How it Works
Shuttle
Loading...
DH270
User Manual
13 pgs1.65 Mb0
User Manual [de]
13 pgs1.66 Mb0

Shuttle DH270 User Manual

Download
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 1 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
First Shuttle XPC slim with HDMI 2.0
The Shuttle XPC slim Barebone DH270 is a robust 1.3l B arebo ne PC
with H 270 c hipse t for Inte l LGA1151 desktop processo rs, code named "Sk ylake" a nd "Kaby Lake". Three HDMI ports allow for three indepe ndent displays to be operated at the same time. One HDMI 2.0 port supports Ul tra HD at 60 Hz frame rate . The DH270 also offers Dual Intel LAN, two COM ports a nd one U SB port type C. Its slim meta l chassis comes with a VES A mou nt included, provides versatile connec tivity and reliable opera tion in environments with ambient temperatures of up to 50 °C. This platform is targe ted a t professional applic ations such as Digital Signage, POS, POI, gambli ng machi nes, off ice, hea lthca re and industry.
Feature Highlights
Slim Design
Slim 1.3-litre metal chassis, black 190 x 165 x 43 mm ( LWH) Operating temp erature: 0~50 °C Including VESA mount (75/100 mm)
Operating
System
The operating system is not included Supports Windows 10 and Linux (64-bit) Windows 7 with Skylake CPUs only
Processor
&
Graphics
Supports LGA 1151 Skylake or Kaby Lake
processors up to a max. TDP of 65 W
Supports Core i7 / i5 / i3, Pentium, Celeron Heatpipe cooling system with two fans Integrated Intel HD grap hics supports 4K
and can operate three independent displays simultaneously
Chipset
Intel H270 Chipset , Triple Monitor Support
Memory
2x 260-pin SO-DIMM slots Supports DDR4-2133/2400, max. 2x 16 GB
Storage
Bays/Slots
1x 2.5” bay for SATA hard disk or SSD Two Mini expansion slots:
1x M.2 2280BM, supports PCIe x4 & SATA 1x M.2-2230AE for optional WLAN [WLN-M]
I/O
Connectors
1x HDMI 2.0, 2x HDMI 1.4b, optional VGA SD card reader, 2x audio (line out, mic) 3x USB 3.0 (1x Type C), 4x USB 2.0 2x Intel Gigabit LAN (RJ45), supports WOL 2x COM port (RS232 + RS232/RS422/RS485) Connector for external power button “Always on” Jumper onboard
Power Supply
External 90 W fanless power adapter
XPC slim Barebone
DH 270
Images for illustration only.
Processor, memory, storage and
operating system not included.
50
0
HDMI 2.0
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 2 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Shuttle XPC slim Barebone DH270 – Front and Back Panel
Front view
Rear view
Right side
Left side
Front
Rear
Rear
Front
1
Microphone input
2
Headphones output
3
Power LED
4
Hard disk LED
5
Power Button
6
SD Card Reader
7
1x USB 3.0 Type C
8
2x USB 3.0 Type A
A
2x WLAN perforation
B
COM1 supports RS232 (or optional VGA port for analog displays [5])
C
COM2 supports RS232/RS422/RS485
D
DC power input
E
HDMI 2.0 video output
F
HDMI 1.4b video outputs
G
2x RJ45 Gigabit LAN
H
4x USB 2.0
I
Connector for external power button, Clear CMOS and 5 V DC voltage (4 pins, 2.54 mm pitch)
J
2x hole for Kensington Lock
K
VESA mount (two parts)
COM port Pin 9 Configuration
Pin 9 is a multi-functional signal. Based on jumper JP1 configuration on the mainboard, it can be configured as Ring Indicator (RI) or external power supply with either 5 V or 12 V voltage level (each COM port separately).
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 3 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Shuttle XPC slim Barebone DH270 – Mainboard
A
C
G
P
D
F
K
L
M
N
O
H
E
I
B
J
A
Front Panel
I Intel H270 Chipset
B
Always Power-On Jumper
J Debug Interface
C
Fan Connector
K COM1 serial Port (RS232,RS422,RS485)
D
LGA 1151 Processor Socket
L COM2 serial Port (RS232)
E
VGA Connector
M COM1/COM2 Pin 9 Configuration
F
M.2 2230 Slot (for optional WLAN)
N M.2 2280 Slot
G
SATA 3.0 (6 Gbps) Connector
O Battery Connector
H
SO-DIMM Socke t for DDR4 Memory
P Back Panel
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 4 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Required Components
The following components need to be added to make it a fully -configured Mini PC
2.5” SATA hard disk or Solid State Disk (SSD) (max. height: 12.5 mm)
Up to two DDR4-2133/2400 SO-DIMM memory modules max. 16 GB each
Windows 10 / Linux Operating System
LGA 1151 processor “Sk ylake” or “Kab y Lake” TDP max. 65 W Core i7 / i5 / i3, Pentium or Celeron
M.2 2280/2260/2242 SSD storage
WLAN-Accessory WLN-M
VGA port Accessory PVG01
Installing PVG01 means one serial port (COM) less can be used at the backpanel.
Vertical Stand PS02 for vertical operation
Optional Accessories
Cable for external push button switch CXP01 (without button)
2U rack mount front plate PRM01
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 5 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Shuttle Slim-PC Barebone DH270 – Product Features
16.5 cm
4.3 cm
19 cm
1.3 L
Robust, stylish and particularly small
You should have held it in your own hands t o see how small it actually is. Barely measuring a volume of 1.35 litre, its steel chassis gives it the appropriate stability required for professional applications in digital signage. Despite its dimensi ons of 19 x 16.5 x 4.3 cm (LWH), the overall system performance is very high thanks to support of Intel Core desktop processors. The interior of the D H270 is very t idy t oo so that it won't take long to set it up. Its sleek and styli sh looks lets it easily find a place in both home and office en vironments.
Low noise thanks to heatpipe cooling system
An active dual-fan heatpipe cooling syst em ensures whi sper-quiet operation and syst em stability.
Extended temperature range and reliability
The DH270 is outstandingly robust thanks to its rugged chass is. With an ambient temperature range from 0-50 °C it is suitabl e for use in the most demanding environments. Solely designed with all solid capa ­citors, DH270 is guaranteed to deliver maximum stability, reliability and longer system lifetime for long-term applications like digital signage. Caution: for high ambient temperatures o ver 40°C w e strongly recomm end to use SSDs (supporting at least 70°C).
Triple Display with 3x HDMI (optional VGA)
DH270 features three HDMI digital video outputs . This multi-monitoring technology offers multiple display support on up to three separate monitors. This helps improve o n productivity by allowing for spreading multiple windows across three monitors while working with them simult aneously. Furthermore, the DH270 supports an optional D-Sub /VGA port.
Supports 4K Ultra HD at 60Hz
The DH270 supports displays running at 4K (3840 x 2160 / 2160p) high resolution at 60Hz frames per second when connected to its HDMI 2.0 video output. Being the successor to t he Full HD standard, Ultra HD delivers a fo ur times higher resolution wit h a w ider colour space and colour depth.
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 6 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
One M.2-2280-Slot for SSD card
The M.2-2280 BM slot supports one M.2 SSD storage card with SATA or with the more advanced PCIe inter face. Type 2280 means, it supports the usual M.2 cards with a width of 22mm and a length of 80mm, but also 2242 and 2260 standard cards are supported. The DH270 is prepar ed for the Intel® Optane™ Technology.
Intel® Optane™ Ready
With a 7th Gen Intel® Core™ "Kaby Lake" processor, the DH270 supports the latest Intel® Optane™ memory technology which is able
to accelerate your system to deliver amazing speed.
VESA mount
The supplied 75/100mm VESA mount allows for installation on to walls or monitors which is particular ly interesting for the industry segment, company buildings and public institutions. Other than this, the chassis bears numerous thr eaded holes (M3) enabling it t o be fitted alm ost anywhere.
Kensington Lock
This is a small, m etal-reinforced hole as part of an anti-theft syst em. The DH270 provides an appropriate hole on both side of its chassis. The lock and cable are not included.
External power button by separate remote line
If because of space constraints (e.g. in case of f ixed installation), the machine cannot be switched on by pressing the front power button, it can be powered on by a separate remote line. You will find an appropriate four-pin-connector at the back panel of the D H270 (pitch
2.54 mm) . Furthermore, this connector provides a Clear CMOS function and +5V DC voltage supply for external devi ces.
(4) Power Button (3) Ground
+5V voltage (2)
Clear CMOS (1)
- Front Panel -
Power on after Power fail
The BIOS setup provides a "Power-On after Power Fail " function that can be found under "Power Management Configuration". As the name indicates, this fu nction det ermines the PC's behaviour after power failure: (1) unconditional power on, (2) restore former status (3) keep system turned off (4) Power-On by LAN or (5) Power-On by Real-Time­Clock. As a matter of the nature of this function, it may fail after short power failures. This is why the DH270 also comes with a hardware­based solution. By remo ving Jumper JP2 (see image) the system will start unconditiona lly once power is a pplied.
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 7 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Product Comparison
DH110SE
DH110
DH170
DQ170
DH270
Availability
Nov 2016
Jan 2016
Oct 2015
Oct 2016
Q3 2017
Processor Support
Socket LGA 1151 supports Intel Core i7 / i5 / i3, Pentium, Celeron 6th gen. ”Skylake” or 7th gen. “Kaby Lake”, TDP max. 65 W
OS Support
Windows 7, 10 and Linux (64-bit only) Note: Windows 7 is not supported in connection with Kaby Lake processors.
Chipset
H110
H110
H170
Q170
H270
TPM-Support
Firmware
Firmware
Firmware
Hardware
Firmware
Multi-Display
2 Displays
2 Displays
3 Displays
3 Displays
3 Displays
Memory
2x SO-DIMM max. 2x 16GB DDR4-2133
2x SO-DIMM max. 2x 16GB DDR3L-1600
2x SO-DIMM max. 2x 16GB DDR3L-1600
2x SO-DIMM max. 2x 16GB DDR3L-1600
2x SO-DIMM max. 2x 16GB
DDR4-2133/2400
2.5“ drive bay
1x SATA v3.0
1x SATA v3.0
1x SATA v3.0
1x SATA v3.0
1x SATA v3.0
M.2 SSD slot
M.2-2260 SATA
M.2-2260 SATA/PCIe
M.2-2260 SATA/PCIe
NVMe-Support
M.2-2260 SATA/PCIe
NVMe-Support
M.2-2280 SATA/PCIe
NVMe-Support
Network
Single LAN RTL8111G
Dual LAN
Intel i211/i219LM
Dual LAN
Intel i211/i219LM
Dual LAN
Intel i211/i219LM
Dual LAN 2x Intel i211
Front Panel
2x Audio 2x USB 3.0 2x USB 2.0 Card reader
2x Audio 2x USB 3.0 2x USB 2.0 Card reader
2x Audio 2x USB 3.0 2x USB 2.0 Card reader
2x Audio 2x USB 3.0 2x USB 2.0 Card reader
2x Audio 3x USB 3.0 (1x Type C) Card reader
Back Panel
HDMI 1.4b DP 1.2 4x USB 2.0 1x LAN
HDMI 1.4b DP 1.2 2x USB 3.0 1x USB/eSATA 2x LAN 2x COM
HDMI 1.4b 2x DP 1.2 2x USB 3.0 2x USB 2.0 2x LAN 2x COM
HDMI 1.4b 2x DP 1.2 2x USB 3.0 2x USB 2.0 2x LAN 2x COM
1x HDMI 2.0
2x HDMI 1.4b 4x USB 2.0 2x LAN 2x COM
Power Adapter
90 W / 19 W
90 W / 19 W *)
90 W / 19 W
90 W / 19 W
90 W / 19 W *)
VESA mount
Optional
Yes
Yes
Yes
Yes
Optional WLAN
WLN-M
WLN-M
WLN-P
WLN-P
WLN-M
Optional VGA
-
PVG01
PVG01
PVG01
PVG01
*) DH110 and DH270 support 84 W / 12 V power adapters as well
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 8 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Shuttle XPC slim Barebone DH270 - Specifications
Chassis
Black chassis made of steel Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-l itre Weight: 1.3 kg net and 2.04 kg gross Two holes for Kensington Locks an d numerous threaded holes (M3) at both si des of the chassis
Operation
System
This system comes without operating system. It is compatible with Windows 10 and Linux (64-bit). Note: Windows 7 is only supported in combination with 6th generation Intel Core processors "Skylake". For an a dditional note on Wind ows 7, please see [1]
Mainboard,
Chipset,
BIOS
Chipset: Intel® H270 Chipset (code name "Union Point") Platform Controller Hub (PCH) as Single-Chip-Solution AMI BIOS in 8 Mbit EEPROM with SPI int erface All capacit ors are high quality solid capacitors Supports hardware monitoring and watch dog functionality Supports Unified Extensible Firmware Interface (UEFI) Supports power on after p ower failure [4] Supports Firmware-TPM (fTPM) Version 2.0
Power
Adapter
External 90 W power adapter (fanless) Input: 100~240 V A C, 50/60 Hz Output: 19 V DC, 4 .74 A, max. 90 W DC Connector: 5.5/2.5 mm (outer/inn er diameter) Remark: The DC-input of t he computer sup ports an external power source with either 12V±5% or 19V±5%.
Processor
Support
Socket LGA 1151 (H4) supports Intel Core i7 / i5 / i3, Pentium and Cel eron processors
- 6th generation, code name "Skylake"
- 7th generation, code name "Kaby Lake" Maximum supported processor power consumption (TDP) = 65 W 14 nm process t echnology, up to 8 MB of L3 cache Not compatible with Intel Xeon E3 V5 processors for socket L GA 1151 and processors with the older Socket LGA 1150. Does not support the un lock-function of Intel K-Series processors. The processor integrates PCI -Express, memory control ler and t he graphics eng ine on the same die (performance features dep ending on processor type) Please refer to the support list for d etailed pr ocessor support in formation at global.shuttl e.com.
Processor
Cooling
Heatpipe processor cooling with two 60 mm fans o n the upper side of the chassis
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 9 2 5 Septem ber 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Memory
Support
2x SO-DIMM slot with 260 pins Supports DDR4-2133/2400 (PC4-17066/19200) SDRAM at 1.2 V Supports maximum total size of 32 GB (ma x. 16 GB per module) Supports Dual Channel mode Supports two unbuffered DIMM modules (no ECC)
Integrated
Graphics
The features of the int egrated graphics fun ction depend on the processor type used. Three digital video outputs: 1x HDMI 2.0 und 2x HDMI 1 .4b
- supports up to t hree indep endent displays simultaneously
- HDMI 1.4b supports 4K UHD resolution at 30 Hz (2160p/30)
- HDMI 2.0 supports 4K UHD resolution at 60 Hz (2160p/60)
- supports Bl u-ray (BD) playback with HD CP
- supports HD video plus multi-channel digital audio via a single cab le Optional analog D-Sub/VGA video output [3]
2.5" Storage Bay
1x 6.35 cm / 2.5" storage bay supports one hard disk or SSD drive Device height: 12.5 mm (max.) 1x Serial-ATA III connector, max. 6 Gb/s (60 0 MB/s) bandwidth With Serial-ATA power connector (onboard)
Two M.2 Slot
This XPC features two M .2 expansion slots: (1) M.2 2280 BM slot
- Interfaces: PCI-Express Gen. 2.0 X4 (max. 16 Gbit/s) and SATA v3.0 (ma x. 6 Gbit/s)
- supports M.2 cards with a width of 22 mm and a length of 42 , 60 or 80 mm (type 2242, 2260, 2280)
- supports SA TA SSDs (BM- Key) or PCIe SSDs (M-Key) (2) M.2 2230 AE slot
- Interfaces: PCI-Express Gen. 2.0 X1 und USB 2.0
- supports M.2 cards with a width of 22 mm and a length of 30 mm (t ype 2230)
- supports an optional WLAN card (access ory W LN -M [4])
Audio
Audio Realtek® ALC 662 5.1 channel High-Definition Audio Two analog audio connectors (3.5 mm) at the front panel:
1) 2-channel line out ( headphones)
2) microphone input Digita l multi -channel audio output: b y HDMI.
Dual
Gigabit LAN
Controller
Dual network with two RJ45 ports Used network chips: 2x Intel i211 Ethernet Controller with MAC, PHY and PCIe int erface Supports 10 / 100 / 1.000 MB it/s operation Supports WAKE ON LAN (WOL) Suppor ts network b oot b y Preboot eXecution Envir onment (PX E) Supports Teaming mode [5]
Card Reader
Integrated card reader Supports SD, SDHC and SDXC memory flash cards Supports boot up from SD card
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 10 25 Se ptember 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Front Panel
Connectors
Microphone input Audio Line-out (headphones) 2x USB 3.0 type A 1x USB 3.0 type C SD card reader Power button Power LED (blue) HDD LED (yellow)
Back Panel
Connectors
1x HDMI 2.0 (supports UltraHD resoluti on at 60 Hz) 2x HDMI 1.4b (with two screw holes for HDMI connector with locking screws) Optional 1x D-Sub VGA connector (Accessory PVG01 [3]) 4x USB 2.0 2x Gigabit LAN (RJ45) 2x RS232 serial port, 9 -pin D-Sub (5/12 V, 1x RS422/ RS485) [6] DC-input connector for external power adapter 4-pin connector (2 .54 mm pitch) supports
- external power on button
- Clear CMOS function
- 5 V DC voltage for externa l components 2x perforation for optional Wireless LAN antennas 2x hole for Kensington Locks (at the side)
Other
Onboar d
Connectors
1x jumper JP2 – power-on-after-power-fail (hardware solution) [4] 1x analog VGA graphics output CN6 (2x 10-pin , 1 mm pitch) [3] 2x serial interface (COM) oc cupied by back panel connect ors 1x fan connector (4-pin) occupied by cooling system 1x connector for CMOS batter y (occupied) 1x audio connector (line-out/microphone, 2 x 7-pin)
Supplied
Accessories
Multi-languag e user gui de (EN, DE, FR, ES, JP , KR, SC, TC) VESA mount for 75/100mm standard (two metal brackets) Four thumbscrews M3 x 5 mm (screws together VESA mount and PC) Four screws M4 x 10 mm (to affix VESA mount on t h e PC) Four screws M3 x 4 mm (to mount a 2.5" drive into the bay) Driver DVD (Windows 10 64-bit) Serial ATA cable for 2.5" drive including power cable External 90 W power adapter with power cord Protection cap for CPU socket (do not use, if heatpipe or fan is mounted) Heatsink compound
Optional
Accessory
(1) WLN-M: Wireless LAN kit consisting of a M.2 -2230 WLAN card, tw o antennas and appropriate cables. Supports IEEE 802.11b/g/n/ac in t he 2.4 / 5 GHz band and Bluetooth 4.0. [7] (2) PVG01: optional D-Sub VGA video output [3]
Environmental Specifications
Operating temperature range: 0~50 °C [8] Relative humidity, non-condensing: 10~90 %
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 11 25 Se ptember 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Conformity
Certification s
EMI: FCC, CE, BSMI, C-Tick Safety: ETL, CB, BSMI Other: RoHS, Energy Star, ErP This device is class ed as a technical information equipment (ITE) i n class B and is intended for use in living room and office. The CE -mark approves the conform ity b y the EU dir ectives: (1) 2004/108/EC relating to electromagnetic compatibility (EMC), (2) 2006/95/EC relating t o Electrical Equipment designed for use within certa in voltage limits (LVD), (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)
Footnotes: [1] Installation of Windows 7 The Intel® 100/200 chipset series does no longer support the Enhanced Host Controller Interface (EHCI) which is the driver software for USB 2.0. The new chipset only supports the updated Extensibl e Host Controller Interface (xHCI for USB 3.0) which is not supported by the original Windows 7 install atio n disk. This means, that p eripheral devices connected by USB (like keyboard, mouse and external optical drive) will not work during the Windows 7 Installation. As a solution , pleas e add the required USB 3.0 drivers to the Windows 7 installation files - this procedure is explained in the Shuttle FAQ section at http://go.shuttle.eu/skylakewin7en. Note: Windows 7 is only supported with processors of the 6th generation (Skylake), not wit h processors of the 7th generation (Kaby Lake). [2] HDMI output supports DVI-D w ith optional adapter [3] Opti onal D-Sub/VGA connector The mainboard features one analog graphics port CN6 on the mainboard. This signal can be lead to the outside as a 15-pin D-Sub VGA connector at th e backpanel by using an optional adapter PVG01. Howe ver doing so means one serial port (COM) less can be used at t he ba ckpanel. [4] Power-on-after-power-fail The BIOS setup provides a "Power-on-after-power-fail" function that can be found under "Pow er Mana gement Configuration ". As the name indicates, this function determi nes the PC's behaviour after power failure: (1) unconditional power on, (2) restore former status or (3) keep system turned off. As a matter of the nature of this function, it may fail after short power failures. This is why the DH270 also comes with a hardware -based solution. By removing Jumper JP2 (on the mainboard behind the power button) , the system will start unconditionally once power is supplied. [5] Teaming Mode The teaming function allows you to group both available network adapters together to function as one single adapter. The benefit of this appr oach is that it enables load balancing and failover. Driver download: https://downloadcenter.intel.com/download/21642 [6] Serial Ports This PC features two serial RS232 ports with 9-pin D-Sub conn ectors at the b ack panel. The left COM port (COM1) can also be configured as RS422 and RS485 in the BIOS setup. The COM ports are pr otected by black plast ic caps . Pin 9 of the D-Sub COM-Port is a multi-funct ional signal. Bas ed on the Jumper JP1 conf iguration on the mainboard, it can be configured as Ring Indicator (RI) or external power supply with a voltage l evel of either 5 V or 12 V. Each COM port can be configured separately. The maximum current is 500 mA per connector. [7] Opti onal Wireless LAN module This Shuttle XPC slim Barebone supports the optional Shuttle XPC Acces sory WLN -M which consists of a M.2-2230 card w ith IEEE 802.11ac a nd BT4.0 functionality and two external antennas with appropriate ant enna cables. [8] Notice - operating temperature For ambient temperatures over 40 °C w e strongly recommend to use SSDs (supporting at least 70 °C) and rugged SO-DIMM memory modules with a temperature range of up to 95 °C.
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 12 25 Se ptember 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
6th Generation Intel Core Desktop Processor Family
Socket LGA 1151 14 nm “Skylake-S” processor overview
Processors with a TDP>65 W are not supported (marked in red)
Name
Model
Cores/
Threads
CPU
Clock
Turbo Clock
Cache
TDP
Graphics
Engine
Graphics
Clock
Core i7 6700K
4 / 8
4.0 GHz
4.2 GHz
8 MB
91 W
HD 530
350~1150 MHz
6700
4 / 8
3.4 GHz
4.0 GHz
8 MB
65 W
HD 530
350~1150 MHz
6700T
4 / 8
2.8 GHz
3.6 GHz
8 MB
35 W
HD 530
350~1100 MHz
Core i5
6600K
4 / 4
3.5 GHz
3.9 GHz
6 MB
91 W
HD 530
350~1150 MHz
6600
4 / 4
3.3 GHz
3.9 GHz
6 MB
65 W
HD 530
350~1150 MHz
6600T
4 / 4
2.7 GHz
3.5 GHz
6 MB
35 W
HD 530
350~1100 MHz
6500
4 / 4
3.2 GHz
3.6 GHz
6 MB
65 W
HD 530
350~1150 MHz
6500T
4 / 4
2.5 GHz
3.1 GHz
6 MB
35 W
HD 530
350~1100 MHz
6400
4 / 4
2.7 GHz
3.3 GHz
6 MB
65 W
HD 530
350~1150 MHz
6400T
4 / 4
2.2 GHz
2.8 GHz
6 MB
35 W
HD 530
350~1100 MHz
Core i3
6320
2 / 4
3.9 GHz
−
4 MB
65 W
HD 530
350~1150 MHz
6300
2 / 4
3.8 GHz
−
4 MB
65 W
HD 530
350~1150 MHz
6300T
2 / 4
3.3 GHz
−
4 MB
35 W
HD 530
350~1100 MHz
6100
2 / 4
3.7 GHz
−
4 MB
65 W
HD 530
350~1150 MHz
6100T
2 / 4
3.2 GHz
−
4 MB
35 W
HD 530
350~1100 MHz
Pentium
G4520
2 / 2
3.6 GHz
−
3 MB
51 W
HD 530
350~1150 MHz
G4500
2 / 2
3.5 GHz
−
3 MB
51 W
HD 530
350~1150 MHz
G4500T
2 / 2
3.0 GHz
−
3 MB
35 W
HD 530
350~1100 MHz
G4400
2 / 2
3.3 GHz
−
3 MB
51 W
HD 530
350~1150 MHz
G4400T
2 / 2
2.9 GHz
−
3 MB
35 W
HD 530
350~1100 MHz
Celeron
G3920
2 / 2
2.9 GHz
−
2 MB
51 W
HD 530
350~1050 MHz
G3900
2 / 2
2.8 GHz
−
2 MB
51 W
HD 530
350~1050 MHz
G3900T
2 / 2
2.6 GHz
−
2 MB
35 W
HD 530
350~950 MHz
K = unlocked clock multiplier, T = Power optimized lifestyle, TDP = Thermal Design Power (max. power consumption)
Note: The Shuttle XPC slim Barebone DH270 does not support the unlock-function of Intel K-Series processors.
Please refer to the support list for detailed processor support information at global.shuttle.com.
Product Specifications
w w w . s h u t t l e . e u
Te l. +4 9 ( 0 ) 412 1 -4 7 6 8 6 0 Fa x + 4 9 ( 0) 41 21- 47 69 00 sa les @sh ut tle .eu
Page 13 25 Se ptember 2017
© 2017 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
7th Generation Intel Core Desktop Processor Family
Socket LGA 1151 14 nm “Kaby Lake-S” processor overview
Processors with a TDP>65 W are not supported (marked in red)
Name
Model
Cores/
Threads
CPU
Clock
Turbo Clock
Cache
TDP
Graphics
Engine
Graphics
Clock
Core i7
7700K
4 / 8
4.2 GHz
4.5 GHz
8 MB
91 W
HD 630
350~1150 MHz
7700
4 / 8
3.6 GHz
4.2 GHz
8 MB
65 W
HD 630
350~1150 MHz
7700T
4 / 8
2.9 GHz
3.8 GHz
8 MB
35 W
HD 630
350~1150 MHz
Core i5
7600K
4 / 4
3.8 GHz
4.2 GHz
6 MB
91 W
HD 630
350~1150 MHz
7600
4 / 4
3.5 GHz
4.1 GHz
6 MB
65 W
HD 630
350~1150 MHz
7600T
4 / 4
2.8 GHz
3.7 GHz
6 MB
35 W
HD 630
350~1100 MHz
7500
4 / 4
3.4 GHz
3.8 GHz
6 MB
65 W
HD 630
350~1100 MHz
7500T
4 / 4
2.7 GHz
3.3 GHz
6 MB
35 W
HD 630
350~1100 MHz
7400
4 / 4
3.0 GHz
3.5 GHz
6 MB
65 W
HD 630
350~1000 MHz
7400T
4 / 4
2.4 GHz
3.0 GHz
6 MB
35 W
HD 630
350~1000 MHz
Core i3
7350K
2 / 4
4.2 GHz
−
4 MB
60 W
HD 630
350~1050 MHz
7320
2 / 4
4.1 GHz
−
4 MB
51 W
HD 630
350~1050 MHz
7300
2 / 4
4.0 GHz
−
4 MB
51 W
HD 630
350~1050 MHz
7300T
2 / 4
3.5 GHz
−
4 MB
35 W
HD 630
350~1100 MHz
7101E
2 / 4
3.9 GHz
−
3 MB
54 W
HD 610
350~1100 MHz
7101TE
2 / 4
3.4 GHz
−
3 MB
35 W
HD 610
350~1100 MHz
7100
2 / 4
3.9 GHz
−
3 MB
51 W
HD 630
350~1100 MHz
7100T
2 / 4
3.4 GHz
−
3 MB
35 W
HD 630
350~1100 MHz
Pentium
G4620
2 / 4
3.7 GHz
−
3 MB
51 W
HD 630
350~1100 MHz
G4600
2 / 4
3.6 GHz
−
3 MB
51 W
HD 630
350~1100 MHz
G4600T
2 / 4
3.0 GHz
−
3 MB
35 W
HD 630
350~1050 MHz
G4560
2 / 4
3.5 GHz
−
3 MB
54 W
HD 610
350~1050 MHz
G4560T
2 / 4
2.9 GHz
−
3 MB
35 W
HD 610
350~1050 MHz
Celeron
G3950
2 / 2
3.0 GHz
−
2 MB
51 W
HD 610
350~1050 MHz
G3930
2 / 2
2.9 GHz
−
2 MB
51 W
HD 610
350~1050 MHz
G3930T
2 / 2
2.7 GHz
−
2 MB
35 W
HD 610
350~1000 MHz
K = unlocked clock multiplier, T = Power optimized lifestyle, TDP = Thermal Design Power (max. power consumption)
Note: The Shuttle XPC slim Barebone DH270 does not support the unlock-function of Intel K-Series processors.
Please refer to the support list for detailed processor support information at global.shuttle.com.
Loading...
Buy Points How it Works FAQ Contact Us Questions and Suggestions Privacy Policy Cookie Policy Terms of Use