Page 1
Product Specification
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Page 1 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Powerful 3-litre PC offers space for
four 2.5" drives plus M.2-SSD
The ultra-com pact Shuttle XPC s lim Barebone XH27 0 comes in a robus t
metal chass is and can be used in many ways . With three concurrently
usable graphics ports and numerous USB ports , it is highly f lexible for
off ice and media applications and supports a huge range of
proces sors too. I ts COM por t and the practical "always-on-jumper"
also makes it interesting for industrial envi ronments. Special h ighlights
include support for up to four 2.5" drive bays and one M.2-2280 slot
for NVMe drives. This can make it a mini se rver PC with RAID 10
support. Plus , the re are two Intel network ports that support teaming
mode. The XH270 is the perfect basis for a power -efficient and
reliable system for a wide range of app lications. The built -in heatpipe
cooling ensures the s ystem runs quietly at maximum stability.
Feature Highlights
Slim-Design
Slim 3.5-litre chassis, black
Dimensions: 24 x 20 x 7.2 cm (L/W/H)
Max. operating temp erature: 0~50 °C
Processor
Supports LGA 1151 Skylake or Kaby Lake
processors up to a max. TDP of 65 W [11]
Supports Core i7 / i5 / i3, Pentium, Celeron
Includes heatpipe cooling syst em
Operating
System
No operating syst em supplied
Supports Wind ows 7 / 8.1 / 10, Linux (64-bit)
Win 7 / 8.1 only supported w ith Skylake CPU
Chipset
Intel H270 Chipset
Memory
2x 260-pin SO-DIMM slot
Supports DDR4-2133/2400, max. 2 x 16 GB
Graphics
Integrated Intel HD graphics supports Ultra
HD 4K resolution at 60 fps over DisplayPort
Supports three independent displays
Storage
4x 6.35cm/2.5" bay f or hard disks or SSDs
Serial ATA ports support RAID 0, 1, 5 , 10
M.2-2280 slot supports PCIe X4 and SATA
Connectors
HDMI + DisplayPort + D-Sub/VGA video out
5.1 HD Audio (digital audio via HDMI/DP)
4x USB 3.0, 4x USB 2.0 (each 2 front, 2 rear )
Dual Intel Gigabit LAN (RJ45), COM (RS232)
M.2-2230 slot for optional WLAN module
Optional
Accessories
Vertical stand (PS01), VESA mount (PV02)
WLAN kit (WLN-M)
Power Supply
External 120W / 19V fanless power adapter
Applications
Home, office, vertical market
XPC slim Barebone
XH270
Images for illustration purposes only.
Optional Accessory:
Vertical Stand PS01
50
0
RS232
COM-Port
Page 2
Product Specification
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Page 2 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Connectors and Slots
A A B C D B
L O P Q S T UM
IH G
G
HJ
R
E F
K
N
Front Panel
A
2x USB 3.0 port
B
2x USB 2.0 port
C
Microphone input
D
Headphone output
E
Power on button with LED
F
LED indicator for hard disk activity
Back Panel
G
2x perforation for optional WLAN antenna
H
2x thumbscrew
I
Hole for Kensington Lock
J
2x Gigabit network (RJ45)
K
RS232 serial interface (COM port)
L
DC-Input connector for power adapter
M
DisplayPort Video/Audio output
N
D-Sub/VGA Video output
O
HDMI Video/Audio output
P
Clear CMOS button
Q
2x USB 3.0
R
2x USB 2.0
S
Microphone input
T
Headphones / line-out
U
Audio line-in
A
Q
C
B
L
O
I
H
J
K
E
G
M
D
N
P
F
Mainboard
A
Back panel
B
M.2 2280 Slot
C
Front Audio Header
D
2x USB 2.0 Header
E
4x Serial ATA 6G
F
RS232 COM Port
G
LPC Header
H
4x USB 2.0 Header
I
2x SO-DIMM Slot
J
Connector for Front USB 3.0 Port
K
Always-On-Jumper
L
M.2 2230 Slot
M
CMOS Battery Connector
N
Intel H270 Chipset
O
LGA 1151 CPU Socket
P
Connector for Front Buttons/LEDs
Q
Fan Connector
Page 3
Product Specification
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Page 3 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Appropriate Components
The Shuttle XPC slim Barebone XH270 consists of a stylish case with pre-installed mainboard,
cooling system and external power adapter. Despite its small form factor, it offers outstanding
connectivity, functionality and performance. For a complete Mini-PC system, a few components still
need to be added:
Optional Accessories
Vertical Stand (PS01)
The Shuttle XPC slim Barebone XH270
is to be used in horizontal operation by
default. The optional stand PS01 allows
it to be used in upright position as well.
VESA 75/100 mount (PV02)
The optional VESA mount allows it to be
installed on to walls or to be attached to
the rear side of a monitor.
WLAN-Kit (WLN-M)
Wireless LAN adapter (M.2-2230 card)
with two external antennas supports
IEEE 802.11ac and Bluetooth 4.0
Four 2.5" SATA Drives
Hard Disks or SSDs
Max. height: 9.5 mm
1~2 SO-DIMM
Memory Modules
DDR4-2133/2400
max. 2x 16 GB
M.2 2280/2260/2242 SSD Card
SATA or PCIe x4 Interface
LGA 1151
Processor
max. 65 W
"Skylake" or
"Kaby Lake"
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Product Specification
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© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Comparison of the 3-litre XPC slim Barebones
Barebone Modell
XH110 / XH110V
XH170V
XH110G
XH270
Available since
March 2016
September 2015
August 2017
December 2017
Processor Support
6th/7th Gen. Intel Core Processors, LGA 1151
“Skylake” & “Kaby Lake”, TDP max. 65 W
Operating System
Windows 7, 8.1, 10 & Linux (64-bit)
„Kaby Lake“ CPU does not support Windows 7/8.1
Chipset
Intel H110
Intel H170
Intel H110
Intel H270
RAM (max.)
2x 16 GB DDR3L-1600
SO-DIMM (204-pin)
2x 16 GB DDR4-2133/2400
SO-DIMM (260-pin)
Multi Monitoring
max. 2 Displays
max. 3 Displays
max. 2 Displays
max. 3 Displays
PCIe Slot
− − PCI-Express X16 Slot
−
Storage Bays
1x Slimline DVD/Blu-ray
2x 2,5" drive
1x Slimline DVD/Blu-ray
2x 2,5" drive
1x 2,5" or 3,5" drive
Internal USB-2.0-Stick
4x 2,5" drive
Mini Slots
M.2-2280 (PCIe, SATA)
M.2-2230 (for WLAN)
M.2-2280 (SATA)
Mini-PCIe (for WLAN)
M.2-2280 (PCIe, SATA)
M.2-2230 (for WLAN)
M.2-2280 (PCIe, SATA)
M.2-2230 (for WLAN)
Front Panel
Power-Button, Power-LED, HDD-LED, 2x USB 2.0, 2x USB 3.0, 2x Audio
Back Panel
Connectors
1x HDMI 1.4
1x DisplayPort 1.2
1x HDMI 1.4
2x DisplayPort 1.2
1x HDMI 1.4
1x D-Sub/VGA
1x HDMI 1.4
1x DisplayPort 1.2
1x D-Sub/VGA
2x USB 3.0, 2x USB
2.0
2x USB 3.0, 2x USB
2.0
2x USB 3.0, 2x USB
2.0
2x USB 3.0, 2x USB
2.0
2x GigaBit Intel LAN
1x GigaBit Intel LAN
1x GigaBit Intel LAN
2x GigaBit Intel LAN
2x COM (RS232)
1x COM (RS232)
−
1x COM (RS232)
3x Audio
3x Audio
−
3x Audio
PS/2 Port (Combo)
1x eSATA (3G)
− − Clear CMOS Button
Clear CMOS Button
Clear CMOS Button
Clear CMOS Button
Perforations
2x WLAN Antenna
1x Kensington Lock
1x VGA Adapter
2x WLAN Antenna
1x Kensington Lock
2x WLAN Antenna
1x Kensington Lock
2x WLAN Antenna
1x Kensington Lock
Optional
Accessories
Note: PVG01 and HRS232 cannot be
used simultaneously.
Vertical Stand (PS01)
Vertical Stand (PS01)
Vertical Stand (PS01)
Vertical Stand (PS01)
VESA Mount (PV02)
VESA Mount (PV02)
VESA mount included
VESA Mount (PV02)
WLAN Kit (WLN-M)
WLAN Kit (WLN-S/-P)
WLAN Kit (WLN-M)
WLAN Kit (WLN-M)
3.5“ HDD Rack (PHD4)
3.5“ HDD Rack (PHD4)
−
−
ODD bay cover (MY01)
(for XH110V only)
Cover/Mylar for the
slimline bay (MY01)
−
−
1x COM Port (H-RS232)
1x COM Port (H-RS232)
− − VGA Adapter (PVG01)
− − −
← Front Views →
XH110V (Front doors)
XH110 (with ODD bay)
XH110G, XH270 (w/o ODD)
← Rear Views →
XH110, XH110V
XH170V
XH270
Page 5
Product Specification
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Page 5 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Shuttle XPC slim Barebone XH270 - Specifications
Chassis
Slim 3-litre chassis, colour: black
Dimensions: 240 x 200 x 72 mm (LWH) = 3.5-litre
Weight: 2.2 kg net , 3.5 kg gross
Open fro nt - without covers for front panel connectors
Hole for Kensington Lock on the back panel
Operation position horizontal or even vertical with the optional stand PS01
Operation
System
This system comes without operating system.
It is compatible with Windows 10 / 8.1 / 7 and Linux (64-b it).
Note: Windows 7 and 8.1 is only supported in combination wit h 6th generat ion Intel
Core processors "Skylake".
For an a dditional note on Windows 7, see [3]
Mainboard
Chipset
BIOS
Mainboard FH270, Mini-ITX form factor 17 x 17 cm
Chipset: Intel® H270 Chipset (code name "Union Point")
Platform Controller Hub (PCH) as Single-Chip-Solution
AMI BIOS in 8 Mbit EEPROM with SPI int erface
All capacit ors are high quality solid capacitors
Supports hardware monitoring and watch dog functionality
Supports Unified Extensible Firmware Interface (UEFI)
Supports power on after power failure [1]
Supports Firmware-TPM (fTPM) Version 2.0
Power
Adapter
External 120 W power adapter (fanless)
Input: 100~240 V A C, 50/60 Hz
Output: 19 V DC, max. 6.32 A, max. 120 W output wattage
AC Connector with protective-earth contacts, cable length: 1.7 m
DC Connector: 5.5 / 2.5 mm (outer/inner diameter)
Processor
Support
Socket LGA 1151 (H4) supports
Intel Core i7 / i5 / i3, Pentium and Cel eron processors
- 6th generation, code name "Skylake"
- 7th generation, code name "Kaby Lake" [4 ]
Maximum supported processor power consumption (TDP) = 65 W
14 nm process t echnology, up to 8 MB of L3 cache
Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors
with the older Socket LGA 1150.
Does not support the un lock-function of Intel K-Series processors.
The processor integrates PCI -Express, memory control ler
and the graphics engine on the same die (performance features
depending on processor type)
Please refer to the support list for d etailed pr ocessor support information at
global.shuttl e.com.
Heatpipe
Cooling
Processor cooling with heatpipe technology and two fans (6 cm)
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Product Specification
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Page 6 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Storage Bays
& RAID
Support
This system featur es four dr ive bays
- Supports hard disks or SSDs in 2.5" / 6.35 cm form factor
- Maximum height of the drives: 9 .5 mm
- Interface: SATA III (max. 6 Gbps)
- Includ ed: four combo cables for data and power [8]
- Supports RAID modes 0, 1, 5, 10
Memory
Support
2x SO-DIMM sl ot with 260 pins
Supports DDR4-2133/2400 (PC4-17066/19200) SDRAM at 1.2 V
Supports maximum total size of 32 GB (max. 16 GB per module)
Supports Dual Channel mode
Supports two unbuffered DIMM modules (no ECC)
Integrated
Graphics
The features of the integrated grap hics function
depend on the processor used.
Three video outputs:
support three independent displays simultaneously
(1) DisplayPort 1.2 - supports 1080p/60Hz and 2160p/60Hz
(2) HDMI 1.4 - supports 1080p/60Hz and 2160p/30Hz
(3) D-Sub/VGA
The digital video ports (DisplayPort and HDMI) support Blu-ray (BD) playback w ith H DCP.
These ports transmit HD video plus multi -channel digital audio via a single cable.
Audio
Audio Realtek® ALC 662 5.1-channel High-Definition Aud io
Three analog audio connectors (3.5 mm) at the back p anel:
(1) Front line-out ( headphones)
(2) Rear Surround line-out (shar ed with microphone input)
(3) Center line-out (shar ed with line -in)
Digita l audio output is provided by HDMI and DisplayPort
Dual LAN
Controller
Dual network with two RJ45 ports
Used network chips: 2x Intel i211 Ethernet Controller wit h MAC, PHY and PCIe interface
Supports 10 / 100 / 1.000 MB it/s operation
Supports WAKE ON LAN (WOL)
Supports network boot by Preboot eXecution Envir onment (PX E)
Supports Team ing mode [5]
M.2-2280 Slot
The M.2 2280 BM slot provides the following interfaces:
- PCI-Express Gen. 3.0 X4 (max. 32 Gbps), supports NVMe
- SATA v3.0 (max. 6 Gbps)
It supports M.2 cards with a width of 22 mm
and a length of 42 , 60 or 80 mm (type 2242, 2260, 2280).
Supports M.2 SSDs with SATA or PCI-Express interface
Intel®
Opt ane™
Ready
The XH270 sup ports I ntel® Optane™ Technology
which accelerates the speed of one hard dis k through data caching.
This requires a 7th gen. Intel Core processor ("Kaby L ake")
and an Optane-SSD with 3D-Xpoint memory (e.g. in M.2 form at).
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Product Specification
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Page 7 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
M.2-2230 Slot
M.2-2230 slot for WLAN cards
Interfaces: PCI-Expr ess Gen. 2 .0 X1 und USB 2.0
Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
Supports WLAN extension cards (optional Shuttle accessory WLN-M [7])
Front Panel
Connectors
Front Panel connectors
Microphone input
Audio Line-out (headphones)
2x USB 3.0
2x USB 2.0
Power button
Power LED (blue)
HDD LED (yellow)
Back Panel
Connectors
1x Dis playPort 1.2 - digital Audio/Video output
1x HDMI 1.4 - digital Audio/Video output
1x D-Sub/VGA - analog Video output
2x USB 3.0
2x USB 2.0
2x GigaBit LAN (RJ45)
1x Serial COM port (RS232)
Audio Line-in
Audio Line-out
Audio Mic-in
Clear CMOS Button
Perforation for Wireless LAN antennas (2 holes)
Hole for Kensington Lock
Other
Onboard
Connectors
Power-on-after-power-fail (hardwar e sol ution, Jumper 4 ) [1]
Front connectors f or power button , LEDs, USBs, audio ports
Three headers 2x 5-pin for dual USB 2.0 (one occupied)
One 4-pin fan connector (occupied by the CPU cooling system)
LPC interface (2x 10-pin header, 2 mm pitch)
Supplied
Accessories
Multi-languag e installation guide (EN, DE, FR, ES, JP, KR, SC, TC)
Driver DVD
4x Combo SATA/power cable for 2.5" drives
External power adapter with 1.7 m AC power cord (wit h protective-earth contacts)
Protector cap for the CPU socket (do not use , if heatpipe or fan is mounted)
CPU heatpipe cooling system with heatsink compound
Bag with screws
Optional
Accessories
(1) Vertical stand (PS01)
(2) VESA mount (PV02)
(3) WLAN module (WLN-M) [7]
Environmental
Specifications
Operating temperature range: 0~50 °C [6]
Relative humidity range: 10~90 % (non-condensing)
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Product Specification
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© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Conformity
and
Certifications
EMI: FCC, CE, BSMI, C-Tick
Safety: CB, BSMI, ETL
Others: RoHS, Energy Star V5.0, EuP Lot 6
This device is classed as a techn ical information
equipment (ITE) in class B and is intended for use in
living room and office. The CE -mark approves the
conformity by the EU-guid elines:
- EMV-guideline 89/336/EW G electromagnet ic to lerance
- L VD-guideline 73/23/EWG use of electric devices
within certain voltage-limits
Notes:
[1] Power-on-after-power-fail:
The BIOS setup provides a "Power-on-after-power-fail" function that can be found under "Pow er Management
Configuration ". As the name indicates, this function determi nes the PC's behaviour after power failure: (1)
unconditional power on, (2) restore former status or (3) keep system turned off. As a matter of the nature of this
function, it may fail after short power failures. This is why the XH270 also comes with a hardware-based solution. By
removing Jumper 4 (on the mainboard near th e "Shuttle" printing), the system will start unconditionally once power
is supplied.
[2] How to convert DisplayP ort into HDMI/DVI
The DisplayPort output can be con verted to HDMI or DVI by an additional, passive adapter cable. For example:
DELOCK 82590: 1 m, Displa yPort (male, 20p) to HDMI -A (male, 19p)
DELOCK 82435: 5 m, Displa yPort (male, 20p) to DVI-D (male, 24p)
The integrated graphics automatically detects the connected display and puts out the appropriate electric signal either DisplayPort (without an adapter) or HDMI/DVI (with an adapter).
However, a monitor with a DisplayPort connector cannot be connected to the HDMI port with a simple, passive
adapter.
[3] Installation of Windows 7
Intel® 100 chipset series has been removed s upport for the Enhanced Host Controller Interface (EHCI) which is the
driver software for the USB 2.0 ports. The new chipset only supports the updated Extensible Host Controller Interface
(xHCI for USB 3.0) which is not supported by the original Windows 7 installat ion disk. This means, that perip heral
devices connected over USB (like keyboard, mouse and external optical drive) do not work during Windows 7
installation. Therefore please add the required USB 3.0 drivers to the Windows 7 installation files manually. This
procedure is explained in the Shuttle FAQ section at faq.shuttle.eu.
[4] Use of Kaby Lake processor
If a Kab y Lake processor is used, this XPC will only support Windows 10 and Linux operating systems. Windows 7
and 8.1 will no longer be supported.
[5] Teaming Mode
The teaming function allows you to group both availab le network a d apters together to function as one single
adapter. The benefit of this appr oach is that it enables load balancing and failover.
Driver download: https://downloadcenter.intel.com/download/21642
[6] High ambient t emperature
For high ambient t emperature s over 40 °C we strongly recommend to use SSDs inst ead of hard disk drives.
[7] Opti onal Wireless LAN module:
This Shuttle XPC slim Barebone supports the optional Shuttle XPC Acces sory WLN -M which consists of a M.2-2230
card w ith IEEE 802.11ac and BT4.0 functionality and two external antennas with appropriate antenna cables.
[8] Power connector for SATA drives
The supplied power cables for SATA drives provid e a voltag e of 5 V. In very rare cases a 2.5" hard disk also requires
a 12 V line, which is n ot supported (e.g. S eagat e Constellation® series).
Page 9
Product Specification
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Page 9 | 13 Novembe r 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
6th Generation Intel Core Desktop Processor Family
Socket LGA 1151 14 nm “Skylake-S” processor overview
Processors with a TDP>65 W are not supported (marked in red)
Name
Model
Cores/
Threads
CPU
Clock
Turbo
Clock
Cache
TDP
Graphics
Engine
Graphics
Clock
Core i7
6700K
4 / 8
4.0 GHz
4.2 GHz
8 MB
91 W
HD 530
350~1150 MHz
6700
4 / 8
3.4 GHz
4.0 GHz
8 MB
65 W
HD 530
350~1150 MHz
6700T
4 / 8
2.8 GHz
3.6 GHz
8 MB
35 W
HD 530
350~1100 MHz
Core i5
6600K
4 / 4
3.5 GHz
3.9 GHz
6 MB
91 W
HD 530
350~1150 MHz
6600
4 / 4
3.3 GHz
3.9 GHz
6 MB
65 W
HD 530
350~1150 MHz
6600T
4 / 4
2.7 GHz
3.5 GHz
6 MB
35 W
HD 530
350~1100 MHz
6500
4 / 4
3.2 GHz
3.6 GHz
6 MB
65 W
HD 530
350~1150 MHz
6500T
4 / 4
2.5 GHz
3.1 GHz
6 MB
35 W
HD 530
350~1100 MHz
6400
4 / 4
2.7 GHz
3.3 GHz
6 MB
65 W
HD 530
350~1150 MHz
6400T
4 / 4
2.2 GHz
2.8 GHz
6 MB
35 W
HD 530
350~1100 MHz
Core i3
6320
2 / 4
3.9 GHz
−
4 MB
65 W
HD 530
350~1150 MHz
6300
2 / 4
3.8 GHz
−
4 MB
65 W
HD 530
350~1150 MHz
6300T
2 / 4
3.3 GHz
−
4 MB
35 W
HD 530
350~1100 MHz
6100
2 / 4
3.7 GHz
−
4 MB
65 W
HD 530
350~1150 MHz
6100T
2 / 4
3.2 GHz
−
4 MB
35 W
HD 530
350~1100 MHz
Pentium
G4520
2 / 2
3.6 GHz
−
3 MB
51 W
HD 530
350~1150 MHz
G4500
2 / 2
3.5 GHz
−
3 MB
51 W
HD 530
350~1150 MHz
G4500T
2 / 2
3.0 GHz
−
3 MB
35 W
HD 530
350~1100 MHz
G4400
2 / 2
3.3 GHz
−
3 MB
51 W
HD 530
350~1150 MHz
G4400T
2 / 2
2.9 GHz
−
3 MB
35 W
HD 530
350~1100 MHz
Celeron
G3920
2 / 2
2.9 GHz
−
2 MB
51 W
HD 530
350~1050 MHz
G3900
2 / 2
2.8 GHz
−
2 MB
51 W
HD 530
350~1050 MHz
G3900T
2 / 2
2.6 GHz
−
2 MB
35 W
HD 530
350~950 MHz
K = unlocked clock multiplier, T = Power optimized lifestyle, TDP = Thermal Design Power (max. power consumption)
Note: The Shuttle XPC slim Barebone XH270 does not support the unlock-function of Intel K-Series processors.
Please refer to the support list for detailed processor support information at global.shuttle.com.
Page 10
Product Specification
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Fa x + 4 9 ( 0) 41 21- 47 69 00
sa les @sh ut tle .eu
Page 10 | 13 November
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
7th Generation Intel Core Desktop Processor Family
Socket LGA 1151 14 nm “Kaby Lake-S” processor overview
Processors with a TDP>65 W are not supported (marked in red)
Name
Model
Cores/
Threads
CPU
Clock
Turbo
Clock
Cache
TDP
Graphics
Engine
Graphics
Clock
Core i7
7700K
4 / 8
4.2 GHz
4.5 GHz
8 MB
91 W
HD 630
350~1150 MHz
7700
4 / 8
3.6 GHz
4.2 GHz
8 MB
65 W
HD 630
350~1150 MHz
7700T
4 / 8
2.9 GHz
3.8 GHz
8 MB
35 W
HD 630
350~1150 MHz
Core i5
7600K
4 / 4
3.8 GHz
4.2 GHz
6 MB
91 W
HD 630
350~1150 MHz
7600
4 / 4
3.5 GHz
4.1 GHz
6 MB
65 W
HD 630
350~1150 MHz
7600T
4 / 4
2.8 GHz
3.7 GHz
6 MB
35 W
HD 630
350~1100 MHz
7500
4 / 4
3.4 GHz
3.8 GHz
6 MB
65 W
HD 630
350~1100 MHz
7500T
4 / 4
2.7 GHz
3.3 GHz
6 MB
35 W
HD 630
350~1100 MHz
7400
4 / 4
3.0 GHz
3.5 GHz
6 MB
65 W
HD 630
350~1000 MHz
7400T
4 / 4
2.4 GHz
3.0 GHz
6 MB
35 W
HD 630
350~1000 MHz
Core i3
7350K
2 / 4
4.2 GHz
−
4 MB
60 W
HD 630
350~1050 MHz
7320
2 / 4
4.1 GHz
−
4 MB
51 W
HD 630
350~1050 MHz
7300
2 / 4
4.0 GHz
−
4 MB
51 W
HD 630
350~1050 MHz
7300T
2 / 4
3.5 GHz
−
4 MB
35 W
HD 630
350~1100 MHz
7101E
2 / 4
3.9 GHz
−
3 MB
54 W
HD 610
350~1100 MHz
7101TE
2 / 4
3.4 GHz
−
3 MB
35 W
HD 610
350~1100 MHz
7100
2 / 4
3.9 GHz
−
3 MB
51 W
HD 630
350~1100 MHz
7100T
2 / 4
3.4 GHz
−
3 MB
35 W
HD 630
350~1100 MHz
Pentium
G4620
2 / 4
3.7 GHz
−
3 MB
51 W
HD 630
350~1100 MHz
G4600
2 / 4
3.6 GHz
−
3 MB
51 W
HD 630
350~1100 MHz
G4600T
2 / 4
3.0 GHz
−
3 MB
35 W
HD 630
350~1050 MHz
G4560
2 / 4
3.5 GHz
−
3 MB
54 W
HD 610
350~1050 MHz
G4560T
2 / 4
2.9 GHz
−
3 MB
35 W
HD 610
350~1050 MHz
Celeron
G3950
2 / 2
3.0 GHz
−
2 MB
51 W
HD 610
350~1050 MHz
G3930
2 / 2
2.9 GHz
−
2 MB
51 W
HD 610
350~1050 MHz
G3930T
2 / 2
2.7 GHz
−
2 MB
35 W
HD 610
350~1000 MHz
K = unlocked clock multiplier, T = Power optimized lifestyle, TDP = Thermal Design Power (max. power consumption)
Note: The Shuttle XPC slim Barebone XH270 does not support the unlock-function of Intel K-Series processors.
Please refer to the support list for detailed processor support information at global.shuttle.com.
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