Shuttle DQ170 User Manual

Product Specifications
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Images for ill
ustration
only.
50°C
Robust and powerful Slim PC to support Intel® vPro Technology
The
Shuttle XPC sl im Barebone DQ170 is a robust 1.3l Ba rebone PC for
Intel® LGA 1151 deskto p proces sors, codenamed "Skylake ". It allows for three d isplays to be operated at the same time and offe rs Dual Intel LAN a nd COM ports. Its slim metal chassis comes with a V ESA mount included, provides ve rsa tile connectivity and reliable o peration in environments with ambient temperatu res of up to 50 °C. Its Q170 chipset brings Inte l® vPro support. This platform is targeted at professional applic ations such as D igital S ignage, office and indus try.
Feature Highlights
Slim 1.3 litre metal chassis, bla ck
Slim Design
Operating
System
Processor
190 x 165 x 43 mm (LWH)
Op erating temperature: 0~50°C
Including VESA mount (75/100 mm)
An operating system is not included
Supports Windows 7/8.1/10, Linux -
64-bit only
Supports LGA 1151 “Skylake” processors
up to a max. TDP of 65 W
Supports Core i7 / i5 / i3, Pentium, Celeron
Heatpipe coolin g system with two fans
XPC slim Barebone
DQ 170
Chipset
Memory
Graphics
Storage
Bays
Other
Connectors
Power Supply
Intel Q170 Chipset
Supports Intel vPro in combination with
appropriate processors and so ftware
Hardware TPM v2 .0 chip onboard
2x 204-pin SO-DIMM slots
Supports DDR3L-1600 (1.35V), max. 2x16GB
Integrated Intel HD graphics, 4K support [4]
(features depend on processor)
HDMI, 2x Displa yPort ,
Supports three indep endent d isplays [3]
1x 2.5” bay for SATA hard disk or SSD
Two Mini expansion slots:
1x M.2 2260 BM slot (PCIe x4, SATA) 1x Half-Siz e Mini-PCIe for optional WLAN [6]
SD card reader, 2x a udio (line out, mi c)
4x USB 3.0, 4x USB 2 .0, 2x USB 2.0 onboard
2x Intel Gigabit LAN (RJ45), supports WOL
2x COM port (RS232 + RS232/RS422/RS485)
Connector for external power button
“Always on” Jumper onboard
External 90 W fanless power adapter
opt ional
VGA [5]
Processor, memory, storage and
operating system not included.
Applications
Digital Signage, POS , control device, etc.
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Product Specifications
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Front view
Right side
Shuttle XPC slim Barebone DQ170 – Front and Back Panel
1 Microphone input 2 Headphone output 3 Power LED 4 Har d disk LED 5 Power Button 6 SD Card Reader 7 2x USB 3.0 8 2x USB 2.0
A
Rear view
Front
Left side
Rear
Rear
Front
2x W LAN perforation
B Ventilation grille C COM 1 supports RS232
(or optional VGA port for analog displays [5])
D COM 2 supports
RS232/RS422/RS485
E DC power i nput F HDMI video output G 2x DisplayPort ( DP) video
out puts
H 2x RJ45 Gigabit LAN
Not e: only the LAN port supports the Intel vPro
I 2x USB 3.0
J 2x USB 2.0
K Connector for external
power button, Cl ear CMOS and 5V DC voltage (four pins, 2.54 mm pitch)
L 2x hole for Kensington
Lock
M VESA mount (two parts)
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COM port Pin 9 Configuration
Pin 9 is a multi-functional signal. Based on jumper JP1 configu­ration on the mainboard, it can be configured as Ri ng Indicator (RI) or external power supply with either 5V or 12V voltage level (each COM port s eparately).
Shuttl e C o m p u t er H an d e l s GmbH
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H
L
M
N
O
P
I
G
K
J
A
Front Panel
J
Mini-PCIe Slot (Half-Size)
B
Always Power
-
On Jumper
K
COM
1 /
COM
2 Pin 9
C
onfiguration
C
Fan Connector
L
COM
1 /
COM
2 S
erial
Ports
D
LGA 1151
Processo
r Socket
M
Debug
Interface
E
VGA Connector
N
USB 2.0 Header
F
Intel
Q170
Chips
et
O
M.2 226
0
Slot
G
SATA 3.0 (6 Gbps)
Connector
P
Batter
y Connector
H
SATA Power Connector
Q
Back Panel
I
SO-DIMM
Socke
t for DDR3L
Memory
Shuttle XPC slim Barebone DQ170 – Mainboard
A
B C
D
E
F
Q
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Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
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2.5” S
ATA hard disk
Up to two DDR3
L-1600
Windows / Linux
LGA 1151
“Sk ylake”
processor
Optional:
Optional:
Optional:
VGA port Accessory PVG01
Shuttle XPC slim Barebone DQ170 – Required Components
The following components need to be added to make it a fully-configured Mini PC
TDP max. 65 W Core i7 / i5 / i3, Pentium or Celeron
SO-DIMM memory modules max. 16 GB each
WLAN-Accessory WLN-S or WLN-P
or Solid State Disk (SSD) (max. height: 12.7 mm)
Operating System, 64-bit only
M.2 2260/2242 SSD storage
Installing the PVG01 means one serial port (COM) less can be used at the backpanel.
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Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
Te l. +4 9 ( 0) 412 1- 4 7 68 60 Fa x +49 (0 ) 4 121 -47 69 00 sa les@ shu tt le .eu
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Connectivity / Applications
The Shuttle XPC slim Barebone DQ170's wealth of ports makes it well-suited for a wide field of applications and external devices.
The DQ170 is your powerful 1.3-litre slim PC solution for particularly:
Digital Signage operating up to three displays simultaneously
In-store Audio/Video entertainment
Gambling
Home-Media
Office
Call Center
Education
Kiosk
Point of Sales (POS)
Medical
Automation
Small Server
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Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
Te l. +4 9 ( 0) 412 1- 4 7 68 60 Fa x +49 (0 ) 4 121 -47 69 00 sa les@ shu tt le .eu
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43 mm
1.3 L
Robust, stylish and particularly small
Triple Displ
ay with HDMI and 2x DisplayPort
(optional VGA)
190 mm
Shuttle XPC slim Barebone DQ170 – Product Features
You should have held it in your own hands to see how small it actually is. Barely measuring a volume of 1.35 litr es, its steel chassis gives it the appropriate stability required for professional applications in d igital signage. Despite its dimensions of 19 x 16.5 x 4.3 cm (LWH), the overa ll system performance is very hi gh thanks to support of Intel Core desktop
165 mm
processors. The interior of t he DQ170 is very tidy too so that it won't take long to set it up. Its sleek and stylish looks lets it easily find a place in both hom e and office environments.
Low noise thanks to heatpipe cooling system
An active dual-fan heatpipe cooling system ensures w hisper-quiet operation and system stability.
Extended temperature range and reliability
The DQ170 is outstanding ly robust thanks to its rugged chassis. With an ambient temperature range from 0-50 °C it is suitable for us e in most demanding environments. Solel y designed with al l solid capacitors, the DQ170 is guaranteed to deliver maximum stability, reliabilit y and longer syst em lifetime for long-term applications like digital signage.
Caution: recomm end to use SSDs (supporting at least 70 °C) and rugged SO­DIMM memory with a wide temperatur e tolerance ( up to 95 °C).
The DQ170 f eatures three digital video outputs: HDMI and 2x DisplayPort. This multi-monitoring technology offers multiple d isplay support on up to three s eparate monit ors. This helps improve on productivit y by allowing for spreading multiple windows across three monitors while working w ith them simultaneously. Furthermore, the DQ170 supports an optional D-Sub/VGA port.
for high ambient temperatures o ver 40 °C we strongly
Supports 4K Ultra HD at 60Hz
The DQ170 s upports displays running at 4K (3840 x 2160 / 2160p) high resolution at 60 Hz frames per second when connected to its DisplayPort video outputs. Being the successor to the Full HD standard, Ultra HD delivers a four times higher resolution with a wider colour space and colour depth.
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Shuttl e C o m p u t er H an d e l s GmbH
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Supports
Intel vPro Technology
Intel® vPro™ Technology allows IT organisations to remotely manage corporate PCs, even when they are pow ered off or with non-functional operating systems. It features Intel® Active Management Technology and offers a lig hter-weight form of virtualisation to audit all Intel® AMT­based platforms in a networked environment. PCs with Intel® vPro™ Technology allow IT departments to remotely retrieve assets and hardware/software inventories , contain security threats, resolve system problems, a nd in crease the uptime of desktops with lower maintenance costs. Note: Intel vPro requires an Intel® Core™ vPro™ processor and appropriate software.
Two Mini-Slots: Mini PCI-Express and M.2
The
Half-Size M ini-P CI-Express slot cards (e.g. the Shuttle Accessory WLN-S or WLN-P) as shown in the pictur e on the right.
The
M.2 slot (t ype 2260) lanes, SATA 3.0 und USB 2.0 interfaces. Modern M.2 SSDs with PCI Express interface (PCIe) provide a significant higher bandwith as compared to the usual SA TA standard. Type 2260 means it supports the usual M.2 cards with a w idth of 22 mm and a length of 60 mm, but also 2230 and 2242 standard cards are supported .
is fully-equipped with 4X PCI-Express v3.0
is intended for Wireless LAN adapter
VESA mount
The supplied 75 / 100 mm VESA mount allows for installation on to walls or monitors which is particul arly inter esting for the ind ustry segment, company buildings and public institut ions. Other than this, the chassis bears numerous threaded holes (M3) enabling it to be fitted alm ost anywhere.
Kensington Lock
This is a small, metal-reinforced hole as part of an anti-theft system. The DQ170 provides an appropriate hole on both side of its chassis. The lock and cable are not includ ed.
w w w . s h u t t l e . e u
Shuttl e C o m p u t er H an d e l s GmbH
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(4) Power Button
Power on after Power fail
External power button by separate remote line
If because of space constraints (e.g. in case of fixed installation), the machine cannot be switched on by pressing the front power button, it can be powered on by a separate remote line. You will f ind an appropriate four-pin-connector at the back panel of the DQ170 (pitch
2.54 mm). Furthermore, this connector provides a Clear CMOS function and +5V DC voltage supply for external devices.
+5V voltage (2)
Clear CMOS (1)
(3) Ground
- Front Panel ­The BIOS setup provides a "Power-On after Power Fail" function that can
be found under "Power Ma nagement Configuration". As the name indicates, this function determines the PC's behaviour after power failure: (1) unc ondition al power on, (2) restore former status (3) k eep system turned off (4) Power-On by LAN or (5) Power-On by Rea l-Time­Clock. As a matter of the nature of this function, it may fail after short power failures. This is why the DQ170 also comes with a hardware­based solut ion. By removing Jumper JP2 (see image) the system will start unconditionally once power is applied.
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Shuttl e C o m p u t er H an d e l s GmbH
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Availability
Chassis
Processor
Chipset
Intel H110
Intel H110
Intel H170
Intel
Q
170
Operation
Firmware
-
Hardware
-
Multi
-
Displa y
Memory
260-p
in
204-p
in
Audio
Single LAN
Dual LAN
Dual LAN
Drive Ba ys
SATA
SATA/PCIe
SATA/PCIe
2x Dis playPort
Accessories
VESA mount
VESA mount
Optional
Operation
Product Comparison
DH110SE DH110 DH170 DQ170
from Q3’16 from March’16 from Oct’15 from Sept’16
1.35L, 19 x 16.5 x 4.3 cm
Support
System Support
Socket LGA1151, Skylake, TDP max. 65W
Windows 7, 8.1, 10 and Linux (64-bit only)
TPM-Support Firmware-TPM (optional) Firmware-TPM (optional)
Support
UHD Support
Support
2 Displays 2 Displays 3 Displays
HDMI: 2160p/30 DisplayPort: 2160p/60
2x SO-DIMM ( max. 2x 16 GB DDR4-2133
)
2x SO-DIMM (
)
max. 2x 16 GB DDR3L-1600
Realtek ALC662
Network
Realtek RTL8111G
Intel i211 + Intel i219LM
1x 2.5” / 12.5mm SATA
Mini-Slots
Front Panel
Back Panel
1x M.2-2260 1x M.2-2230 supports WLAN
Power button, Power LED, HDD LED SD card reader, Head-phones, Microphone, 2x USB 3.0, 2x USB 2.0
HDMI, DisplayPort
4x USB 2.0 1x Gigabit LAN (Realtek)
2x Kensington Lock 2x WLAN antenna (opt.) External power button (opt.)
1x M.2-2260 1x M.2-2230 supports WLAN
HDMI, DisplayPort
2x USB 3.0 1x USB2.0/eSATA Combo 1x PS/2 Combo 2x Gigabit LAN (Intel) RS232 + RS232/422/485
2x Kensington Lock 2x WLAN antenna (opt.) External power button (opt.)
-/-
WLAN kit (W LN-M) D-Sub VGA port (PVG01)
Accessories
WLAN kit (W LN-M)
TPM (opt.)
TPM Chip
Intel i211 + Intel i219LM
1x M.2-2260 1x Mini-PCIe Half Size
HDMI, 2x USB 3.0, 2x USB 2.0
2x Gigabit LAN (Intel) RS232 + RS232/422/485
2x Kensington Lock 2x WLAN antenna (opt.) External power button (opt.)
WLAN kit (W LN-S, W LN-P) D-Sub VGA port (PVG01)
Temperature
Pow er Adapter
max. 50 °C max. 50 °C max. 50 °C
90 W / 19 V
Front View
Rear View
w w w . s h u t t l e . e u
90 W / 19 V (also supports 84 W / 12 V power adapters)
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90 W / 19 V
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Nettop PC with black chassis made of metal
1x 6.35 cm / 2.5 " storage bay supports one hard disk or SSD drive
This system comes without operating system.
Chipset: Intel®
Q170
Chipset
Intel® vPro™ is a brand name for a specific set of management and securit y
Equipped with a Trusted Platform Module (TPM)
External 90 W power adapter (fanless)
Shuttle XPC slim Barebone DQ170 - Specifications
Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-litre
Chassis
Weight: 1.3 kg net and 2.1 kg gross Two holes for Kensington Locks and numerous threaded holes (M3) on b oth s ides of the chassis
Storage Bay
Operation
System
Mainboard
Chipset
BIOS
Supports
Intel® vPro™
and AMT
Device heig ht: 12.5 mm (max.)
It is compatible with Windows 10, 8.1, 8, 7 and Linux – 64 bit only For Windows 7 Installation see notes here [11]
(Intel® GL82Q170 PCH, code name "Sunrise Point") Platform Controller Hub (PCH) as Single-Chip-Solution AMI BIOS in 8 Mbit EEPROM with SPI interfa ce All capacit ors are high-quality solid capacitors Supports hardwar e monitoring and watch dog functionality Supports Unified Extensible F irmware Interface (UEFI) Supports power on after power failure [8]
technologies. Intel® Act ive Management Technology (AMT) is a subset of Intel vPro. This technology allows remote management of PCs , even in power-off m ode or with n on­functional operating systems. You can audit, repair and restore AMT-based platforms in a LAN. These fun ctions can increas e the uptime of desktops with lower maintenance costs. Note: Intel vPro requires an Intel® Core™ vPro™ processor (e.g. Core i7-6700/T, Core i5­6600/T, Core i5-6500/T) and appr opriate software.
TPM Module
Power
Adapter
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TPM v2.0 chip: Nuvoton NPCT650AAAWX
Input: 100~240 V AC, 50 / 60 Hz Output: 19 V DC, 4.74 A, max. 90 W DC Connector: 5.5 / 2.5mm (outer/inner diameter)
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Product Specifications
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Processor
Socket LGA 1151 (H4) supports the sixth generation of
Processor
2x SO
-
DIMM slots with 204 pins
The features of the integrated graphics function
The M.2 22
6
0 BM slot provid es th e following interfaces:
Mini-PCIe Half
-
Size slot
Audio Realt ek® ALC 662
5.1 channel
High-Definition Audio
Support
Intel Core i7 / i5 / i3, Pentium and Celeron processors Maximum supported processor power consumption (TDP) = 65 W Codename "S kylake", 14 nm process technolo gy, up to 8 MB of L3 cache Not compatible with Intel Xeo n E3 V5 processors for Socket LGA 1151 and processors for Socket LGA 1150.Does not support the unlock-function of Intel K-Series processors. The process or integrates PCI-Express, memory controller and the graphics engine on the sam e die (performance features depending on pro cessor t ype) Please refer to the support list for detai led processor support information at global.shuttle.com.
Cooling
Memory
Support
Integrated
Graphics
M.2 Slot
Heatpipe pr ocessor cooling with two 60 mm fans on the upper side of the chassis
Supports DDR3L-1333/1600 (PC3-10600/12800) SDRAM at 1.35V Supports ma ximum total size of 32 GB ( max. 16 GB per module) Supports Dual Channel mode Supports tw o unb uffered DIMM modules (no ECC) Notice: This mainboard does only support 1.35V DDR3L memor y modules. DDR3L h as a lower operation voltage compared to DDR3. The maximum memory clock rate depends on t he pr ocessor type.
depend on the processor type used. Three digital video outp uts: 2x DisplayPort 1.2 and 1x HDMI 1.4
- supports three independent Full HD displays simultaneously [3]
- supports Full HD resolution at 1920 x 1200 (1080p/60Hz)
- supports 4K UHD resolution at 3840 x 2160 (2160p/60Hz on DP, 30 Hz on HDMI) [4]
- supports Blu-ray (BD) playback with HDCP
- supports HD video plus mult i-channel digital audio via a single cable. Optional analog D-Sub/VGA vid eo output [5]
- PCI-Express v3.0 X4
- SATA v3.0 (6 Gbps)
- USB 2.0 It supports M.2 cards with a width of 22 mm and a lengt h of 30, 42 or 60 mm (type 2230 , 2242, 2260). Supports M.2 SATA SSDs, M.2 PCIe SSDs and other M.2 cards.
Mini PCIe Slot
Audio
with PCIe 2 .0 and USB 2.0 interfac e supports one optional Wireless Network (WLAN) card [6]
Two analog audio connectors (3.5 mm) at the front panel:
1) 2-channel lin e out (headph ones)
2) microphone input Digital multi-channel audio output: by HDM I and DisplayPort
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Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
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Product Specifications
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Dua l
Dual networ k with two RJ45 ports
Drive
1x Serial
-
ATA III, 6 Gb/s (600 MB/s) bandwidth
Integr ated card reader
Microphone input
1x HDMI connector [1]
1x jumper JP2
- power
-on-
after power fail
(hardware solution) [8]
Gigabit LAN
Controller
Used network chips:
1) Intel i211 Et hernet Controller with MAC, PHY an d PCIe int erface
2) Intel i219LM PHY connected to the MAC of the processor Supports 10 / 100 / 1.000 MBit/s operation Supports WA KE ON LAN (WOL) Supports network boot by Preb oot eXecution Environment (PXE) Supports Teaming mode [9]
Connectors
Card Reader
Front Panel Connectors
Back Panel Connectors
With Serial-ATA power connect or (onboard)
Supports SD, SDH C and SDXC memory flash cards Supports boot-up from SD card
Audio Line-out (headphone) 2x USB 3.0 2x USB 2.0 SD card rea der Power button Power LED (blue) HDD LED (yellow)
2x Dis playPort connector (DP) [2] Optional 1x D-Sub VGA connector (Accessory PVG01 [5]) 2x USB 3.0 2x USB 2.0 2x Gigabit LAN (RJ45) 2x RS232 serial port, 9- pin D-Sub (5/12V, 1x RS422 /RS485) [10] DC-input connector for external power adapter 4-pin connector (2.54 mm pitc h) supports
- external power on button
- Clear CMOS function
- +5V DC voltage for ext ernal components 2x Perforation for optional Wireless LAN antennas 2x hole for Kensington Locks
Other
Onboar d
Connectors
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1x analog VGA graphics output CN6 (2x 10-p in, 1 mm pitch) [5] 2x USB 2.0 (2x5-pin) 2x serial interface (COM) occupied by back panel connectors 1x fan connector (4-pin) occupied by the cooling s ystem 1x connector for CMOS battery (occupied) 1x audio connect or (line-out/microphone, 2x 7-pin)
Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
Te l. +4 9 ( 0) 412 1- 4 7 68 60 Fa x +49 (0 ) 4 121 -47 69 00 sa les@ shu tt le .eu
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Supplied
Multi-languag
e user guide (EN, DE, FR, ES, JP, KR, SC, TC)
(1) WLN
-S or
WLN-P
:
Wireless LAN kit consisting of a Mini
-
PCIe card,
Environment al
Ambient temperature range: 0~50
°C
[7]
EMI: FCC, CE, BSMI, C
-
Tick
Accessories
VESA mount for 75 / 100 mm standard (two metal brackets) Four thumbs crews M3 x 5 mm (to affix VESA mount on the PC) Four screws M4 x 10 mm (to fix the VESA mount to the external device) Four screws M3 x 4 mm (to mount a 2.5" storage into the bay) Driver DVD (Windows 64-b it) Serial ATA cable for 2.5" drive including power cable External 90 W power adapter with power cord Protection cap for CPU socket (do not use if heatpipe or fan is mounted) Heatsink compound
Optional
Accessory
Specifications
Conformity
Certifications
Footnotes: [1] HDMI [2] How to convert DisplayPort to HDMI/DV I? The DisplayPort outputs can b e converted to HDM I or DVI by an add itional, pass ive adapter cable. For example: DELOCK 82590: 1 m, DisplayPort (male, 20p) to HDMI-A (male, 19p) DELOCK 82435: 5 m, DisplayPort (male, 20p) to DVI-D (male, 24p) The integrated graphics automatically detects the connected display and puts out the appropriate electric signal ­eit her through DisplayPort (w ithout an adapter) or HDMI/DVI (with an adapter). However, a monitor with a DisplayPort connector ca nnot be connected to the HDMI p ort with a simple, passive adapter.
[3] Three independent displays sim ultaneously The Shuttle XPC slim Barebone DQ170 supports a maximum of tw o displays with th e sam e input connector. For example: Two displays can be conne cted thr ough HDMI input - the f irst one directly to the HDMI o utput, the second one to the DisplayPort output with an adapter. A third digital display, if required, must be connected direct ly to the DisplayPort output (without an adapter).
[4] 4K Ultr a-HD resolution A 4K-displa y with Ultra-HD resolut ion (3840 x 2160) should only be connected via DisplayPort, as only this port supports a higher refresh rate of 60 Hz. Certain displays (e.g. Dell UP2414Q) however require MST mode (Multi­Stream Transport) to be enabled which sends two separate images at half r esolution each to the display. These two images are then combined and put in correct order by the Int el graphics driver when in Collage mode. Please note that HBR2-m ode (High Bit Rate 2) must be supported by each display to have more t han o ne of them run at 4K resolution.
[5] Optional D-Sub/VGA connector
output supports DVI-D with optional adapter
two antenna s and appropr iate antenna cables.
(2) PVG01:
Relative humidit y, non-condensing: 10~90 %
Safety: ETL, CB, BSMI Other: RoHS, Energy Star 5.0, ErP This device is classed as a technical informati on equipment (ITE) in class B and is intended for use in living room and office. The CE-mark appr oves the conformity by the EU dir ectives: (1) 2004/108/EC relating to electromagnetic compatibility (EMC), (2) 2006/95 /EC relating to El ectrical Equipment designed for use within certain voltage limits (LVD), (3) 2009/125/EC relating to ecodesign requirements for energy-related pro ducts (ErP)
optional D-Sub VGA video output [5]
w w w . s h u t t l e . e u
Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
Te l. +4 9 ( 0) 412 1- 4 7 68 60 Fa x +49 (0 ) 4 121 -47 69 00 sa les@ shu tt le .eu
Product Specifications
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The mainboard features one analog graphics port CN6 on the mainboard. This signal can be lead to the outside as a 15-pin D-Sub VGA connector at the backpanel by using an optiona l adapter PVG01. However doing so means one serial port (COM) less can be used at the backpanel. [6] Optional Wireless LAN modul e The Shuttle XPC slim Barebone DQ170 supports an optiona l WLAN module, which consists of a half-size Mini-PCIe WLAN card and an external ant enna with an appropriate antenna cable. Shuttle o ffers a suitable accessory kit "WLN-S" with two antennas.
[7] Notice - operatin g temperat ure For high ambient temperatures over 40° C we str ongly recommend to use SSDs (su pporting at least 70 °C) and rugged SO-DIMM memory mo dules with a temperature range of up to 95 °C.
[8] Power-on-aft er-power-fail The BIOS setup provides a "Power-On after Power Fail" function that can be found under "Power Management Configuration". As the name indicates, this fun ction determines the PC's behaviour after power failure: (1) unconditional power on, (2) restor e former stat us or (3) keep system turned of f. As a matter of the nature of this function, it may fail after s hort power failures. This is why the DQ170 also comes with a hardware-based solution. By removing Jumper JP2 (on the mainboard behind the power button) the s ystem will start unconditionally once power is supplied.
[9] Teaming Mode The teaming function allows you to group both available network adapters together to function as a singl e adapter. The ben efit of this approach is that it enables load balancing and failover. Driver down load: https://down loadcent er.intel.com/download/21642 [10] Serial Port s This P C features two ser ial RS232 ports with 9-pin D-Sub connectors at the back panel. The left COM port (COM 1) can also be configured as RS422 and RS485 in the BIOS s etup. The COM ports are protected by black plastic caps. Pin 9 of the D-Sub COM-P ort is a multi-function al signal. Based on the Jumper JP1 c onfig uration on the mainboard, it can be configured as Ring Indicator (RI) or external power supply with a voltage level of either 5 V or 12 V. Each COM port can be configur ed separately. The maximum curr ent is 500 mA per connector.
[11] Installation of Windows 7 Intel® 100 chipset series has removed support f or the Enhanced Host Contr oller Interface (EHCI) which is the driver software for the USB 2.0 ports. The new chipset only supports the updated Extensible Host Controller Interface (xH CI for USB 3.0) which is not sup ported by the orig inal Windows 7 installation disk. This means, that peripher al devices connected by USB (like keyboard, mouse and external optical drive) will not work during Windows 7 installation. To sol ve this, please add the required USB 3.0 drivers to the Windows 7 installation files - this proced ure is explained in the Shuttle FAQ section at http://global.s huttle.com/support/faqDetail?faqId=2380 .
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Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
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Cores/
CPU
Turbo
Graphics
Graphics
6th
Generation Intel Core Desktop Processor Family
Socket LGA 1151 14nm “Skylake-S” processor overview
(Date: July 2016)
Processors with a TDP > 65 W are not supported (marked in red)
Class
Model
6700K
Core i7
6700 6700T 6600K
6600
6600T
Core i5
6500
6500T
6402P
6400
6400T
6320
6300
Core i3
6300T
6100
6100T 6098P G4520 G4500
Pentium
G4500T
G4400
G4400T
G3920
Celeron
G3900
G3900T
K = unlocked, T = Powe r optimized lifestyle, R = Intel® Iris™ Pro Graphics 580.
Note: Shuttle XPC slim Bare bon e products do not support the unlock-function of Intel K-Series process ors.
Please refer to the support list fo r detailed pr ocessor support information at global.sh uttle.com.
Threads
Clock
Clock
4 / 8 4.0 GHz 4.2 GHz 8 MB 91 W HD 530 350~1150 MHz 4 / 8 3.4 GHz 4.0 GHz 8 MB 65 W HD 530 350~1150 MHz 4 / 8 2.8 GHz 3.6 GHz 8 MB 35 W HD 530 350~1100 MHz 4 / 4 3.5 GHz 3.9 GHz 6 MB 91 W HD 530 350~1150 MHz 4 / 4 3.3 GHz 3.9 GHz 6 MB 65 W HD 530 350~1150 MHz 4 / 4 2.7 GHz 3.5 GHz 6 MB 35 W HD 530 350~1100 MHz 4 / 4 3.2 GHz 3.6 GHz 6 MB 65 W HD 530 350~1150 MHz 4 / 4 2.5 GHz 3.1 GHz 6 MB 35 W HD 530 350~1100 MHz 4 / 4 2.8 GHz 3.4 GHz 6 MB 65 W HD 510 350~950 MHz 4 / 4 2.7 GHz 3.3 GHz 6 MB 65 W HD 530 350~1150 MHz 4 / 4 2.2 GHz 2.8 GHz 6 MB 35 W HD 530 350~1100 MHz 2 / 4 3.9 GHz − 4 MB 65 W HD 530 350~1150 MHz 2 / 4 3.8 GHz − 4 MB 65 W HD 530 350~1150 MHz 2 / 4 3.3 GHz − 4 MB 35 W HD 530 350~1100 MHz 2 / 4 3.7 GHz − 4 MB 65 W HD 530 350~1150 MHz 2 / 4 3.2 GHz − 4 MB 35 W HD 530 350~1100 MHz 2 / 4 3.6 GHz − 3 MB 54 W HD 510 350~1050 MHz 2 / 2 3.6 GHz − 3 MB 51 W HD 530 350~1150 MHz 2 / 2 3.5 GHz − 3 MB 51 W HD 530 350~1150 MHz 2 / 2 3.0 GHz − 3 MB 35 W HD 530 350~1100 MHz 2 / 2 3.3 GHz − 3 MB 51 W HD 530 350~1150 MHz 2 / 2 2.9 GHz − 3 MB 35 W HD 530 350~1100 MHz 2 / 2 2.9 GHz − 2 MB 51 W HD 530 350~1050 MHz 2 / 2 2.8 GHz − 2 MB 51 W HD 530 350~1050 MHz 2 / 2 2.6 GHz − 2 MB 35 W HD 530 350~950 MHz
Cache TDP
Engine
Clock
vPro
− Yes Yes
− Yes Yes Yes Yes
w w w . s h u t t l e . e u
Shuttl e C o m p u t er H an d e l s GmbH
Fr it z- Stra ssm ann- Str. 5 25 337 El ms hor n | Ge rma ny
Te l. +4 9 ( 0) 412 1- 4 7 68 60 Fa x +49 (0 ) 4 121 -47 69 00 sa les@ shu tt le .eu
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