Shuttle SH170R6 User Manual

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Product Specifications
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
sales@shuttle.eu
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Shuttle Mini PC with heatpipe cooling
for LGA1151 "Skylake" processors
The Shuttle XPC Barebone SH170R6 packs the 6th Generation of Intel
Core desktop processors for LGA1151 socket into an elegant, fresh
case design. The aluminium case cover with a black-brushed surface
has a volume of 14 litre which is just a third of the volume of a
standard Midi tower. Despite its small dimensions, it is brimming with
features. Set up a top-performer with the latest LGA1151 "Skylake"
processor, a dual-slot PCI Express graphics card, M.2-SSD, two 6 TB
hard disks in RAID mode and 32 GB of DDR4 memory, plus Blu-ray
drive. However, also cost-effective configurations without dedicated
graphics cards are possible, since Intel's Skylake generation offers an
amazing inbuilt CPU and graphics performance with low energy
consumption.
Feature Highlights
R6 Chassis
Black aluminium chassis (14.2 litre)
Bays: 1x 5.25“, 2x 3.5“ (1x external)
CPU
Supports 6th Gen. Intel® Core™ Processors
Codename “Skylake”, Socket LGA1151
Supports Core i3, i5, i7, Pentium, Celeron
Shuttle I.C.E. heatpipe cooling system
Operating
System
An operating system is not included
Supports Windows 7/8.1/10, Linux - 64 bit
Slots
1x PCIe x16 (v3.0) supports dual-slot
PCI-Express X16 graphics cards
1x PCIe x4 (v3.0)
1x M.2 2280 supports PCIe 3.0 x4 & SATA 3
1x Mini-PCIe Half-Size, supports WLAN
Chipset
Intel H170 PCH
Integrated
Graphics
Supports three Full HD displays at once
Supports one UHD display (with Core CPU)
Memory
Supports 4x DDR4-2133, max. 64 GB
Drive
Connectors
4x SATA 3.0 (6Gb/s) supports RAID and RST
1x eSATA, 1x M.2 SSD slot
Other
Connectors
Video: HDMI 1.4 and 2x DisplayPort 1.2
Audio: 7.1-ch Line-out, Line-in, Microphone
GigaBit LAN (RJ45)
8x USB 3.0, 2x USB 2.0, 1x External SATA
Optional
COM-Port, Wireless LAN and 2.5” bay
PSU
300 Watt power supply (80 PLUS Bronze)
XPC cube
B
arebone
SH170R6
Images for illustration purposes only.
6
th
.Gen.
Intel Core
4x DDR4
max. 64GB
M.2
2280
Triple
Display
Heat-pipe
Cooling System
Product Specifications
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
sales@shuttle.eu
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Shuttle XPC cube Barebone SH170R6 – Connectors
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Eject button (optical drive)
5.25“ bay (optical drive)
3.5“ bay
Hard disk LED indicator
Power LED indicator
Power button
2x USB 3.0 port
USB 2.0 port
Microphone input
Headphone output
USB 2.0 fast-charge port
A
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G
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Power supply
Power supply fan
AC power connector
Perforation for optional
WLAN module
Three thumbscrews
Heatpipe cooling system
Hole for Kensington Lock
COM / RS232 (optional)
2x DisplayPort output
HDMI output
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6x USB 3.0
External Serial-ATA
Gigabit LAN (RJ45)
Clear-CMOS-Button
Audio Line-in
Audio Surround Front
Audio Center/Bass
Audio Surround Rear
Audio Surround Side
PCI-Express X16 slot
PCI-Express X4 slot
Front
view
Rear
view
Product Specifications
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
sales@shuttle.eu
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Shuttle XPC cube Barebone SH170R6 – Mainboard
Back Panel
C
onnectors
PCIe X16 Slot
Intel H170 Chipset
CMOS Battery
LGA1151
CPU Socket
ATX Power (4 Pins)
4x DIMM Socket
supports DDR4-213
3
A
TX Power (20 Pins)
4x Serial-ATA 3.0
Solid Capacitors
Front Audio Header
Mini-PCIe Slot Half-Size
Fr
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LED-An
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hl
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M.2 / 2280 Slot
COM Port (RS232)
LPC Header
Front USB 2.0 Header
PCIe X4 Slot
Front USB 3.0 Header
USB 2.0 Header
Power FET
Heatsink
FAN2 Connector
Product Specifications
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
sales@shuttle.eu
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Handels GmbH
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Shuttle XPC cube Barebone SH170R6 – Product Features
The R6 chassis design: a clean and modern look
R6 is Shuttle’s chassis design for the high-end series XPCs. Shuttle has
always placed great emphasis on the interior and exterior aesthetics of
the XPC cubes with the belief that a good blend of style and form
factor will enable it to be attractive, versatile, and work well in almost
any environment. The case cover is made of aluminium, while the
drives and front panel connectors are elegantly hidden by drive doors
for superior style and visual appeal.
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14.2 L
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Small, but easy to install
Shuttle XPC cubes offer the performance of a desktop PC at a third of
the size while using standard desktop components. Shuttle keeps the
concept of being "futureproof" in mind when designing the new R6
chassis. The meticulously designed internal layout already comes with
cables fitted to reduce clutter, increase airflow and make the
installation of components easy.
What is a Barebone?
The Shuttle XPC cube Barebone SH170R6 consists of a stylish case with
pre-installed mainboard, power supply unit (PSU) and cables. Despite
its small form factor, it offers outstanding connectivity, functionality
and performance. For a full PC system, a processor, memory, mass
storage and operating system need to be added. Shuttle XPC cube
Barebones are completely customisable meaning users can pick
certain components on their own to ideally match their individual
needs.
Supports Intel 14nm Skylake Processors
Skylake is the codename for Intel's 6
th
Generation of Intel Core
Processors introduced in 2015 along with the 100-Series chipsets. The
Shuttle XPC cube Barebone SH170R6 supports the desktop version with
socket LGA1151, while the previous generation (code name “Haswell”,
LGA1150) is not compatible.
Integrated Cooling Engine (I.C.E.)
Shuttle XPC cubes offer the performance of a desktop PC at a third of
the size. In order to ensure proper airflow inside such a small case,
more advanced cooling technologies have been developed and
implemented. Shuttle's industry-leading I.C.E. heatpipe technology
delivers efficient cooling and is exceptionally quiet.
Product Specifications
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
sales@shuttle.eu
Pa
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Handels GmbH
(
Ge
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Processor
Integrated
Graphics
4
x
DDR4
-
2133
PCI-Express
V3.0
PCIe x4
USB 3.0/2.0
SATA 6G
Gigabit LAN
7.1 HD-Audi
o
HDMI + 2xDP
Intel H170
Chipset
M.2/Mini-PCIe
Single-Chip Chipset: Intel H170
The Shuttle XPC cube Barebone SH170R6 sports Intel's H170 Platform
Controller Hub (PCH) which is part of the 100 Series "Sunrise Point"
chipset. The H170 chipset consists of a single chip and integrates the
hard drive controller, network controller, firmware interface, PCIe links,
USB and other connectors.
Supports up to 64 GB DDR4 memory
The Shuttle XPC cube Barebone SH170R6 supports up to 64 GB of DDR4-
2133 memory which is ideal for workstations powered by 64-bit
operating systems, so users take full advantage of high-performance
configurations. Compatible memory comes in 288-pin DIMM modules
at 1.2V operating voltage, while the predecessor is 244-pin at 1.5V
operating voltage. ForDDR3L it is 1.35V.
Two Mini-Slots: Mini PCI-Express and M.2
The Half-Size Mini-PCI-Express slot is intended for Wireless LAN adapter
cards (e.g. the Shuttle Accessory WLN-C) as shown in the picture on the
right.
The M.2 slot (type 2280) is fully-equipped with 4X PCI-Express v3.0 lanes
and SATA 3.0 interfaces. Modern M.2 SSDs with PCI Express interface
(PCIe) provide a significant higher bandwith compared to the usual
SATA standard. Type 2280 means it supports the usual M.2 cards with a
width of 22mm and a length of 80mm, but also 2242 and 2260
standard cards are supported.
80 PLUS BRONZE certified 300W Power Supply
The Shuttle XPC cube Barebone SH170R6 is equipped with a rock-
stable built-in 300W power supply which was tested with the latest
graphics cards and powerful Core i3/i5/i7 processors. Its 80 Plus Bronze
logo indicates that it provides more than 82/85/82% of energy
efficiency at 20/50/100% of rated load. This means a reduction of
energy consumption while increasing the computer’s reliability.
8x USB 3.0
The Shuttle XPC cube Barebone SH170R6 sports eight USB 3.0 ports (2x
front, 6x rear) besides two USB 2.0 ports. USB 3.0 achieves a maximum
data transfer rate of up to 5.0Gbps (640MBytes/sec) which is ten times
faster than USB 2.0. USB 3.0 is fully downward compatible to USB 2.0.
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