Sichuan AI Link Technology LTM3210 Users manual

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LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

 Reserving System

IEEE Std. 802.11b

IEEE Std. 802.11g

IEEE Std. 802.11n

 Chip Solution

WIFI ：Qualcomm QCA4010

 Size

30.0mm*16.0mm*3.0mm

Module Name

Install

Standard

Data Rate

Band

Antenna

Interface

Note

LTM3210

SMT

IEEE 802.11b/g/n

135Mbps

2.4 GHz

Stamp Hole

3.3V power supply

AI-LINK

Features

：

Model Overview

：

Sichuan AI-Link Technology Co.,Ltd Add:

Tel： 13881190925 Web: http://www.changhong.com

Anzhou,Industrial park,Mianyang,Sichuan

LTM3210

Feedback of customer’s Confirmation

We accept the specification after Confirmed

Customer name

Customer signature

Confirmation Date

Please feed back this paper and first paper after your signature by the address,thanks!

ADD： Anzhou,Industrial park,Mianyang,Sichuan

Factory： Sichuan AI-Link Technology Co.,Ltd.

Approved

Checked

Designed

Product

WiFi Module

Model

LTM3210

Date

2018-07-03

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 2 of 17

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Date of

modification

Main content of

modification

Reason of

modification

Serial number of

modification

Confirm

V1.0

20180703

Initial release

Fengjie

Record of Modification

LTM3210

Sichuan AI-Link Technology Co., Ltd. page 3 of 17

LTM3210

1. Brief description:

 QCA4010 chip



An integrated Balun to save cost and size, minimize tuning and tolerance

 A printed antenna



2MB SPI Flash memory and etc

Module Interface

3. Package outline and Mounting:

IEEE 802.11b/g/n 1T1R SDIO IOT Module

IOT MODULE LTM3210 is based on Qualcomm QCA4010 complied with IEEE 802.11b/g/n standard in

2.4GHz ISM band.Supported for 135Mbps high speed wireless network connection. LTM3210 module includes the following components:

LTM3210 manufacturing interface

USB 2.0 interface with integrated controller and PHY for manufacturing test and configuration.

LTM3210 host interfaces

UART host interface to a remote microcontroller with an AT style command set.

Figure 3.1 LTM3210 module dimensions

Sichuan AI-Link Technology Co., Ltd. page 4 of 17

IEEE 802.11b/g/n 1T1R SDIO IOT Module

4. Pin Definition:

Table 3.1 LTM3210 module dimensions

NOTE: General tolerance ±0.2mm unless otherwise stated

LTM3210

Figure 4.1 top view

Sichuan AI-Link Technology Co., Ltd. page 5 of 17

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Table 4.1 LTM3210 pin assignment

Sichuan AI-Link Technology Co., Ltd. page 6 of 17

5.Bootstrap Signals

6.Timing specifications

6.1 SPI master interface timing

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Table 5.1 Bootstrap Signals

Figure 6.1 SPI master timing

Table 6.1 SPI master timing

Sichuan AI-Link Technology Co., Ltd. page 7 of 17

6.2 SPI slave interface timing

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Figure 6.2 SPI slave timing

7.Product Pictures

Table 6.1 SPI slave timing

TOP VIEW BOTTOM VIEW

Sichuan AI-Link Technology Co., Ltd. page 8 of 17

8.Key Materials

Items

Category

MPN

Description

MFR

Notes

QCA4010

116 QFN

Qualcomm

PCB

LTM3210

FR-4,2LAY

Sunlord IQPCB

Crystal

E3SB40E000900E

40M

JWT Hosonic

No.

Feature

Description

7-1

Operation Voltage

3.3V+/-0.3

7-2

Current Consumption

Total3.3V@Max 410mA BW 40 MHZ@14dbm

7-3

Operation Temperature

0°C to +70°C

7-4

Antenna Type

Integral PCB antenna

7-5

SDIO

SDIO slave Interface

7-6

Storage Temperature

-45°C to +135°C

9.General Requirements:

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 9 of 17

10.Electrical Characteristics:

10-1 IEEE 802.11b Section:

Items

Contents

Specification

IEEE802.11b

Mode

DSSS

Channel

CH1 to CH11

Data rate

1, 2, 5.5, 11Mbps

Min.

Typ.

Max.

Unit

Remark

TX Characteristics

1. Power Levels(Calibrated)

1) for each data rate

18.5

dBm

2. Spectrum Mask @ target power

1) fc +/-11MHz to +/-22MHz

---30

dBr

2) fc > +/-22MHz

---50

dBr

3 Constellation Error(EVM)@ target power

1) 1Mbps

---10

2) 2Mbps

---10

3) 5.5Mbps

---10

4) 11Mbps

-10

4. Frequency Error

-10-510

ppm

RX Characteristics

Min.

Typ.

Max.

Unit

5 Minimum Input Level Sensitivity(each chain)

1) 1Mbps (FER ≦8%)

-83

dBm

2) 2Mbps (FER ≦8%)

-80

dBm

3) 5.5Mbps (FER ≦8%)

-79

dBm

4) 11Mbps (FER ≦8%)

-76

dBm

6 Maximum Input Level (FER ≦8%)

-10--

dBm

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 10 of 17

LTM3210

10-2 IEEE 802.11g Section:

Items

Contents

Specification

IEEE802.11g

Mode

OFDM

Channel

CH1 to CH11

Data rate

6, 9, 12, 18, 24, 36, 48, 54Mbps

Min.

Typ.

Max.

Unit

Remark

TX Characteristics

1. Power Levels

1) for each data rate

21.5

dBm

2. Spectrum Mask @ target power

1) at fc +/-11MHz

---20

dBr

2) at fc +/-20MHz

---28

dBr

3) at fc > +/-30MHz

---40

dBr

3 Constellation Error(EVM)@ target power

1) 6Mbps

---5

2) 9Mbps

---8

3) 12Mbps

---10

4) 18Mbps

---13

5) 24Mbps

---16

6) 36Mbps

---19

7) 48Mbps

---22

8) 54Mbps

-25

4 Frequency Error

-10-510

ppm

RX Characteristics

Min.

Typ.

Max.

Unit

5 Minimum Input Level Sensitivity(each chain)

1) 6Mbps (PER ≦10%)

-85

dBm

2) 9Mbps (PER ≦10%)

-84

dBm

3) 12Mbps (PER ≦10%)

-82

dBm

4) 18Mbps (PER ≦10%)

-80

dBm

5) 24Mbps (PER ≦10%)

-77

dBm

6) 36Mbps (PER ≦10%)

-73

dBm

7) 48Mbps (PER ≦10%)

-69

dBm

8) 54Mbps (PER ≦10%)

-65

dBm

6 Maximum Input Level (PER ≦10%)

-20--

dBm

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 11 of 17

LTM3210

10-3 IEEE 802.11n HT20 Section:

Items

Contents

Specification

IEEE802.11n HT20 @ 2.4GHz ISM

Mode

OFDM

Channel

CH1 to CH11

Data rate (MCS index)

MCS0/1/2/3/4/5/6/7

Min.

Typ.

Max.

Unit

Remark

TX Characteristics

Min.

Typ.

Max.

Unit

2. Power Levels

1) for each data rate

19.5

dBm

3. Spectrum Mask @target power

1) at fc +/-11MHz

---20

dBr

2) at fc +/-20MHz

---28

dBr

3) at fc > +/-30MHz

---45

dBr

4. Constellation Error(EVM)@ target power

1) MCS0

---5

2) MCS1

---10

3) MCS2

---13

4) MCS3

---16

5) MCS4

---19

6) MCS5

---22

7) MCS6

---25

8) MCS7

-28

5. Frequency Error

-10-10

ppm

RX Characteristics

Min.

Typ.

Max.

Unit

6. Minimum Input Level Sensitivity(each chain)

1) MCS0 (PER ≦10%)

-82

dBm

2) MCS1 (PER ≦10%)

-79

dBm

3) MCS2 (PER ≦10%)

-77

dBm

4) MCS3 (PER ≦10%)

-74

dBm

5) MCS4 (PER ≦10%)

-70

dBm

6) MCS5 (PER ≦10%)

-66

dBm

7) MCS6 (PER ≦10%)

-65

dBm

8) MCS7 (PER ≦10%)

-64

dBm

7. Maximum Input Level (PER ≦10%)

-20--

dBm

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 12 of 17

LTM3210

10-4 IEEE 802.11n HT40 Section:

Items

Contents

Specification

IEEE802.11n HT40 @ 2.4GHz ISM

Mode

OFDM

Channel

CH3 to CH9

Data rate (MCS index)

MCS0/1/2/3/4/5/6/7

Min.

Typ.

Max.

Unit

Remark

TX Characteristics

Min.

Typ.

Max.

Unit

1. Power Levels (Calibrated)

1) for each data rate

19.2

dBm

2. Spectrum Mask @target power

1) at fc +/-22MHz

---20

dBr

2) at fc +/-40MHz

---28

dBr

3) at fc > +/-60MHz

---45

dBr

3. Constellation Error(EVM)@target power

1) MCS0

---5

2) MCS1

---10

3) MCS2

---13

4) MCS3

---16

5) MCS4

---19

6) MCS5

---22

7) MCS6

---25

8) MCS7

-28

4. Frequency Error

-10-510

ppm

RX Characteristics

Min.

Typ.

Max.

Unit

5. Minimum Input Level Sensitivity(each chain)

1) MCS0 (PER ≦10%)

-79

dBm

2) MCS1 (PER ≦10%)

-76

dBm

3) MCS2 (PER ≦10%)

-74

dBm

4) MCS3 (PER ≦10%)

-71

dBm

5) MCS4 (PER ≦10%)

-67

dBm

6) MCS5 (PER ≦10%)

-63

dBm

7) MCS6 (PER ≦10%)

-62

dBm

8) MCS7 (PER ≦10%)

-61

dBm

6. Maximum Input Level(PER ≦10%)

-20--

dBm

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 13 of 17

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Test Items

Test Conditions

Qty

Criteria Condition

4-1

Drop test

The packed samples within 100Kg can be tested Drop height: Face Side: 800/600/450mm Edge line: 600/450/350mm

Drop time: 1 each Face and edge.

1xBox

After drop test, the outer box and inner box will not been broken by appearance visual inspection.

4-2

Vibration test

X-Y-Z direction, first Frequency changing from 10Hz to 30Hz to 10Hz ,amplitude 0.75mm, 5 times vibrations, then frequency Changing from 30Hz to 55 Hz to 30 Hz, amplitude

0.15mm, 5 time vibration.

After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification.

4-3

Impact test

Impact acceleration: 50m/sec2; Impact duration: 16ms； Impact times: 1000.

After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification.

4-4

Soldering ability

test

Soldering temperature: 235±5℃ Soldering duration: 2±0.5S

1. After soldering, the soldered area must be covered by a smooth bright solder layer, some deficiencies such as a small amount of the pinhole, not wetting are allowed, but the deficiencies can not be in the same place；

2. At least 90% of soldered area shall be covered continuously by the soldering material.

4-5

Humidity test

Leave samples in 40±3℃, 93% RH @ 96 hours

Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error functional parameter shall be satisfied with the test specification.

4-6

High temperature

load life test

Thermostat cabinet temperature: 55±5℃ Applied voltage: 110% rated voltage Working duration: 200 hour (Supply Voltage Cycle 23h power on, 1h power off)

After test, leave samples in standard condition for 1 hour and test, Power, EVM and Frequency error shall be satisfied with the test specification.

4-7

High temperature

load test

Temperature: 55±5℃ Samples work for 16 hours

After test, the Appearance, Power, EVM and Frequency error shall be Satisfied with the test specification.

4-8

Low temperature

storage test

Leave the samples in

-25±3℃@24 hours

Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification.

11.Mechanical, Environmental and Reliability Tests

LTM3210

Sichuan AI-Link Technology Co., Ltd. page 14 of 17

LTM3210

4-9

Low temperature

load test

Leave samples in

-15±3℃@ 2 hours,

samples’ function shall be normal, the let samples work for 1 hour

After test, leave the samples in standard condition and tested the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification.

4-10

Temperature circle

test

One cycle duration

-10±3℃ @3H 40±3℃ @3H Total cycle: 10x

After test, leave the samples in standard condition and tested Power EVM and Frequency error shall be qualified and all the characters shall be satisfied with the test specification.

4-11

Continuous

TP test

Twice cycle duration

-10±3℃@4H +60±3℃@4H, +25@2H@2H

During test, There will not been appeared signal disconnection or interruption between DUT and AP.

4-12

ESD

Discharge voltage: 2kV C: 150pF Discharge resistance：330Ω Positive10 times 1 time for each second

The products can recoverable smoothly after ESD test.

IEEE 802.11b/g/n 1T1R SDIO IOT Module

Sichuan AI-Link Technology Co., Ltd. page 15 of 17

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

12.Package

（1）put the products into the trays （2）tie up the trays

（3）put the trays into the box （4）fill the interspace with cystosepiment

（5）paste the sticker on the box

Sichuan AI-Link Technology Co., Ltd.

page 16 of 17

LTM3210

IEEE 802.11b/g/n 1T1R SDIO IOT Module

13.FCC Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Labeling Instruction for End User Device Integrator

Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: XXXXXX” any similar wording that expresses the same meaning may be used.

§ 15.19 Labelling requirements shall be complied on end user device. Labelling rules for special device, please refer to §2.925, § 15.19 (a)(5) and relevant KDB publications. For E-label, please refer to §2.935.

Installation Notice The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application, a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations.

FCC Part 15B Compliance Requirements for End User Device

The OEM integrator is responsible for ensuring that the host product which is installed and operating with the module is in compliant with Part 15B requirements. Please note that For a Class B digital device or peripheral, the instructions furnished the user manual of the end-user product shall include statement set out in §15.105 Information to the user or such similar statement and place it in a prominent location in the text of the manual.

Sichuan AI-Link Technology Co., Ltd.

page 17 of 17

Sichuan AI Link Technology LTM3210 Users manual

Specifications and Main Features

Frequently Asked Questions

User Manual