities Qualification
Mounting, maintenance
Electrical installation, device replacement
Basic practical technical training
Knowledge of the current safety regulations in the workplace
Practical electrical training
Knowledge of current electrical safety regulations
Knowledge of the operation and control of the devices in
their particular application
Commissioning, configura‐ tion
Basic knowledge of the WindowsTM operating system in use
Basic knowledge of the design and setup of the described
connections and interfaces Basic knowledge of data transmission
Operation of the device for the particular application
Knowledge of the operation and control of the devices in
their particular application Knowledge of the software and hardware environment for
the particular application

2.8 Operational safety and particular hazards

Please observe the safety notes and the warnings listed here and in other chapters of these operating instructions to reduce the possibility of risks to health and avoid dan‐ gerous situations.
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2 SAFETY INFORMATION
WARNING Electrical voltage!
Electrical voltage can cause severe injury or death.
b b
b
b b
WARNING Dangerous equipotential bonding currents!
Improper grounding can lead to dangerous equipotential bonding currents, which may in turn lead to dangerous voltages on metallic surfaces, such as the housing. Electrical voltage can cause severe injury or death.
b b b
Work on electrical systems must only be performed by qualified electricians. The power supply must be disconnected when attaching and detaching electrical connections. The sensor must only be connected to a voltage source as set out in the require‐ ments in the operating instructions. National and regional regulations must be complied with. Safety requirements relating to work on electrical systems must be complied with.
Work on electrical systems must only be performed by qualified electricians. Follow the notes in the operating instructions. Install the grounding for the sensor and the system in accordance with national and regional regulations.

2.8.1 LED RG0

The product is fitted with LEDs in risk group 0. The accessible radiation from these LEDs does not pose a danger to the eyes or skin.
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3 Product description

1
2 3 4 5 6 7 89ß
à á â

3.1 Device view

PRODUCT DESCRIPTION 3
1 2 3 4 5 6 7 8
9 ß à á
â

3.2 Functionality

The Sensor Integration Machine – part of the SICK AppSpace eco-system – is opening up new possibilities for customized application solutions.
Data from SICK sensors such as 1D/2D code sensors and VMS4xx/5xx for detecting object geometry can be imported, evaluated, archived, and transmitted. In order to do this, the sensors can be connected to the SIM via the CAN bus. Ethernet-based fieldbus interfaces ensure rapid communication with controls.
X1 – IO LINK MASTER: connections for IO-Link and/or GPIO
X2 – POWER: connections for the device voltage supply
X3 – OUTPUT: connections for digital switching outputs
X4 – INPUT A: connections for digital switching inputs A
X5 – INPUT B: connections for digital switching inputs B
X6 – SERIAL A: serial connections A
X7 – SERIAL B: serial connections B
X8 – CAN: connections for SICK CAN sensor network with termination resistor which can be activated
X9 to X12 – ETHERNET: 4 Ethernet connections
X13 to X14 – FIELDBUS: 2 connections for Ethernet-based fieldbuses
Device status indicators
Servicing panel: function button, function selector switch, USB connection (for configura‐ tion/diagnostics)
Status indicators for Ethernet and fieldbus connections
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SIM2000ST
Supply voltage
Power supply connection
ICR890 system
CAN bus
HOST
Read cycle
Conveyor speed
MLG light grid
Object distance
(optional)
VMS4xx/5xx CLV690
Object geometry
3 PRODUCT DESCRIPTION
Depending on the application, additional sensors can be connected for the read cycle, for detecting the object distance (e.g., MLG, as an alternative to the VMS4xx/5xx), and for generating the increment signal. IO-Link especially is suitable for incorporating the relevant sensors for performing distance and height measurements.
In particular, the high-performance multi-core processor featuring hardware support enables input and output signals to be handled in real time.
The HMI and data visualization features can be provided on any browser-enabled note‐ book, PC, or tablet.

3.2.1 Functions

Features:
Real-time-capable hardware architecture with precise synchronization of I/O sig‐
nals 4 x Ethernet interfaces to connect sensors as well as for connection to a network
or PC Serial interfaces with support from RS-232/RS-422/RS-485
2 x Ethernet-based fieldbus interfaces
Support of a SICK CAN network for the integration of the 1D/2D code sensors and
the VMS4xx/5xx 4 configurable digital switching inputs/outputs/IO-Link data (X1)
4 digital switching inputs, not isolated (X1)
8 digital switching inputs, isolated (X4 & X5)
4 digital switching outputs, isolated (X3)
Connectivity:
Data and function interfaces: spring-loaded terminals, RJ45, USB type B
Supply voltage: spring-loaded terminals
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3.3 SICK AppSpace

Detailed instructions on the SICK AppStudio as well as programming the device can be found at https://supportportal.sick.com.

3.4 Preset ETHERNET interfaces

NOTE
Preset IP addresses of the ETHERNET interfaces:
ETHERNET 1: 192.168.0.1
ETHERNET 2: 192.168.1.1
ETHERNET 3: 192.168.2.1
ETHERNET 4: 192.168.3.1
PRODUCT DESCRIPTION 3
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4 TRANSPORT AND STORAGE

4 Transport and storage

4.1 Transport

For your own safety, please read and observe the following notes:
NOTICE Damage to the product due to improper transport.
The device must be packaged for transport with protection against shock and damp.
Recommendation: Use the original packaging as it provides the best protection.
Transport should be performed by trained specialist staff only.
The utmost care and attention is required at all times during unloading and trans‐ portation on company premises.
Note the symbols on the packaging.
Do not remove packaging until immediately before you start mounting.
4.2

Transport inspection

4.3 Storage

Immediately upon receipt in Goods-in, check the delivery for completeness and for any damage that may have occurred in transit. In the case of transit damage that is visible externally, proceed as follows:
Do not accept the delivery or only do so conditionally.
Note the scope of damage on the transport documents or on the transport compa‐ ny's delivery note.
File a complaint.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage claims are only valid before the applicable complaint deadlines.
Store the device under the following conditions:
Recommendation: Use the original packaging.
Do not store outdoors.
Store in a dry area that is protected from dust.
So that any residual damp can evaporate, do not package in airtight containers.
Do not expose to any aggressive substances.
Protect from sunlight.
Avoid mechanical shocks.
Storage temperature: see "Technical data", page 33.
For storage periods of longer than 3 months, check the general condition of all components and packaging on a regular basis.
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5 Mounting

5.1 Overview of mounting procedure

NOTE
The mounting procedure described here for the device meets the requirements for use in the target system.
Additional or different requirements may become necessary in the laboratory and dur‐ ing preparation, and should be taken into account as necessary, see "Commissioning",
page 27. If you have any questions or anything remains unclear in this regard, please
contact our service team.
Mounting the bracket, if provided.
Mounting the device.
Assembling and laying cables.
Connecting peripheral devices.
Connecting the voltage supply.

5.2 Scope of delivery

MOUNTING 5
SIM2000ST
1 x grounding screw
1 x toothed lock washer
Safety note

5.3 Preparing for mounting

Mounting requirements
NOTE
Two mounting methods along with the relevant accessories are recommended:
Via mounting rail (accessory part no. 2084765)
Via adapter plates (accessory part no. 2084764)
Select the mounting site: Plan space requirements and sufficient distance from
other devices. Be aware of the possibility of heat dissipation. Unpack the device and allow to acclimatize to avoid formation of condensation.
Prepare vibration reduction measures, if necessary.
Preparing for mounting with mounting rail
1. Place the mounting rail at the mounting site.
2. Mark the mounting holes.
3. Proceed to drill the mounting holes.
Preparing for mounting with adapter plate
1. Place the adapter plate at the mounting site.
2. Mark the mounting holes.
3. Proceed to drill the mounting holes.
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MOUNTING
5

5.4 Mounting the device

Mounting the device with mounting rail
1. Attach the mounting plates using two hexagon socket head cap screws (A/F 3) on each.
2. Mount the lower clamping plate on the mounting rail.
3. Insert the lower clamping plate on the opposite side at an angle and hook into the lower clamping plate.
4. Use the mounting plates and two hexagon socket heat cap screws (A/F 3) to screw the device securely into the two clamping plates.
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Mounting the device with adapter plate
MOUNTING 5
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5 MOUNTING
1. Attach the mounting plates using two hexagon socket head cap screws (A/F 3) on each.
5.5
2. Use the mounting plates to attach the device at the intended mounting site.

Mounting the device (at a critical ambient temperature of max. 50 °C)

NOTICE
To prevent damage to the device or the attached peripheral devices at high ambient temperatures of a maximum of 50 °C, the following extended installation conditions must be taken into account when mounting the device.
Prerequisites:
Device is mounted vertically (device name on top)
Mounting takes place using the supplied sliding nuts and the holding plate, which
is available as an accessory Aluminum profiles for mounting on the system (min. 600 mm in length)
No direct sunlight and heat radiation
Distance to other components or housing walls: Min. 400 mm
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0
10
20
30
40
50
60
0 20 40 60 80 100 120
Ambient temperature [°C]
CPU load [%]
MOUNTING
Contrary to the conditions described above, operation is also possible provided
the test of the housing temperature at the position specified in the graphic does not result in values above 75 °C outside on the cooling element during a period of time of 4 hours of operation.
5
Degradation of ambient temperature
Depending on the following device configurations, degradation of the permitted ambi‐ ent temperature must be taken into account:
CPU load 75% (can be read using SICK AppStudio)
Figure 1: Degradation of ambient temperature depending on the CPU capacity
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6 ELECTRICAL INSTALLATION

6 Electrical installation

6.1 Important information

WARNING Risk of injury and damage caused by electrical current!
Due to equipotential bonding currents, incorrect grounding can lead to the following dangers and faults: Voltage is applied to the metal housing, cable fires due to cable shields heating up, the product and other devices become damaged.
Generate the same ground potential at all grounding points.
b
Ground the equipotential bonding via the functional ground connection with a low
b
impedance (use standard cable lug with M4 hole).
NOTICE Risk of damage to the device due to incorrect supply voltage
An incorrect supply voltage may result in damage to the device.
Only operate the device with the specified supply voltage.
b
All circuits connected to the device must be designed as SELV circuits (in accord‐
b
ance with EN 60950 or ES1 EN 62368-1).
NOTE Layout of data cables
Use screened data cables with twisted-pair wires.
Implement the screening design correctly and completely.
To avoid interference, e.g. from switching power supplies, motors, clocked drives, and contactors, always use cables and layouts that are suitable for EMC.
Do not lay cables over long distances in parallel with power supply cables and motor cables in cable channels.
6.2

Preparing the electrical installation

To carry out the electrical installation, you will need:
Connection cables for the peripheral devices, including the corresponding data
sheets Voltage supply cable

6.3 Assembling the cables (optional)

Depending on the peripheral devices to be connected and the connecting interface used, various connection cables must be assembled before installing the device.
Ensure that you plan a sufficient length of cable for strain-relief clamps, for example.
NOTICE Risk of damage/malfunction due to incorrect PIN assignment
Incorrect wiring of the male connectors/female connectors can lead to damage to or malfunctions in the system.
20
Observe data sheets provided by the cable manufacturer.
b
Observe the pin assignment.
b
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Overview of connections
1
3 4 5 6 7 8
9
ß
à
2
á
2
22
2
ELECTRICAL INSTALLATION 6
X1 – IO LINK MASTER
1
Shield connection (e.g. via screening clamps)
2
X2 – POWER
3
X3 – OUTPUT
4
X4 – INPUT A
5
X5 – INPUT B
6
X6 – SERIAL A
7
X7 – SERIAL B
8
X8 – CAN
9
X9 to X12 – ETHERNET
ß
X13 ... X14 – FIELDBUS
à
Ground connection
á

6.4 Pin allocation of the connections

6.4.1 X1 – IO LINK MASTER

Pin Signal Function
1 24V Supply voltage
2 GND Ground
3 CQ1 IO-Link data or GPIO
4 DI1 Digital input
5 24V Supply voltage
6 GND Ground
7 CQ2 IO-Link data or GPIO
8 DI2 Digital input
9 24V Supply voltage
10 GND Ground
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6 ELECTRICAL INSTALLATION
Pin Signal Function
11 CQ3 IO-Link data or GPIO
12 DI3 Digital input
13 24V Supply voltage
14 GND Ground
15 CQ4 IO-Link data or GPIO
16 DI4 Digital input
Additional notes:
CQn: IO-Link data or configurable GPIO (not isolated)
DIn: dedicated digital input (not isolated)
4 x IO-Link master
IO-Link stack is implemented in FPGA (SoftCore)
Max. 0.7 A total output for 24 V supply voltage connections
Switching output:
• °
° ° ° ° °
Switching input:
• °
° ° °
The digital inputs and outputs are not reverse polarity protected. The voltage at the
X1 inputs and outputs must never be higher than the 24 V supply voltage of the SIM2000ST to prevent feedback.
Max. output 100 mA Min. high output logic level: VCC – 3 V Max. low output logic level: 3 V Push/pull, NPN, PNP configurable Max. IO-Link output frequency: 230 kHz Max. IO output frequency: 30 kHz
Min. high input logic level: 12 V Max. low input logic level: 4 V Max. IO-Link input frequency: 230 kHz Max. IO input frequency: 30 kHz

6.4.2 X2 – POWER

6.4.3 X3 – OUTPUT

Pin Signal Function
1 Shield Shield
2 GND Ground
3 24V IN1 Supply voltage 1
4 Shield Shield
5 GND Ground
6 24V IN2 Supply voltage 2
Additional notes:
24V IN1 and 24V IN2 are designed with redundancy
Pin Signal Function
1 OUT1 Insulated digital switching output
2 OUT2 Insulated digital switching output
3 OUT3 Insulated digital switching output
4 OUT4 Insulated digital switching output
5 24 V IN (X3) Supply voltage for switching outputs
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6.4.4 X4 – INPUT A

ELECTRICAL INSTALLATION 6
Pin Signal Function
6 GND ISO (X3) Insulated reference potential for switching outputs and 24 V
IN (X3)
7 GND ISO (X3) Insulated reference potential for switching outputs and 24 V
IN (X3)
8 GND ISO (X3) Insulated reference potential for switching outputs and 24 V
IN (X3)
9 GND ISO (X3) Insulated reference potential for switching outputs and 24 V
IN (X3)
10 GND ISO (X3) Insulated reference potential for switching outputs and 24 V
IN (X3)
Additional notes:
OUT 1 to OUT 4: isolated 0.6 A high side (PNP) outputs
Min. high output logic level: VCC – 3 V
Max. frequency: 1 kHz (1 kohm load resistance)
Pin Signal Function
1 IN1+ Isolated digital switching input
2 IN1+ Isolated digital switching input
3 IN2+ Isolated digital switching input
4 IN2+ Isolated digital switching input
5 IN3+ Isolated digital switching input
6 IN4+ Isolated digital switching input
7 24 V Non-insulated supply voltage for external sensors
8 GND ISO (X4) Insulated reference potential for switching inputs (X4)
9 24 V Non-insulated supply voltage for external sensors
10 GND ISO (X4) Insulated reference potential for switching inputs (X4)
11 24 V Non-insulated supply voltage for external sensors
12 GND ISO (X4) Insulated reference potential for switching inputs (X4)
1
S1 switch in GND position: Reference potential also for 24 V (X4)
1
1
1
Additional notes:
IN1 and IN2 are designed with redundancy
Max. 0.7 A total output for all 24 V supply voltage connections
Min. high input logic level: 12 V
Max. low input logic level: 4 V
Input frequency: 10 kHz
S1 switch
GND ISO: volt-free connection
GND: GND of the connected device connected to SIM2000-GND

6.4.5 X5 – INPUT B

Pin Signal Function
1 IN5+ Isolated digital switching input
2 IN5+ Isolated digital switching input
3 IN6+ Isolated digital switching input
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6 ELECTRICAL INSTALLATION
Pin Signal Function
4 IN6+ Isolated digital switching input
5 IN7+ Isolated digital switching input
6 IN8+ Isolated digital switching input
7 24 V Non-insulated supply voltage for external sensors
8 GND ISO (X5) Insulated reference potential for switching inputs (X5)
9 24 V Non-insulated supply voltage for external sensors
10 GND ISO (X5) Insulated reference potential for switching inputs (X5)
11 24 V Non-insulated supply voltage for external sensors
12 GND ISO (X5) Insulated reference potential for switching inputs (X5)
1
S2 switch in GND position: Reference potential also for 24 V (X5)
Additional notes:
IN5 and IN6 are designed with redundancy
Max. 0.7 A total output for all 24 V supply voltage connections
Min. high input logic level: 12 V
Max. low input logic level: 4 V
Input frequency: 10 kHz
S2 switch
GND ISO: volt-free connection
GND: GND of the connected device connected to SIM2000-GND
1
1
1

6.4.6 X6 – SERIAL A

Not isolated
Pin Signal Mode
RS-422 RS-232 LED RS -485 LED
1 R1+/RxD1 R1+ RxD1 Rx1
2 R1-/RxD2 R1-
3 GND GND (ground) GND
(ground)
4 R2+/RxD3 R2+ RxD3 Rx2
5 R2-/RxD4 R2-
6 T1+/TxD1 T1+ TxD1 Tx1 Rx1+/Tx1+ Receive: Rx1
7 T1-/TxD2 T1- Rx1-/Tx1-
8 GND GND (ground) GND
(ground)
9 T2+/TxD3 T2+ TxD3 Tx2 Rx2+/Tx2+ Receive: Rx2
10 T2-/TxD4 T2- Rx2-/Tx2-
Transmit: Tx1
Transmit: Tx2
NOTE
RxD2, RxD4 as well as TxD2 and TxD4 are not supported by the device.
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6.4.7 X7 – SERIAL B

ELECTRICAL INSTALLATION 6
Isolated
Pin Signal Mode
RS-422 RS-232 LED RS -485 LED
1 R3+/RxD5 R3+ RxD5 Rx3
2 R3-/RxD6 R3-
3 GND ISO Insulated reference poten‐
tial
4 R4+/RxD7 R4+ RxD7 Rx4
5 R4-/RxD8 R4-
6 T3+/TxD5 T3+ TxD5 Tx3 Rx3+/Tx3+ Receive: Rx3
7 T3-/TxD6 T3- Rx3-/Tx3-
8 GND ISO Insulated reference poten‐
tial
9 T4+/TxD7 T4+ TxD7 Tx4 Rx4+/Tx4+ Receive: Rx4
10 T4-/TxD8 T4- Rx4-/Tx4-
GND
(ground)
GND
(ground)
Transmit: Tx3
Transmit: Tx4
NOTE
RxD6, RxD8 as well as TxD6 and TxD8 are not supported by the device.

6.4.8 X8 – CAN

Pin Signal Function
1 CAN H CAN high
2 CAN L CAN low
3 GND Ground
4 CAN H CAN high (redundant)
5 CAN L CAN low (redundant)
6 GND Ground
Additional notes:
1 x CAN (IN/OUT) not isolated

6.5 Connecting peripheral devices

The device can be connected to a wide range of sensors and cameras.
The required pin assignments can be found in the data sheets for the peripherals to be connected as well as in the relevant connection descriptions, see "Pin allocation of the
connections", page 21.
1. If necessary, assemble connection cables, see "Assembling the cables (optional)",
page 20.
2. Connect the cables to peripheral devices.
3. Route the cables to the device using installation materials (cable channels, cable ties, etc.). When doing so, pay attention to cable strain relief.
4. Connect cables to the relevant device connections.
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6 ELECTRICAL INSTALLATION

6.6 Connecting voltage supply

NOTICE Risk of damage to peripheral devices!
If peripheral devices are connected when the voltage supply is also applied, these devi‐ ces can become damaged.
Only connect peripheral devices when the voltage supply is disconnected.
b
1. Ensure that the voltage has been disconnected by the user.
2. Connect voltage supply cable(s) to the device.
3. Lay the cable(s) with strain relief.
4. Have the user connect the voltage supply.
5. Have the user activate the voltage.
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7 Commissioning

7.1 Preparatory commissioning

Commissioning for preparatory purposes and under laboratory conditions differs in some respects from commissioning in the target system.
In general, all safety and hazard warnings applicable to mounting (see "Important infor‐
mation", page 20) and electrical installation (see "Mounting", page 15) must also be
observed under laboratory conditions. In addition, further information must be taken into consideration to guarantee the most effective preparation possible:
Only connect those devices to the product that you want to configure or program.
Operate the connected device in a controlled and contained network environment
for the time being to check network communication if necessary. Note the company standards that apply to the use of checking and testing devices.
For initial programming, use ideal conditions for sensor or camera recognition.
Use the largest possible deviations from these ideal conditions to check the pro‐
gramming with respect to its error tolerance and reliability, and to determine error limit values.
Procedure
COMMISSIONING 7
1. Place the device on a non-slip base.
2. Connect the required peripheral devices, see "Connecting peripheral devices",
page 25.
3. Connect the network connection.
4. Connect the voltage supply.
5. Switch on the voltage supply.
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8 OPERATION

8 Operation

8.1 Status LEDs

When the device is operating, the operational status of the connections is indicated vis‐ ually by status LEDs.
Using these status indicators, the operator can find out quickly and easily whether the device and the peripherals are working properly or whether any faults or errors have occurred.
Monitoring the visual indicators is part of the routine inspection carried out on the device and the machine/plant area into which the device is incorporated.

8.1.1 Situation and function of the LEDs

X1 – IO-Link master
Table 2: Power status LEDs
CQ1 DI1 CQ3 DI3 CQ2 DI2 CQ4 DI4
IO LINK mode: no data activity Dig-IO mode: status of current signal level = low
IO LINK mode: data activity Dig-IO mode: status of current signal level = high
X2 – POWER
Table 3: X2 – POWER
X3 – OUTPUT
X4 – INPUT A
1 2
1 2 3 4
GND GND S1 switch to GND ISO
1 2 3 4
Supply voltage not applied
Supply voltage applied
No voltage applied to connec‐ tion
Voltage applied to connection
GND S1 switch to GND
Current signal level = low
Current signal level = high
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X5 – INPUT B
OPERATION 8
GND GND S2 switch to GND ISO
GND S2 switch to GND
5 6 7 8
X6 – SERIAL A
Table 4: SERIAL status LEDs
Rx1 Tx1 Rx2 Tx2
X7 – SERIAL B
Table 5: SERIAL status LEDs
Rx3 Tx3 Rx4 Tx4
X8 – CAN
Table 6: CAN status LEDs
Act No signal activity
Current signal level = low
Current signal level = high
No signal activity
Signal activity
No signal activity
Signal activity
TERM Termination resistor not acti‐
X9 – X12 ETHERNET 1 – 4, fieldbus 1 – 2
Table 7: ETHERNET and FIELDBUS status LEDs
Link Connection not established with
Act No activity
Signal activity
vated
Termination resistor activated
Ethernet
ETH1-ETH4 only. Connection established with Ethernet
Data transmission via Ethernet
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8 OPERATION
Device status
Table 8: Device status indicators
Dev RDY Runlevel READY, no errors
detected
Runlevel READY, boot process error
Runlevel READY not reached
Sys RDY User-defined, configurable with
SICK AppSpace
Result User-defined, configurable with
SICK AppSpace
Funct 1 User-defined, configurable with
SICK AppSpace
Funct 2 User-defined, configurable with
SICK AppSpace
Remote Remote maintenance active.
Currently not supported
SSD 1 Internal SSD connected.
Currently not supported
BF / NS Bus error (fieldbus)
SF / MS System error (fieldbus)
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9 Maintenance

9.1 Cleaning

NOTICE Equipment damage due to improper cleaning.
Improper cleaning may result in equipment damage.
b

9.2 Maintenance

During operation, the device works maintenance-free.
MAINTENANCE 9
Only use recommended cleaning agents. Never use sharp objects for cleaning.
The device must be cleaned regularly from the outside to guarantee heat dissipa‐ tion and therefore operation. Particular attention must be paid to ensure that the cooling fins are free from dust and dirt. Clean using a dry towel or an industrial vacuum cleaner. Do not use cleaning agents.
Depending on the assignment location, the following preventive maintenance tasks may be required for the device at regular intervals:
Table 9: Maintenance schedule
Maintenance work Interval To be carried out
by
Check that the unused connections are sealed with blind plugs
Interval depends on ambient condi‐ tions and climate. Recommended: At least every 6 months.
Specialist
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10 DECOMMISSIONING

10 Decommissioning

10.1 Disposal

CAUTION Risk of injury due to hot device surface.
The surface of the device can become hot during operation.
Before commencing disassembly, switch off the device and allow it to cool down
b
as necessary.
Any device which can no longer be used must be disposed of in an environmentally friendly manner in accordance with the applicable country-specific waste disposal regu‐ lations. Do not dispose of the product along with household waste.
NOTICE Danger to the environment due to improper disposal of the device.
Disposing of devices improperly may cause damage to the environment.
Therefore, observe the following information:
Always observe the valid regulations on environmental protection.
b
Separate the recyclable materials by type and place them in recycling containers.
b
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11 Technical data

NOTE
The relevant online data sheet for your product, including technical data, dimensional drawing, and connection diagrams can be downloaded, saved, and printed at:
www.sick.com/SIM2000
b

11.1 Features

Feature Parameter
Task Data recording, evaluation, and archiving
Supported devices/excerpt Encoders, code readers, laser scanners, photoelectric sensors,
Technology Embedded hardware architecture:
Random Access Memory 2 GB
Flash memory 512 MB in total, 427 MB of which available for applications
Memory card (optional) Industry-grade microSD memory card (flash card), max. 16 GB
Programming software SICK AppStudio
TECHNICAL DATA 11
etc.
4-core PowerPC CPU
FPGA for I/O handling
Dedicated fieldbus controller
Software:
Can be programmed within the SICK AppSpace environment

11.2 Interfaces

Feature Parameter
Data storage and retrieval Image and data logging via microSD memory card, inter‐
nal RAM, and external FTP
Serial (RS-232/RS-422/RS-485)
Quantity 4, also configurable as an encoder port
Function RS-232 / RS-422 / RS-485
Maximum data transmission rate RS-232: 115.2 kBaud
RS-422: 2 MBaud RS-485: 2 MBaud
Fieldbus
Quantity 2
Function Ethernet-based fieldbus
Data transmission rate 10/100 Mbit/s
Protocol ProfiNet, Ethernet/IP, EtherCAT
Ethernet
Quantity 4
Function Host, AUX, image transmission
Data transmission rate 4 x [10/100/1,000 Mbit/s]
Protocol TCP/IP, FTP (image transmission)
CAN
Quantity 1
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11 TECHNICAL DATA
Feature Parameter
Function SICK CAN sensor network (master/slave, multiplexer/
server) with termination resistor which can be activated 1 x CAN (IN/OUT) not isolated
Data transmission rate 20 kbit/s to 1 Mbit/s
Protocol CSN (SICK CAN sensor network)
IO-Link master
Quantity 4 x IO-Link to X1 male connector
Data transmission rate max. 230 kBaud
Protocol IO-Link master 1.1
Digital switching inputs/outputs
X1 4 configurable inputs/
outputs incl. IO-Link
X3 4 isolated outputs (high side)
X4 4 isolated inputs
X5 4 isolated inputs
USB AUX (USB 2.0) for configuration/diagnostics
4 inputs

11.3 Mechanics and electronics

Feature Parameter
Optical indicators 31 x green status indicators
Operating elements 1 selector switch present under the servicing panel
Electrical connection X1 – IO-Link, GPIOs: spring terminals
Supply voltage 24 V DC, ± 10% ES1 in accordance with EN 62368-1 or SELV in
Power consumption Typ. 20 W, without connected sensors
Power output Max. 50 W (input A & B, IO-Link)
Output current for switch‐ ing outputs
Output current for supply voltages
Housing material Aluminum die cast
Housing color Light blue (RAL 5012)
Protection class III
Weight without accessories 1,532 g
Dimensions (W x D x H) 196 x 137 x 81 mm
3 x blue status indicators 6 x green Link indicators 6 x orange activity indicators 9 x red/green device status indicators
2 S1 and S2 switches for GND ISO/GND
X2 – POWER: spring terminals X3 – OUTPUT: spring terminals X4 – INPUT A: spring terminals X5 – INPUT B: spring terminals X6 – SERIAL A: spring terminals X7 – SERIAL B: spring terminals X8 – CAN: spring terminals X9 to X14: RJ-45
accordance with EN 60950-1
X1: 100 mA per output X3: 700 mA in total
X1: max. 700 mA X4, X5: 700 mA in total
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11.4 Ambient data

Feature Parameter
Electromagnetic compati‐ bility (EMC)
Shock resistance EN 60068-2-6
Electrical safety EN 62368-1
Enclosure rating IP 20
Ambient operating temper‐ ature
Storage temperature -20 °C to +70 °C
Permissible relative humid‐ ity
TECHNICAL DATA 11
EN 61000-6-2:2005-08 EN 61000-6-4:2007+A1:2011 EN 61131-9:2013-12
0 °C to +50 °C, taking the described mounting requirements into account, see "Mounting the device", page 16
90%, non-condensing
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176.2 (6.94)
0
5.4 (0.21)
40.6 (1.60)
69.6 (2.74) 70.3
(2.77)
43.1
(1.7)
50
(1.97)
60.6
(2.39)
15
(0.59)
46.2
(1.82)
19.1
(0.75)
0
5.5
(0.22)
87.8 (3.46)
106.5 (4.19)
0.5 (0.02)
167.5 (6.59)
158.3 (6.23)
135.2 (5.32)
110.3 (4.34)
87.1 (3.43)
65.7 (2.59)
47.8 (1.88)
29.7 (1.17)
11.2 (0.44)
182 (7.17)
170 (6.69)
0
185 (7.28)
169 (6.65)
5.5 (0.22)
0
18 (3.27) 56.5 (2.23)
26.8
(1.06)
81
(3.19)
137
(5.39)
196 (7.72)
175.2 (6.90)
50.2
(1.98)
29.4
(1.16)
29.4
(1.16)

12 ANNEX

12 Annex

12.1 Dimensional drawings

Dimensions without accessories
All measurements in mm (inch).
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Dimensions with adapter plate
170 (6.69)
250 (9.84)
220 (8.66)
225 (8.86)
50 (1.97)
30
(1.18)
0,2 (0.01)
R 3,2
(.13)
R 3,2
(.13)
R 6,5
(.26)
196 (7.72)
ANNEX 12

12.2 Licenses

SICK uses open-source software. This software is licensed by the rights holders using the following licenses among others: the free licenses GNU General Public License (GPL Version2, GPL Version3) and GNU Lesser General Public License (LGPL), the MIT license, zLib license, and the licenses derived from the BSD license.
This program is provided for general use, but WITHOUT ANY WARRANTY OF ANY KIND. This warranty disclaimer also extends to the implicit assurance of marketability or suita‐ bility of the program for a particular purpose.
More details can be found in the GNU General Public License. View the complete license texts here: www.sick.com/licensetexts. Printed copies of the license texts are also available on request.
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