SIM1012
Sensor Integration Machine
O P E R A T I N G I N S T R U C T I O N S
Described product
SIM1012
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be
reserved for SICK AG. Reproduction of this document or parts of this document is only
permissible within the limits of the legal determination of Copyright Law. Any modifica‐
tion, abridgment or translation of this document is prohibited without the express writ‐
ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
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Contents
CONTENTS
1 About this document........................................................................ 5
1.1 Information on the operating instructions.............................................. 5
1.2 Explanation of symbols............................................................................ 5
1.3 Further information................................................................................... 6
2 Safety information............................................................................ 7
2.1 General safety notes................................................................................ 7
2.2 Intended use............................................................................................. 7
2.3 Improper use............................................................................................. 7
2.4 Internet protocol (IP) technology.............................................................. 8
2.5 Limitation of liability................................................................................. 8
2.6 Modifications and conversions................................................................ 8
2.7 Requirements for skilled persons and operating personnel.................. 9
2.8 Operational safety and particular hazards.............................................. 9
3 Product description........................................................................... 11
3.1 Device view................................................................................................ 11
3.2 Functionality.............................................................................................. 11
3.3 SICK AppSpace......................................................................................... 12
3.4 Preset Ethernet interfaces....................................................................... 12
4 Transport and storage....................................................................... 13
4.1 Transport................................................................................................... 13
4.2 Transport inspection................................................................................. 13
4.3 Storage...................................................................................................... 13
5 Mounting............................................................................................. 14
5.1 Overview of mounting procedure............................................................. 14
5.2 Scope of delivery....................................................................................... 14
5.3 Preparing for mounting............................................................................. 14
5.4 Mounting the device................................................................................. 14
6 Electrical installation........................................................................ 15
6.1 Important information.............................................................................. 15
6.2 Preparing the electrical installation......................................................... 15
6.3 Assembling the cables (optional)............................................................ 15
6.4 Overview of connections.......................................................................... 16
6.5 Pin allocation of the connections............................................................ 17
6.6 Connecting peripheral devices................................................................ 20
6.7 Connecting voltage supply....................................................................... 20
7 Commissioning.................................................................................. 22
7.1 Preparatory commissioning..................................................................... 22
8 Operation............................................................................................ 23
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CONTENTS
8.1 Status LEDs............................................................................................... 23
9 Maintenance...................................................................................... 28
9.1 Cleaning..................................................................................................... 28
9.2 Maintenance plan..................................................................................... 28
10 Decommissioning............................................................................. 29
10.1 Disposal..................................................................................................... 29
11 Technical data.................................................................................... 30
11.1 Features.................................................................................................... 30
11.2 Interfaces.................................................................................................. 30
11.3 Mechanics and electronics...................................................................... 31
11.4 Ambient data............................................................................................. 32
12 Annex.................................................................................................. 33
12.1 Dimensional drawings.............................................................................. 33
12.2 Licenses.................................................................................................... 33
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1 About this document
1.1 Information on the operating instructions
These operating instructions provide important information on how to use devices from
SICK AG.
Prerequisites for safe work are:
Compliance with all safety notes and handling instructions supplied.
•
Compliance with local work safety regulations and general safety regulations for
•
device applications
The operating instructions are intended to be used by qualified personnel and electrical
specialists.
NOTE
Read these operating instructions carefully to familiarize yourself with the device and its
functions before commencing any work.
The instructions constitute an integral part of the product and are to be stored in the
immediate vicinity of the device so they remain accessible to staff at all times. Should
the device be passed on to a third party, these operating instructions should be handed
over with it.
ABOUT THIS DOCUMENT 1
These operating instructions do not provide information on operating the machine or
system in which the device is integrated. For information about this, refer to the operat‐
ing instructions of the specific machine.
1.2 Explanation of symbols
Warnings and important information in this document are labeled with symbols. The
warnings are introduced by signal words that indicate the extent of the danger. These
warnings must be observed at all times and care must be taken to avoid accidents, per‐
sonal injury, and material damage.
DANGER
… indicates a situation of imminent danger, which will lead to a fatality or serious
injuries if not prevented.
WARNING
… indicates a potentially dangerous situation, which may lead to a fatality or serious
injuries if not prevented.
CAUTION
… indicates a potentially dangerous situation, which may lead to minor/slight injuries if
not prevented.
NOTICE
… indicates a potentially harmful situation, which may lead to material damage if not
prevented.
NOTE
… highlights useful tips and recommendations as well as information for efficient and
trouble-free operation.
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1 ABOUT THIS DOCUMENT
1.3 Further information
NOTE
Further documentation for the device can be found on the online product page at:
www.sick.com/SIM10xx
•
The following information is available for download there:
Model-specific online data sheets for device variants, containing technical data,
•
dimensional drawing, and specification diagrams
EU declaration of conformity for the product family
•
Dimensional drawings and 3D CAD dimension models in various electronic for‐
•
mats
This documentation, in English and German and other languages if applicable
•
Other publications related to the devices described here
•
Publications dealing with accessories
•
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2 Safety information
2.1 General safety notes
The following safety notes must always be observed regardless of specific application
conditions:
The device must only be mounted, commissioned, operated, and maintained by
•
professionally qualified safety personnel.
Electrical connections with peripheral devices must only be made when the volt‐
•
age supply is disconnected.
The device is only to be operated when mounted in a fixed position.
•
The device voltage supply must be protected in accordance with the specifications.
•
The specified ambient conditions must be observed at all times.
•
The electrical connections to peripheral devices must be screwed on correctly.
•
The pin assignment of pre-assembled cables must be checked and adjusted if
•
necessary.
These operating instructions must be made available to the operating personnel
•
and kept ready to hand.
2.2 Intended use
SAFETY INFORMATION 2
The device is a programmable control and evaluation unit for sensors, and image pro‐
cessing devices. The device also acts as a link between system and plant controls, and
the connected terminal devices. The device is mainly used in an industrial environment
in production, testing, and control. Other applications are possible depending on the
device-specific properties.
The device is programmed on a PC by using the development environment software
SICK AppSpace. Depending on the application, a browser-based, graphical user inter‐
face (HMI) can be created, which provides opportunities defined by the application
developer to influence an application at operator level.
The device offers various interfaces for controlling, programming, and operating pur‐
poses, which can be activated as necessary via development environments, control sys‐
tems (programmable logic controllers), or applications.
However, configuration, programming, and control requires various technical skills,
depending on how the device is connected and used.
2.3 Improper use
Any use outside of the stated areas, in particular use outside of the technical specifica‐
tions and the requirements for intended use, will be deemed to be incorrect use.
•
•
•
The device does not constitute a safety component in accordance with the respec‐
tive applicable safety standards for machines.
The device must not be used in explosion-hazardous areas, in corrosive environ‐
ments or under extreme environmental conditions.
Any use of accessories not specifically approved by SICK AG is at your own risk.
WARNING
Danger due to improper use!
Any improper use can result in dangerous situations.
Therefore, observe the following information:
■
Device should be used only in accordance with its intended use.
■
All information in these operating instructions must be strictly observed.
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2 SAFETY INFORMATION
2.4 Internet protocol (IP) technology
NOTE
SICK uses standard IP technology in its products. The emphasis is placed on availability
of products and services.
SICK always assumes the following prerequisites:
The customer ensures the integrity and confidentiality of the data and rights
•
affected by its own use of the aforementioned products.
In all cases, the customer implements the appropriate security measures, such as
•
network separation, firewalls, virus protection, and patch management.
2.5 Limitation of liability
Relevant standards and regulations, the latest technological developments, and our
many years of knowledge and experience have all been taken into account when com‐
piling the data and information contained in these operating instructions. The manufac‐
turer accepts no liability for damage caused by:
■
Non-adherence to the product documentation (e.g., operating instructions)
■
Incorrect use
■
Use of untrained staff
■
Unauthorized conversions
■
Technical modifications
■
Use of unauthorized spare parts, consumables, and accessories
With special variants, where optional extras have been ordered, or owing to the latest
technical changes, the actual scope of delivery may vary from the features and illustra‐
tions shown here.
NOTE
Programmable device
The Sensor Integration Machine (SIM) is a programmable device.
Therefore, the respective programmer is responsible for his/her programming perfor‐
mance and the resulting operating principle of the device.
The liability and warranty of SICK AG is limited to the device specification (hardware
functionality and any programming interfaces) according to the agreed conditions.
Therefore, SICK AG is not liable, among other things, for damages that are caused by
programming of the customer or third parties.
2.6 Modifications and conversions
NOTICE
Modifications and conversions to the device may result in unforeseeable dangers.
Interrupting or modifying the device or SICK software will invalidate any warranty claims
against SICK AG. This applies in particular to opening the housing, even as part of
mounting and electrical installation.
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2.7 Requirements for skilled persons and operating personnel
WARNING
Risk of injury due to insufficient training.
Improper handling of the device may result in considerable personal injury and material
damage.
■
All work must only ever be carried out by the stipulated persons.
This product documentation refers to the following qualification requirements for the
various activities associated with the device:
■
Instructed personnel have been briefed by the operator about the tasks assigned
to them and about potential dangers arising from improper action.
■
Skilled personnel have the specialist training, skills, and experience, as well as
knowledge of the relevant regulations, to be able to perform tasks delegated to
them and to detect and avoid any potential dangers independently.
■
Electricians have the specialist training, skills, and experience, as well as knowl‐
edge of the relevant standards and provisions to be able to carry out work on elec‐
trical systems and to detect and avoid any potential dangers independently. In Ger‐
many, electricians must meet the specifications of the BGV A3 Work Safety Regu‐
lations (e.g. Master Electrician). Other relevant regulations applicable in other
countries must be observed.
SAFETY INFORMATION 2
The following qualifications are required for various activities:
Table 1: Activities and technical requirements
Activities Qualification
Mounting, maintenance
Electrical installation,
device replacement
Basic practical technical training
■
Knowledge of the current safety regulations in the workplace
■
Practical electrical training
■
Knowledge of current electrical safety regulations
■
Knowledge of the operation and control of the devices in their
■
particular application
Commissioning, configura‐
tion
Basic knowledge of the WindowsTM operating system in use
■
Basic knowledge of the design and setup of the described con‐
■
nections and interfaces
Basic knowledge of data transmission
■
Operation of the device for
the particular application
Knowledge of the operation and control of the devices in their
■
particular application
Knowledge of the software and hardware environment for the
■
particular application
2.8 Operational safety and particular hazards
Please observe the safety notes and the warnings listed here and in other chapters of
this product documentation to reduce the possibility of risks to health and avoid dan‐
gerous situations.
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2 SAFETY INFORMATION
WARNING
Electrical voltage!
Electrical voltage can cause severe injury or death.
■
■
■
■
■
WARNING
Risk of injury and damage caused by potential equalization currents!
Improper grounding can lead to dangerous equipotential bonding currents, which may
in turn lead to dangerous voltages on metallic surfaces, such as the housing. Electrical
voltage can cause severe injury or death.
■
■
■
Work on electrical systems must only be performed by qualified electricians.
The power supply must be disconnected when attaching and detaching electrical
connections.
The product must only be connected to a voltage supply as set out in the require‐
ments in the operating instructions.
National and regional regulations must be complied with.
Safety requirements relating to work on electrical systems must be complied with.
Work on electrical systems must only be performed by qualified electricians.
Follow the notes in the operating instructions.
Install the grounding for the product and the system in accordance with national
and regional regulations.
2.8.1 LED RG0
The product is fitted with LEDs in risk group 0. The accessible radiation from these
LEDs does not pose a danger to the eyes or skin.
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3 Product description
1
2
3
4
6
7
5
3.1 Device view
PRODUCT DESCRIPTION 3
Figure 1: SIM1012 device view
1
2
3
4
5
6
7
3.2 Functionality
The SIM1012 Sensor Integration Machine – part of the SICK AppSpace ecosystem – is
opening up new possibilities for application solutions.
Elongated drill holes for mounting
Connections for power and CAN
Status indicators
Connections for Ethernet and sensors
Servicing panel
Connections for increment and serial
Functional ground connection
Data from SICK sensors such as laser scanners or cameras can be evaluated, archived,
and transmitted.
Sensors can be integrated via IO Link, for example for distance or height measurement.
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3 PRODUCT DESCRIPTION
Ethernet interfaces with OPC UA and MQTT provide pre-processed data (edge comput‐
ing) for cloud computing. In addition, the SIM can be integrated into a SICK CAN sensor
network.
The open SICK AppSpace software platform makes it possible to develop customized
application programs for demanding applications.
The HMI and data visualization features can be provided on any browser-enabled note‐
book, PC, or tablet. The app is created via the SICK AppStudio.
3.3 SICK AppSpace
Detailed instructions on the SICK AppStudio as well as programming the device can be
found at supportportal.sick.com.
3.4 Preset Ethernet interfaces
NOTE
Preset IP addresses of the ETHERNET interfaces:
ETHERNET 1: 192.168.0.1
•
ETHERNET 2: 192.168.1.1
•
When expanding the 1 GigE interfaces with one or more Ethernet switches, it is essen‐
tial to use only jumbo-frame compatible 1 GigE switches. Switches limited to just
100 Mb do not support the data packet mode used by cameras and can cause trans‐
mission errors.
Changing the IP addresses
The individual IP addresses can be changed using the SICK “SOPAS-ET” PC tool. This is
described in detail in the “SIM Getting Started” description, which are available for
download from the AppSpace area of the SICK Support Portal. This guide also includes
further instructions on how to connect SICK sensors and the SICK picoCam and
midiCam cameras to the Ethernet interfaces.
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4 Transport and storage
4.1 Transport
For your own safety, please read and observe the following notes:
NOTICE
Damage to the product due to improper transport.
■
The device must be packaged for transport with protection against shock and
damp.
■
Recommendation: Use the original packaging as it provides the best protection.
■
Transport should be performed by trained specialist staff only.
■
The utmost care and attention is required at all times during unloading and trans‐
portation on company premises.
■
Note the symbols on the packaging.
■
Do not remove packaging until immediately before you start mounting.
TRANSPORT AND STORAGE 4
4.2
Transport inspection
4.3 Storage
Immediately upon receipt in Goods-in, check the delivery for completeness and for any
damage that may have occurred in transit. In the case of transit damage that is visible
externally, proceed as follows:
■
Do not accept the delivery or only do so conditionally.
■
Note the scope of damage on the transport documents or on the transport com‐
pany's delivery note.
■
File a complaint.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage
claims are only valid before the applicable complaint deadlines.
Store the device under the following conditions:
■
Recommendation: Use the original packaging.
■
Do not store outdoors.
■
Store in a dry area that is protected from dust.
■
So that any residual damp can evaporate, do not package in airtight containers.
■
Do not expose to any aggressive substances.
■
Protect from sunlight.
■
Avoid mechanical shocks.
■
Storage temperature: see "Technical data", page 30.
■
For storage periods of longer than 3 months, check the general condition of all
components and packaging on a regular basis.
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5 MOUNTING
5 Mounting
5.1 Overview of mounting procedure
NOTE
The mounting procedure described here for the device meets the requirements for use
in the target system.
Additional or different requirements may become necessary in the laboratory and dur‐
ing preparation, and should be taken into account as necessary, see "Commissioning",
page 22. If you have any questions or anything remains unclear in this regard, please
contact our service team.
Mounting the device.
•
Connect the cables.
•
Connecting peripheral devices.
•
Connecting the voltage supply.
•
5.2 Scope of delivery
SIM1012
•
1x grounding screw
•
1x toothed lock washer
•
Safety note
•
Optional: ordered accessories
•
NOTE
For a list of cables suitable for use with the device, see: supportportal.sick.com.
5.3 Preparing for mounting
Installation requirements
Select the mounting site: Plan space requirements and sufficient distance from
•
other devices. Be aware of the possibility of heat dissipation.
Unpack the device and allow to acclimatize to avoid formation of condensation.
•
Prepare vibration reduction measures, if necessary.
•
Preparing for mounting
1. Place the device at the mounting site.
2. Mark the mounting holes.
3. Proceed to drill the mounting holes.
5.4 Mounting the device
14
1. Place device at mounting site.
2. Fasten the device with at least two M6 screws (max. 6 Nm) and corresponding
washers on opposite sides of the device.
NOTICE
Use self-locking or lock nuts on mounting sites that are exposed to vibrations to
prevent the holding plates from loosening.
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6 Electrical installation
6.1 Important information
WARNING
Risk of injury and damage caused by electrical current!
Due to equipotential bonding currents, incorrect earthing can lead to the following dan‐
gers and faults: Voltage is applied to the metal housing, cable fires due to cable shields
heating up, the product and other devices become damaged.
■
Generate the same ground potential at all grounding points.
■
Ground the equipotential bonding via the functional ground connection with a low
impedance (use standard cable lug with M4 hole).
NOTICE
Device damage due to improper supply voltage!
■
Only operate the device with the specified supply voltage.
■
All circuits connected to the device must be designed as SELV circuits (in accor‐
dance with EN 60950-1 or ES1 EN 62368-1).
ELECTRICAL INSTALLATION 6
NOTE
Layout of data cables
■
Use screened data cables with twisted-pair wires.
■
Implement the screening design correctly and completely.
■
To avoid interference, e.g. from switching power supplies, motors, clocked drives,
and contactors, always use cables and layouts that are suitable for EMC.
■
Do not lay cables over long distances in parallel with power supply cables and
motor cables in cable channels.
6.2
Preparing the electrical installation
To carry out the electrical installation, you will need:
Connection cables for the peripheral devices, including the corresponding data
•
sheets
Voltage supply cable
•
If customers assemble the cables: crimping tool, ferrules, soldering iron, and other
•
installation material
6.3 Assembling the cables (optional)
For a list of cables suitable for use with the device, see:
supportportal.sick.com or www.sick.com.
Customer assembly of the cables is only necessary in special cases. Make sure the
length of cable is sufficient, e.g. for strain-relief clamps.
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6
7
4
5
1
3
2
8
9
6 ELECTRICAL INSTALLATION
NOTICE
Risk of damage/malfunction due to incorrect PIN assignment
Incorrect wiring of the male connectors/female connectors can lead to damage to or
malfunctions in the system.
■
Observe data sheets provided by the cable manufacturer.
■
Observe the pin assignment.
6.4 Overview of connections
16
Figure 2: SIM1012 overview of connections
POWER: Voltage supply input
1
CAN: Connection for SICK CAN sensor network (receiver/transceiver)
2
ETHERNET: 2 x 1 Gigabit Ethernet
3
SENSOR S1 - S6: Connections with digital inputs/outputs and voltage supply. Can be
4
alternatively used as IO-Link master connections.
INC: 1 x incremental encoder In/Out or 1 x RS-422
5
SERIAL: 1 x RS-232 / RS-422 / RS-485 or 1 x incremental encoder In/Out
6
For e functional ground connection, see electrical installation/notes chapter.
7
USB connection (Micro-B, for configuration/diagnostics/firmware update)
8
microSD card slot
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6.5 Pin allocation of the connections
1
4
32
1
7
2
6
3
4
5
8
6.5.1 POWER
Table 2: POWER pin assignment, M12 – 4-pin T-coded, male
Pin Signal Function
1 24 V IN1 Supply voltage IN1 (except CAN)
2 GND IN2 Ground
3 GND IN1 Ground
4 24 V IN2 Supply voltage IN2 (CAN)
Housing - Screen
Additional notes:
Max. 7.5 A (IN1), max. 4 A (IN2)
•
24 V ± 10% supply voltage
•
Maximum device power consumption (SIM1012): 15 W
•
Maximum power output of all connections: 270 W
•
The power cable must be protected with a total of 12 A
•
ELECTRICAL INSTALLATION 6
6.5.2 SERIAL
Table 3: SERIAL pin assignment, M12 - 8-pin A-coded, female
Pin Mode
RS-422 RS-232
1 - - - A- (in/out)
2 - - - A+ (in/out)
3 T- - Rx/Tx- (B) B- (in/out)
4 T+ TxD Rx/Tx+ (A) B+ (in/out)
5 R- -
6 R+ RxD
7 GND
8 24 V (supply voltage for peripherals, configurable, deactivated with factory set‐
Housing Screen
*
Standard configuration
*
RS-485 INC
tings)
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1
7
2
6
3
4
5
8
1
43
5
2
6 ELECTRICAL INSTALLATION
Additional notes:
Max. 1 A output for supply voltage connections (compliant with LPS)
•
Data transmission rates:
•
°
°
°
6.5.3 INC
Table 4: INC pin assignment, M12 - 8-pin A-coded, female
Pin Mode
1 T- - - A- (in/out)
2 T+ - - A+ (in/out)
3 R- - - B- (in/out)
4 R+ - - B+ (in/out)
5 - - - -
6 - - - -
7 GND (ground)
8 24 V (supply voltage for peripherals, configurable, deactivated with factory
Housing Screen
*
Standard configuration
RS-232: 115.2 kBaud
RS-422: 2 MBaud
RS-485: 2 MBaud
RS-422* RS-232 RS-485 INC
settings)
Additional notes:
Max. 0.5 A output for supply voltage connections (compliant with LPS)
•
Data transmission rates: max. 2 MBaud
•
6.5.4 CAN
Table 5: CAN pin assignment, M12 – 5-pin A-coded, female
Pin Signal Function Factory settings
1 - Screen -
2 +V24 Supply voltage for
peripherals, config‐
urable
3 GND Ground -
4 CAN_H CAN high
5 CAN_L CAN low
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Deactivated
Termination deacti‐
1)
vated
Subject to change without notice
Pin Signal Function Factory settings
1
43
5
2
Housing - Screen -
1)
Additional notes:
•
•
•
•
To enable voltage supply to the peripherals, both POWER CAN voltage supply strands
must be connected to 24 V.
6.5.5 SENSOR S1 - S6
Table 6: SENSOR S1 - S6 pin assignment, M12 - 5-pin A-coded, female
Pin Signal Function Factory settings
1 +24 V Supply voltage for
2 Input 2 Switching input -
3 GND Ground -
4 C/Q or Input 1/Output1IO-Link CQ or config‐
5 NC Not connected -
Housing - Screen -
ELECTRICAL INSTALLATION 6
Termination can be controlled via app
Access to SICK devices in SICK CAN sensor network
Data transmission rates from 50 Kbit/s up to 1 Mbit/s
Max. 3.2 A output for supply voltage connections (compliant with LPS)
Internal termination can be controlled through programming
Deactivated
peripherals, config‐
urable
All IO connections con‐
urable switching
input/output
figured as inputs
Additional notes:
6 x IO-Link master (1x master available per connection)
•
Max. 1 A output for supply voltage connections S1 to S6 (compliant with LPS)
•
Switching output
•
Max. output 100 mA
°
Min. high output logic level: VCC – 3 V
°
Max. low output logic level: 3 V
°
Push/pull, NPN, PNP configurable
°
Max. IO-Link output frequency: 230 kHz
°
Max. IO output frequency: 30 kHz
°
Switching inputs
•
Min. high input logic level: 12 V
°
Max. low input logic level: 4 V
°
Max. IO-Link input frequency: 230 kHz
°
Max. IO input frequency: 30 kHz
°
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1
7
2
6
54
3
8
6 ELECTRICAL INSTALLATION
6.5.6 ETH1 – ETH2
Table 7: ETH1 - ETH2 pin assignment, M12 - 8-pin X-coded, female
Pin Function
1 D1+
2 D1-
3 D2+
4 D2-
5 D4+
6 D4-
7 D3-
8 D3+
Additional notes:
The Ethernet connections can be used to connect the picoCam and midiCam camera
families and SICK LIDAR scanners as well as a PC or network.
The relevant drivers are implemented in the SIM1012 to enable usage of the SICK pico‐
Cam and midiCam camera families.
Jumbo frame support is needed when using Ethernet switches.
Transmission rate: max. 1 Gb/s
6.6
Connecting peripheral devices
The device can be connected to a wide range of sensors and cameras.
The required pin assignments can be found in the data sheets for the peripherals to be
connected as well as in the relevant connection descriptions, see "Pin allocation of the
connections", page 17.
1. Connect the cables to peripheral devices.
2. Route the cables to the device using installation materials (cable channels, cable
ties, etc.). When doing so, pay attention to cable strain relief.
3. Connect cables to the relevant device connections and screw together tightly.
4. Seal unused connections with dummy plugs.
6.7 Connecting voltage supply
NOTICE
Risk of damage to peripheral devices!
If peripheral devices are connected when the voltage supply is also applied, these
devices can become damaged.
■
Only connect peripheral devices when the voltage supply is disconnected.
1. Ensure that the voltage has been disconnected by the user.
2. Connect voltage supply cable(s) to the device.
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3. Lay the cable(s) with strain relief.
Subject to change without notice
4. Have the user connect the voltage supply.
5. Have the user activate the voltage.
ELECTRICAL INSTALLATION 6
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7 COMMISSIONING
7 Commissioning
7.1 Preparatory commissioning
Commissioning for preparatory purposes and under laboratory conditions differs in
some respects from commissioning in the target system.
In general, all safety and hazard warnings applicable to mounting (see "Important infor‐
mation", page 15) and electrical installation (see "Mounting", page 14) must also be
observed under laboratory conditions. In addition, further information must be taken
into consideration to guarantee the most effective preparation possible:
Only connect those devices to the product that you want to configure or program.
•
Operate the connected device in a controlled and contained network environment
•
for the time being to check network communication if necessary.
Note the company standards that apply to the use of checking and testing devices.
•
For initial programming, use ideal conditions for sensor or camera recognition.
•
Use the largest possible deviations from these ideal conditions to check the pro‐
•
gramming with respect to its error tolerance and reliability, and to determine error
limit values.
Procedure
1. Place the device on a non-slip base.
2. Connect the required peripheral devices, see "Connecting peripheral devices",
page 20.
3. Connect the network connection.
4. Connect the voltage supply.
5. Switch on the voltage supply.
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8 Operation
8.1 Status LEDs
OPERATION 8
When the device is operating, the operational status of the connections is indicated
visually by status LEDs.
Using these status indicators, the operator can find out quickly and easily whether the
device and the peripherals are working properly or whether any faults or errors have
occurred.
Monitoring the visual indicators is part of the routine inspection carried out on the
device and the machine/plant area into which the device is incorporated.
Meaning of symbols
Symbol Purpose
LED off
LED on
LED flashes
LED goes out briefly
LED lights up briefly
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23
8 OPERATION
Device status
Location Designation LED behavior Description
Dev RDY Device booting
Runlevel READY, no errors
detected*
Runlevel READY, boot
process error
Sys RDY User-defined, configurable
with SICK AppSpace
Result User-defined, configurable
with SICK AppSpace
Funct 1 User-defined, configurable
with SICK AppSpace
POWER IN
Funct 2 User-defined, configurable
with SICK AppSpace
Remote Remote maintenance
active, currently not sup‐
ported
BLE Currently not supported
*
Time delay before availability due to boot process (about 20 s)
Location Designation LED behavior Description
POWER IN1
POWER IN2
Voltage not applied to the
connection.
Voltage applied.
Under/overvoltage
detected.
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INC
SERIAL
OPERATION 8
Location Designation LED behavior Description
PWR/ACT Voltage not applied to the
connection.
Voltage applied. No signal
activity.
Voltage applied. Signal
activity.
Voltage not applied to the
connection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Location Designation LED behavior Description
PWR/ACT Voltage not applied to the
connection.
Voltage applied. No signal
activity.
Voltage applied. Signal
activity.
Voltage not applied to the
connection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
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25
8 OPERATION
CAN
Location Designation LED behavior Description
PWR/ACT Voltage not applied to the
connection.
Voltage applied. No signal
activity.
Voltage applied at signal
activity connection.
Voltage not applied to the
connection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Term Termination resistor not
activated.
Termination resistor acti‐
vated.
SENSOR S1 – S6
Location Designation LED behavior Description
PWR/ACT Voltage not applied to the
connection.
Voltage applied. No signal
activity.
Voltage applied. Signal
activity.
Voltage not applied to the
connection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
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ETHERNET 1 - 2
OPERATION 8
Location Designation LED behavior Description
Link/Act Connection not established
with Ethernet
Connection established
with Ethernet.
No activity.
Data transmission via Eth‐
ernet.
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27
9 MAINTENANCE
9 Maintenance
9.1 Cleaning
NOTICE
Equipment damage due to improper cleaning.
Improper cleaning may result in equipment damage.
■
■
b
Only use recommended cleaning agents.
Never use sharp objects for cleaning.
The device must be cleaned regularly from the outside to guarantee heat dissipa‐
tion and therefore operation. Clean using a dry towel or an industrial vacuum
cleaner. Do not use cleaning agents.
9.2
Maintenance plan
During operation, the device works maintenance-free.
Depending on the assignment location, the following preventive maintenance tasks
may be required for the device at regular intervals:
Table 8: Maintenance plan
Maintenance work Interval To be carried out
Check that the unused connections
are sealed with blind plugs
Interval depends on ambient condi‐
tions and climate. Recommended: At
least every 6 months.
by
Specialist
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10 Decommissioning
10.1 Disposal
CAUTION
Risk of injury due to hot device surface.
The surface of the device can become hot during operation.
■
Before commencing disassembly, switch off the device and allow it to cool down
as necessary.
If a device can no longer be used, dispose of it in an environmentally friendly manner in
accordance with the applicable country-specific waste disposal regulations. Do not dis‐
pose of the product along with household waste.
NOTICE
Danger to the environment due to improper disposal of the device.
Disposing of devices improperly may cause damage to the environment.
Therefore, observe the following information:
■
Always observe the valid regulations on environmental protection.
■
Separate the recyclable materials by type and place them in recycling containers.
DECOMMISSIONING 10
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29
11 TECHNICAL DATA
11 Technical data
NOTE
The relevant online data sheet for your product, including technical data, dimensional
drawing, and connection diagrams can be downloaded, saved, and printed from the
Internet:
www.sick.com/SIM10xx
•
11.1 Features
Feature Parameter
Task Data recording, evaluation, and archiving
Supported devices
(excerpt)
Technology Embedded hardware architecture:
Random Access Memory 1 GB
Flash memory 256 MB in total, 30 MB of which available for applications
Memory card (optional) Industry-grade microSD memory card (flash card), max. 16 GB
Programming software SICK AppStudio
Sensor data processing According to SICK Algorithm API
Encoders, code readers, RFID read/write devices, SICK LiDAR
scanners, SICK picoCam and midiCam
2 Core ARM Cortex-A9 CPU with NEON acceleration
•
FPGA for I/O handling
•
Software:
Can be programmed within the SICK AppSpace environment
•
SICK Algorithm API
•
11.2 Interfaces
Feature Parameter
Data storage and retrieval Image and data logging via microSD memory card, internal RAM,
and external FTP
SERIAL (RS-232 / RS-422 / RS-485)
Number 1, also configurable as an encoder output port
Function RS-232 / RS-422 / RS-485, incremental encoder (In/Out)
Maximum data transmis‐
sion rate
INC (incremental)
Number 1, also configurable as RS-422 interface
Function Incremental encoder (In/OUT), RS-422
Maximum frequency 2 MHz
ETHERNET
Number 2
Function Host, AUX, image transmission
Data transmission rate 10/100/1,000 Mbit/s
Protocol TCP/IP, FTP (image transmission)
CAN
RS-232: 115.2 kBaud
RS-422: 2 MBaud
RS-485: 2 MBaud
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TECHNICAL DATA 11
Feature Parameter
Number 1
Function SICK CAN sensor network (master/slave, multiplexer/server) with
termination resistor which can be activated
Data transmission rate 20 kbit/s ... 1 Mbit/s
Protocol CSN (SICK CAN sensor network)
IO-Link
Number 6 (SENSOR S1 to S6)
Function IO-Link master V1.1
Data transmission rate max. 230 kBaud
Digital switching inputs/outputs
S1-S6 Inputs: 1 each, max. frequency: 30 kHz
Inputs/outputs: 1 each (configurable), max. frequency: 30 kHz
USB
Number 1
Function USB 2.0 for configuration/diagnostics/firmware update
11.3 Mechanics and electronics
Feature Parameter
Optical indicators 7 x red/green status indicators
Electrical connection POWER: 1 x M12, 4-pin male connector, T-coded
Supply voltage 24 V DC, ± 10% SELV in accordance with EN 60950-1
Operating current Limit to max. 12 A from external power supply unit
Power consumption 15 W max., without connected sensors
Power output Total 270 W max. (all connections)
Output current
SENSOR S1-S6, IO Max. output current to switching output pins: 100 mA
SENSOR S1-S6, IO Max. output current to power supply pins: 1 A, LPS in accordance
Housing material Aluminum
Housing color Light blue (RAL 5012), with white-gray front foil (RAL 9002)
Protection class III with functional earth
2 x orange/green link/act displays
11 x red/green status indicators for Power, CAN, sensor, Inc, Serial
1 x blue CAN termination
INC: 1 x M12, 8-pin female connector, A-coded
SERIAL: 1 x M12, 8-pin female connector, A-coded
CAN: 1 x M12, 5-pin female connector, A-coded
SENSOR S1–S6, IO-Link master: 6 x M12, 5-pin female connector,
A-coded
ETHERNET: 2 x M12, 8-pin female connector, X-coded
USB: Micro-B
with EN 60950-1
CAN Max. output current to power supply pin: 3.2 A, LPS in accordance
with EN 60950-1
SERIAL Max. output current to power supply pin: 1 A, LPS in accordance
with EN 60950-1
INC Max. output current to power supply pin: 0.5 A, LPS in accordance
with EN 60950-1
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31
11 TECHNICAL DATA
Feature Parameter
Weight 876 g (including connection plugs)
Dimensions (W x D x H) 86.5 x 45.8 x 265.5 mm
11.4 Ambient data
Feature Parameter
Electromagnetic compati‐
bility (EMC)
Vibration resistance EN 60068-2-6: 2008-02
Shock resistance EN 60068-2-27:2009-05
Electrical safety EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 +AC:
Enclosure rating IP65 in accordance with EN 60529:1991-10 + A1:2000-02 +
Ambient operating temper‐
ature
Storage temperature -20 °C ... +70 °C
Permissible relative humid‐
ity
EN 61000-6-2:2005-08
EN 61000-6-4:2007 + A1:2011
2011 + A2:2013
A2:2013-10 (requires blind plugs to be inserted into unused con‐
nections)
0 °C ... +50 °C, taking the described mounting requirements into
account, see "Mounting the device", page 14
90%, non-condensing
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12 Annex
SIM1012
ETHERNET
POWER CAN
SENSOR
INC SERIAL
21
Link/Act
Prw IN1 Prw IN2 Prw/Act Term
Dev RDY
Sys RDY
Result
Funct 1
Funct 2
Remote
BLE
Dev RDY
Sys RDY
Result
Funct 1
Funct 2
Remote
BLE
Link/Act
Pwr/Act Pwr/Act
Pwr/Act Pwr/Act
Pwr/Act Pwr/Act
Pwr/Act Pwr/Act
S1 S2
S3 S4
S5 S6
USBMicro-SD
265.5 (10.45)
233.5 (9.19)
50 (1.97)
45 (1.77)
6.4 (0.25)
249.5 (9.82)
213
(8.38)
50 (1.97)
34.4 (1.35)
25.4
(1.00)
41.6
(1.64)
46
(1.81)
9 (0.35)
24 (0.95)
4 (0.16)
30 (1.18)
86.5 (3.41)
121
(4.77)
95
(3.75)
69
(2.73)
43
(1.70)
17
(0.68)
0
27
(1.06)41(1.63)
56
(2.20)
20
(0.79)
0
21
(0.83)
4.5
(0.18)
53
(2.09)
12.1 Dimensional drawings
Dimensions without accessories
All measurements in mm.
ANNEX 12
12.2 Licenses
SICK uses open-source software. This software is licensed by the rights holders using
the following licenses among others: the free licenses GNU General Public License (GPL
Version2, GPL Version3) and GNU Lesser General Public License (LGPL), the MIT
license, zLib license, and the licenses derived from the BSD license.
This program is provided for general use, but WITHOUT ANY WARRANTY OF ANY KIND.
This warranty disclaimer also extends to the implicit assurance of marketability or suit‐
ability of the program for a particular purpose.
More details can be found in the GNU General Public License. View the complete
license texts here: www.sick.com/licensetexts. Printed copies of the license texts are
also available on request.
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33
Further locations at www.sick.com
Australia
Phone +61 (3) 9457 0600
1800 33 48 02 – tollfree
E-Mail sales@sick.com.au
Austria
Phone +43 (0) 2236 62288-0
E-Mail office@sick.at
Belgium/Luxembourg
Phone +32 (0) 2 466 55 66
E-Mail info@sick.be
Brazil
Phone +55 11 3215-4900
E-Mail comercial@sick.com.br
Canada
Phone +1 905.771.1444
E-Mail cs.canada@sick.com
Czech Republic
Phone +420 2 57 91 18 50
E-Mail sick@sick.cz
Chile
Phone +56 (2) 2274 7430
E-Mail chile@sick.com
China
Phone +86 20 2882 3600
E-Mail info.china@sick.net.cn
Denmark
Phone +45 45 82 64 00
E-Mail sick@sick.dk
Finland
Phone +358-9-25 15 800
E-Mail sick@sick.fi
France
Phone +33 1 64 62 35 00
E-Mail info@sick.fr
Germany
Phone +49 (0) 2 11 53 01
E-Mail info@sick.de
Hong Kong
Phone +852 2153 6300
E-Mail ghk@sick.com.hk
Hungary
Phone +36 1 371 2680
E-Mail ertekesites@sick.hu
India
Phone +91-22-6119 8900
E-Mail info@sick-india.com
Israel
Phone +972-4-6881000
E-Mail info@sick-sensors.com
Italy
Phone +39 02 27 43 41
E-Mail info@sick.it
Japan
Phone +81 3 5309 2112
E-Mail support@sick.jp
Malaysia
Phone +603-8080 7425
E-Mail enquiry.my@sick.com
Mexico
Phone +52 (472) 748 9451
E-Mail mario.garcia@sick.com
Netherlands
Phone +31 (0) 30 229 25 44
E-Mail info@sick.nl
New Zealand
Phone +64 9 415 0459
0800 222 278 – tollfree
E-Mail sales@sick.co.nz
Norway
Phone +47 67 81 50 00
E-Mail sick@sick.no
Poland
Phone +48 22 539 41 00
E-Mail info@sick.pl
Romania
Phone +40 356-17 11 20
E-Mail office@sick.ro
Russia
Phone +7 495 283 09 90
E-Mail info@sick.ru
Singapore
Phone +65 6744 3732
E-Mail sales.gsg@sick.com
Slovakia
Phone +421 482 901 201
E-Mail mail@sick-sk.sk
Slovenia
Phone +386 591 78849
E-Mail office@sick.si
South Africa
Phone +27 (0)11 472 3733
E-Mail info@sickautomation.co.za
South Korea
Phone +82 2 786 6321
E-Mail info@sickkorea.net
Spain
Phone +34 93 480 31 00
E-Mail info@sick.es
Sweden
Phone +46 10 110 10 00
E-Mail info@sick.se
Switzerland
Phone +41 41 619 29 39
E-Mail contact@sick.ch
Taiwan
Phone +886-2-2375-6288
E-Mail sales@sick.com.tw
Thailand
Phone +66 2 645 0009
E-Mail marcom.th@sick.com
Turkey
Phone +90 (216) 528 50 00
E-Mail info@sick.com.tr
United Arab Emirates
Phone +971 (0) 4 88 65 878
E-Mail info@sick.ae
United Kingdom
Phone +44 (0)17278 31121
E-Mail info@sick.co.uk
USA
Phone +1 800.325.7425
E-Mail info@sick.com
Vietnam
Phone +65 6744 3732
E-Mail sales.gsg@sick.com
8023514//2019-01-25/en
SICK AG | Waldkirch | Germany | www.sick.com
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