ShenZhen HLK RM08S User Manual

SHENZHEN HI-LINK ELECTRONIC CO.,LTD

Version：V1.0 Issuing date：2017-2-17 copy right@Hi-Link

HLK-RM08S USER MANUAL

CONTENTS

1. BRIEF INTRODUCTION

1.1. BASIC PARAMETERS

2. BLOCK DIAGRAM

2.1. TYPICAL APPLICATION

2.2. SPECIFICATIONS

3. ELECTRICAL CHARACTERISTICS

3.1. INPUT VOLTAGE

3.2. RF CHARECTERISTICS

3.2.1. 802.11B 11M

3.2.2. 802.11G 54M

3.2.3. 802.11N MCS7(HT20)

3.2.4. 802.11N_MCS7(HT40)

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1

2

3

4

5

6

4. PINS DEFINITION

4.1. PINS DIFINITION DIAGRAM

4.2. DEFAULT PINS DIFINITION

5. DIMENSIONS

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7

8

10

1

HLK-RM08S

1. Brief Introduction

1.1. Basic parameters

 High data processing ability，MCU frequency 580MHz

 150M Mbps

 Support 802.11b/g/n mode

 20/40 channel bandwidth

 Support 802.11v

 Support AP,STA and AP,STA mixed

 Fifth 10/100M adaptive com port

 One USB2.0 host interface

 Multiple interfaces SPI/SD-XC/eMMC

 Rich peripheral interfaces，SPI,I2C,I2S,PCM,UART,JTAG,GPIO

 Widely used in IOT

 Inbuilt powerful PMU

 Support 16 Multiple BSSID

 Support multiple encryption WEP64/128, TKIP, AES, WPA, WPA2, WAPI

 Support QoS，WMM，WMM-PS

HLK-RM08S based on MT7688KN is a low cost and low power consumption IOT module developed by

Hi-Link.The module has rich interfaces and powerful processor and could be widely used in smart devices and

cloud service applications.

2

HLK-RM08S

2. Block diagram

EINT

Ethernet

UART

GPIO

PWM

USB_HOST

SPI

SPIS

I2C

I2S

JTAG

SDXC

MT7688KN

3.3V

40MHz

SPI Flash(32MB)

IPEX Connector

HLK-RM08S Block Diagram

3

HLK-RM08S

2.1. Typical application

HLK-RM08S

HLK-RM08S typical peripheral interfaces diagram

4

HLK-RM08S

2.2. Specification

Item

Parameter

Model

HLK-RM08S

Main Chip

MT7688KN

I-Cache，D-Cache

64KB,32KB

Kernel

MIPS24KEc

Main frequency

580MHz

RAM

64Mb

Flash

32Mb

RF

1T1R 802.11n 2.4GHz

USB2.0

1

UART

2

Temperature

Environmental temperature：-40℃~85℃

Humidity

working：10~95%（noncondensing）

Storage：5~95%（noncondensing）

Size

17.4mm×25.8mm×2.8mm

3. Electrical characteristics

3.1. Input voltage

Name

Function

Min voltage（V）

Typical

voltage（V）

Max Voltage

（V）

VBAT

Supply voltage

3.2

3.3

3.4

I/O

I/O Voltage

3.2

3.3

3.4

5

HLK-RM08S

3.2. RF Characteristics

3.2.1. 802.11b 11M

802.11b Transmit (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Tx Power Level

DQPSK

182022

dBm

Frequency Tolerance

-15015

ppm

Spectral Mask

11MHz→22MHz

40

dBr

＞22MHz

53

dBr

Modulation Accuracy

All Data Rate

15

%

802.11b Receiver (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Min. Input

11Mbps PER<8%

-91.5

-89.5

-87.5

dBm

3.2.2. 802.11g 54M

802.11g Transmit (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Tx Power Level

OFDM

151719

dBm

Frequency Tolerance

-15015

ppm

Modulation Accuracy

All Data Rate

-31

-28

%

802.11g Receiver (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Min. Input

54Mbps PER<10%

-78.0

-76.0

-74.0

dBm

6

HLK-RM08S

3.2.3. 802.11n MCS7(HT20)

802.11n_HT20 Transmit (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Tx Power Level

OFDM

151719

dBm

Frequency Tolerance

-15015

ppm

Modulation Accuracy

All Data Rate

-31

-28

dB

802.11n_HT20 Receiver (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Min. Input

MCS7 PER<10%

-76.5

-74.5

-72.5

dBm

3.2.4. 802.11n_MCS7(HT40)

802.11n_HT40 Transmit (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Tx Power Level

OFDM

15.0

17.0

19.0

dBm

Frequency Tolerance

-15015

ppm

Modulation Accuracy

All Data Rate

-31

-28

dB

802.11n_HT40 Receiver (Conductive)

Item

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Channel 1

Channel 13

Min. Input

MCS7 PER<10%

-76.5

-74.5

-72.5

DBM

7

HLK-RM08S

4. PINS DEFINTION

4.1. Pins definition diagram

HLK-RM08S Default pins definition diagram

8

HLK-RM08S

4.2. Default pins definition

Name

（ Function

1）

Function 2

Function 3

Function 4

GPIO

Note

1

I2S_DI

PCMDRX

GPIO0

2

I2S_WS

PCMCLK

GPIO2

3

I2S_DO

PCMDTX

GPIO1

4

I2S_CLK

PCMFS

GPIO3

5

SPI_CS1

REF_CLKO

GPIO6

6

SPI_MOSI

GPIO8

7

SPI_CLK

GPIO7

8

SPI_MISO

GPIO9

9

UART_TXD0

GPIO12

Default is serial port

TR

10

UART_RXD0

GPIO13

Default is serial port

TR

11

GPIO0

REF_CLKO

PERST_N

GPIO11

12

MDI_RP_P0

GPIO24

13

MDI_RN_P0

GPIO23

14

MDI_TP_P0

GPIO22

15

MDI_TN_P0

GPIO21

16

MDI_TP_P1

SPIS_CS

PWM_CH0

GPIO14

17

MDI_TN_P1

SPIS_CLK

PWM_CH1

GPIO15

18

MDI_RP_P1

SPIS_MISO

UART_TXD2

GPIO16

19

MDI_RN_P1

SPI_MOSI

UART_RXD2

GPIO17

20

MDI_RP_P2

eMMC_D7

PWM_CH0

GPIO18

21

MDI_RN_P2

eMMC_D6

PWM_CH1

GPIO19

22

MDI_TP_P2

UART_TXD2

eMMC_D5

PWM_CH2

GPIO20

23

MDI_TN_P2

UART_RXD2

eMMC_D4

PWM_CH3

GPIO21

24

MDI_TP_P3

SD_WP

eMMC_WP

GPIO22

25

MDI_TN_P3

SD_CD

eMMC_CD

GPIO23

26

MDI_RP_P3

SD_D1

eMMC_D1

GPIO24

9

HLK-RM08S

27

MDI_RN_P3

SD_D0

eMMC_D0

GPIO25

28

MDI_RP_P4

SD_CLK

eMMC_CLK

GPIO26

29

MDI_RN_P4

SD_CMD

eMMC_CMD

GPIO28

30

MDI_TP_P4

SD_D3

eMMC_D3

GPIO29

31

MDI_TN_P4

SD_D2

eMMC_D2

GPIO27

32

USB_DP

Default not available

33

USB_DM

Default not available

34

EPHY_LED4_N

JTAG_RST_N

GPIO30

Com 4 status led

35

EPHY_LED2

JTAG_TMS

GPIO32

Com 2 status led

36

EPHY_LED0

JTAG_TDO

GPIO34

Com 0 status led

37

GND38GND

39

3.3V

Suggested external

power supply current≥

500mA

40

3.3V

41

WLED_N

GPIO35

WiFi status LED

42

EPHY_LED1

JTAG_TDI

GPIO33

Com 1status LED

43

EPHY_LED3

JTAG_CLK

GPIO31

Com 3status LED

44

PORST_N

WIFI reset

45

WDT_RST_N

GPIO37

Watchdog timeout reset

46

UART_TXD1

PWM_CH0

GPIO45

Default is serial port

TR

47

UART_RXD1

PWM_CH1

GPIO46

Default is serial port

TR

48

REF_CLK0

GPIO38

Reference clock output

49

PERST_N

GPIO36

PCIe device reset

50

I2C_SD

GPIO5

51

I2C_CLK

GPIO4

52

GND

53

ANT

Default not connected

54

GND

10

HLK-RM08S

Notes：

1，All pins default 1

2，IO drive current is 4mA

3，All TTL is 3.3V

5. Dimensions

Introductions：

1，The size of the module is length 1mm,width 1mm,space 1.4mm , depth 1.8mm.

2，The thickness of the module is 1.8mm.

3, The noted numbers in the picture is the actual size of module,do recommended pad extension around

1mm, internal heat shrink 0.2mm pad, internal thermal pad grounding once do encapsulation.

Do when the package recommended pad extension around the 1mm, 3 internal heat shrink 0.2mm pad,

internal thermal pad grounding.

HLK-RM08S Drawing

FCC Warning

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

NOTE: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance.

Note 1: This module certified that complies with RF exposure requirement under mobile or fixed condition, this module is to be installed only in mobile or fixed applications.

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. Transmitting devices designed to be used by consumers or workers that can be easily re-located, such as wireless devices associated with a personal computer, are considered to be mobile devices if they meet the 20 centimeter separation requirement.

A fixed device is defined as a device is physically secured at one location and is not able to be easily moved to another location.

Note 2: Any modifications made to the module will void the Grant of Certificatio n, t his module is limited to OEM installation only and must not be sold to end-users, end-user has no manual instructions to remove or install the device, only software or operating procedure shall be placed in the end-user operating manual of final products.

Note 3: Additional testing and certification may be necessary when multiple modules are used.

Note 4: The module may be operated only with the antenna with which it is authorized. Any antenna that is of the

same type and of equal or less directional gain as an antenna that is authorized with the intentional radiator may be marketed with, and used with, that intentional radiator.

Note 5: To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, ShenZhen HaiLingKe Electronic co., Ltd. shall provide guidance to the host manufacturer for compliance with the Part 15B requirements.

Note 6: FCC ID label on the final system must be labeled with “Contains FCC ID: 2AD56HLK-RM08S” or “Contains transmitter module FCC ID: 2AD56HLK-RM08S”.

ShenZhen HLK RM08S User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual