SICK MLG-2 Technical Information
MLG-2
SICK Smart Sensors / IO-Link
Device configuration – Advanced operating instructions
T E C H N I C A L I N F O R M A T I O N
Product described
IO Link – MLG2
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Legal information
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tion of this document or parts of this document is only permissible within the limits of the legal determination of
Copyright Law. Any modification, abridgment or translation of this document is prohibited without the express writ‐
ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
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Contents
CONTENTS
1 About this document........................................................................ 5
1.1 Purpose of this document........................................................................ 5
1.2 Intended use............................................................................................. 5
1.3 Symbols..................................................................................................... 5
2 Description of IO-Link....................................................................... 6
3 Accessories for visualization, configuration, and integration..... 7
4 Data repository.................................................................................. 8
5 Physical layer..................................................................................... 9
6 Process data...................................................................................... 10
6.1 PD in.......................................................................................................... 10
6.1.1 System and Q status + run length code (RLC)....................... 10
6.1.2 System and Q status + beam status...................................... 10
6.1.3 User-defined process data content........................................ 10
6.1.4 System status and output status............................................ 11
6.2 PD out........................................................................................................ 11
7 Service data....................................................................................... 12
7.1 Device identification................................................................................. 12
7.1.1 Product name and manufacturer name................................. 12
7.1.2 Product text and serial number.............................................. 12
7.1.3 Definable names..................................................................... 12
7.1.4 Hardware and firmware version.............................................. 13
7.1.5 Find me..................................................................................... 13
7.2 Teach-in / detection settings for MLG-2 devices.................................... 13
7.2.1 Teach-in and beam blanking via teach-in............................... 13
7.2.2 Beam blanking mask............................................................... 14
7.2.3 Definition of zones................................................................... 15
7.3 Performance options................................................................................ 15
7.4 Process data setting................................................................................. 17
7.5 Beam hold functions................................................................................ 19
7.6 Configuring outputs Q1 – Q4................................................................... 21
7.7 System settings......................................................................................... 22
7.8 Installation / Diagnostics......................................................................... 23
7.8.1 Process quality and teach quality........................................... 23
7.8.2 Device alignment..................................................................... 23
7.8.3 Device properties..................................................................... 24
7.8.4 Diagnostics............................................................................... 24
8 Events.................................................................................................. 25
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CONTENTS
9 Use cases............................................................................................ 26
10 List of abbreviations.......................................................................... 30
11 Index.................................................................................................... 31
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ABOUT THIS DOCUMENT 1
1 About this document
1.1 Purpose of this document
The ISDU descriptions in this document apply to IO-Link-enabled photoelectric sensors (Smart Sensors) with the
following principle of operation: MLG-2.
In some cases, functions may be described in this document which are not supported by individual sensors. The
functions in question are marked accordingly (see "Symbols", page 5).
The specific functional scope of an individual sensor is described in full in the Supplement to operating instructions on
the relevant product page under www.sick.com.
1.2 Intended use
Use IO-Link only as described in this documentation.
1.3 Symbols
NOTICE
This symbol indicates important information.
NOTE
This symbol provides additional information, e.g., dependencies / interactions between the described function and
other functions, or when individual functions are not supported by every sensor.
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DESCRIPTION OF IO-LINK
2
2 Description of IO-Link
IO-Link and control integration
IO-Link is a non-proprietary internationally standardized communication technology, which makes it possible to
communicate with sensors and actuators in industrial environments (IEC 61131-9).
IO-Link devices communicate with higher-level control systems via an IO-Link master. The IO-Link devices (slaves)
are connected to these via a point-to-point connection.
Different variants of IO-Link master are available. In most cases, they are remote fieldbus gateways or input cards
for the backplane bus of the control used.
To make it possible for an IO-Link sensor to communicate with the control, both the IO-Link master and the
IO-Link sensor must be integrated in the hardware configuration in the control manufacturer’s Engineering Tool.
To simplify the integration process, SICK provides sensor-specific device description files (IODD = IO-Link Device
Description) for IO-Link devices.
You can download these device description files free of charge: www.sick.com/[device-part number].
Not all control system manufacturers support the use of IODDs. If third-party IO-Link masters are used, it is possi‐
ble to integrate the IO-Link sensor by manually entering the relevant sensor parameters directly during the hard‐
ware configuration.
To ensure that the IO-Link sensor can be easily integrated into the control program, SICK also provides function
blocks for many control systems. These function blocks make it easier to read and write the individual
sensor parameters, for example, and provide support when it comes to interpreting the process data supplied by
the IO-Link sensor. You can also download them free of charge from the homepage: www.sick.com/[device-part
number].
On SICK’s YouTube channel, you can find some tutorials, which will help you to integrate SICK IO-Link masters:
www.youtube.com/SICKSensors.
If you have any questions, SICK’s Technical Support is available to help all over the world.
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ACCESSORIES FOR VISUALIZATION, CONFIGURATION, AND INTEGRATION 3
3 Accessories for visualization, configuration, and integration
Using the , you can easily connect IO-Link sensors from SICK to a PC or a laptop via USB. You can then quickly and
easily test or configure the connected sensors using the SOPAS ET program (SICK Engineering Tool with graphic
user navigation and convenient visualization).
The corresponding visualization files (SDD = SOPAS Device Description) are available for many devices so that you
can operate the IO-Link sensors using SOPAS ET.
You can download SOPAS ET and the device-specific SDDs directly and free of charge from the SICK homepage:
www.sick.com.
Various IO-Link masters are available from SICK for integrating IO-Link masters using fieldbus. For more details,
see: www.sick.com.
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4 DATA REPOSITORY
4 Data repository
When the current IO-Link standard V1.1 was introduced, the automatic data repository (Data Storage) was added
to IO-Link’s range of functions. The data repository allows the machine operator to replace defective IO-Link
devices with corresponding replacement devices without having to reconfigure these manually.
When the data repository is activated, the IO-Link 1.1 master always saves the last valid setting parameters of all
connected IO-Link 1.1 devices in its local memory. If you replace one of the connected IO-Link devices with
another device which is compatible with the function, the IO-Link master will transfer the last valid parameter set
of the previous sensor to the new sensor automatically.
The data repository therefore means that devices can be replaced in a plug-and-play manner within a matter of
seconds – without complex reconfiguration, special hardware or software tools, and specific specialist knowledge.
NOTE
To use the data repository, you must activate it in the IO-Link master.
•
When the conversion of one or several sensor parameters is initiated via the control, then the control must
•
activate the Data Storage Upload Request-Flag as the final command in the sensor. Only this initiates the data
repository.
Uploading / downloading sensor parameters using the data repository function can take between a few hun‐
•
dred milliseconds and three seconds depending on the volume of data and the IO-Link master used (typical
values; values can differ in practice).
For details on using the data repository, see IO-Link Interface and System Specification, V1.1.2, chapter 10.4
•
Data Storage (DS) at www.io-link.com, Downloads menu item.
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PHYSICAL LAYER 5
5 Physical layer
The physical layer describes the basic IO-Link device data (see table below). The device data is automatically
shared with the IO-Link master. It is important to ensure that the used IO-Link master supports this performance
data.
NOTICE
The maximum current consumption of the IO-Link sensor (including load at the outputs) must not exceed the per‐
missible output current of the relevant port on the IO-Link master.
Table 1: Physical layer – IO-Link device data
SIO mode Yes
Min. cycle time 3 ms
Baud rate COM 3 (230.4 kbit/s)
Process data length PD in (from device to master) 32 bytes
Process data length PD out (from master to device) 1 byte
IODD version V1.0.1
Supported IO-Link version IO-Link V1.1
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6 PROCESS DATA
6 Process data
Process data is transmitted cyclically. There is no confirmation of receipt.
The master determines the cycle time; however, this must not be less than the minimum cycle time of the sensor
(see table 1, page 9).
Note: The service data (acyclic data) does not influence the cycle time.
There is PD-in and PD-out data:
PD in
•
Data from the IO-Link sensor to the IO-Link master – the current status of the sensor is displayed as quickly
as possible (incoming process data).
PD out
•
Commands from the IO-Link master to the IO-Link sensor – for the quickest possible transmission of system
commands (outgoing process data).
6.1
PD in
The PD-in process data, which is transmitted cyclically from the MLG-2 to the IO-Link master, can be configured
depending on the application. 3 different types of data content can be selected using ISDU 120.
6.1.1 System and Q status + run length code (RLC)
Table 2: Process data selection, can be set using ISDU 120; value 0
System and Q status + run length code (RLC)
Byte
Off‐
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
set
RLC 15 RLC 14 RLC 13 RLC 12 RLC 11 RLC 10 RLC 9 RLC 8 RLC 7 RLC 6 RLC 5 RLC 4 RLC 3 RLC 2 RLC 1
1
SS = system status (description: see table 5)
2
AS = output status (description: see table 5)
SS1AS
6.1.2 System and Q status + beam status
Process data selection, can be set using ISDU 120; value 1
Table 3: Process data selection, can be set using ISDU 120; value 1
System and Q status + beam status
Byte
off‐
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
set
beam
beam
beam
beam
beam
beam
beam
beam
beam
beam
beam
beam
beam
beam
beam
225 ...
209 ...
224
193 ...
240
1
SS = system status (description: see table 5)
2
AS = output status (description: see table 5)
208
177
192
161 ...
176
145 ...
160
129 ...
144
113 ...
128
97 ...
112
81 ...
96
65 ...
80
49 ...
64
33 ...
48
17 ...
32
1 ...
16
SS1AS
2
2
6.1.3 User-defined process data content
Process data selection, can be set using ISDU 120; value 2
Table 4: Process data selection, can be set using ISDU 120; value 2
User-defined process data
Byte
off‐
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
set
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