S102S02 Series
S202S02 Series
■ Features
IT(rms)≤8A, Zero Cross type
SIP 4pin
Triac output SSR
1. Output current, IT(rms)≤8.0A
2. Zero crossing functionary (VOX : MAX. 35V)
3. 4 pin SIP package
4. High repetitive peak off-state voltage
(V
DRM
: 600V, S202S02 Series)
(V
DRM
: 400V, S102S02 Series)
5. High isolation voltage between input and output
(V
iso
(rms) : 4.0kV)
6. Lead-free terminal components are also available
(see Model Line-up section in this datasheet)
7. Screw hole for heat sink
■ Description
S102S02 Series and S202S02 Series Solid State
Relays (SSR) are an integration of an infrared emitting
diode (IRED), a Phototriac Detector and a main output
Triac. These devices are ideally suited for controlling
high voltage AC loads with solid state reliability while
providing 4.0kV isolation (V
iso(rms)
) from input to
output.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
S102S02 Series
S202S02 Series
■ Agency approvals/Compliance
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
3. Power control in applications such as lighting and
temperature control equipment.
■ Applications
1.
Recognized by UL508, file No. E94758 (as models No.
S102S02/S202S02)
2. Approved by CSA 22.2 No.14, file No. LR63705 (as
models No.
S102S02/S202S02
)
3. Package resin : UL flammability grade (94V-0)
Sheet No.:D4-A02401EN
Date Apr. 28. 2004
© SHARP Corporation
∗
Non-zero cross type is also available. (S102S01 Series/
S202S01 Series)
∗
: Do not allow external connection.
( ) : Typical dimensions
■ Internal Connection Diagram
1
1 2 3 4
2
3
4
Output (Triac T2)
Output (Triac T1)
Input (+)
Input (−)
Zero Crossing Circuit
2
■ Outline Dimensions
(Unit : mm)
S102S02
12 43
5.5
±0.2
0.6
±0.1
18.5
±0.2
4-1.1
±0.2
4-1.25
±0.3
4-0.8
±0.2
16.4
±0.3
(5.08) (7.62) (2.54) (1.4)
5.0
±0.3
19.6
±0.2
(36.0)
3.2
±0.2
4.2
MAX.
11.2
MIN.
Common to pin No.1
Common to pin No.1
φ3.2
±0.2
+
8A125VAC
∗
−
Model No.
UL mark
CSA mark
Date code (2 digit)
Epoxy resin
S102S02
0.2
MAX.
S202S02
12 43
5.5
±0.2
0.6
±0.1
18.5
±0.2
4-1.1
±0.2
4-1.25
±0.3
4-0.8
±0.2
16.4
±0.3
(5.08) (7.62) (2.54) (1.4)
5.0
±0.3
19.6
±0.2
(36.0)
3.2
±0.2
4.2
MAX.
11.2
MIN.
Common to pin No.1
Common to pin No.1
φ3.2
±0.2
+
8A250VAC
∗
−
Model No.
UL mark
CSA mark
Date code (2 digit)
Epoxy resin
S202S02
0.2
MAX.
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
Product mass : approx. 6.3g Product mass : approx. 6.3g
Date code (2 digit)
Rank mark
There is no rank mark indicator and currently there are no rank offered for this device.
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
·
·
·
·
2nd digit
Month of production
1st digit
Year of production
Country of origin
Japan
3
repeats in a 20 year cycle
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
■ Electro-optical Characteristics
Parameter Symbol Unit
Input
Output
(Ta=25˚C)
Forward voltage
Reverse current
Repetitive peak OFF-state current
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
Critical rate of rise of OFF-state voltage at commutaion
Minimum trigger current
Isolation resistance
Zero cross voltage
Turn-on time
Turn-off time
Thermal resistance
V
F
I
R
I
DRM
VT(rms)
I
H
dV/dt
(dV/dt)c
I
FT
R
ISO
V
OX
t
on
t
off
Rth(j-c)
R
th
(j-a)
V
µA
µA
V
mA
V/µs
V/µs
mA
Ω
V
ms
ms
˚C/W
I
F
=20mA
V
R
=3V
V
D=VDRM
IT(rms)=2A, Resistance load, IF=20mA
−
V
D
=2/3•V
DRM
Tj=125˚C, VD=2/3•V
DRM
, dIT/dt=−4.0A/ms
VD=6V, RL=30Ω
DC500V, 40 to 60%RH
IF=8mA
VD(rms)=100V, AC50Hz
I
T
(rms)=2A, Resistance load, IF=20mA
V
D
(rms)=200V, AC50Hz
I
T
(rms)=2A, Resistance load, IF=20mA
V
D
(rms)=100V, AC50Hz
I
T
(rms)=2A, Resistance load, IF=20mA
V
D
(rms)=200V, AC50Hz
I
T
(rms)=2A, Resistance load, IF=20mA
Between junction and case
Between junction and ambient
Conditions MIN. TYP. MAX.
Transfer
charac-
teristics
S102S02
S202S02
S102S02
S202S02
−
−
−
−
−
30
5
−
10
10
−
−
−
−
−
−
−
1.2
−
−
−
−
−
−
−
−
−
−
−
−
−
4.5
40
1.4
100
100
1.5
50
−
−
8
−
35
10
10
10
10
−
−
■ Absolute Maximum Ratings
4
Parameter Symbol Rating Unit
Input
Output
(Ta=25˚C)
Forward current
Reverse voltage
RMS ON-state current
Peak one cycle surge current
Repetitive
peak OFF-state voltage
Non-Repetitive
peak OFF-state voltage
Critical rate of rise of ON-state current
Operating frequency
Isolation voltage
Operating temperature
Storage temperature
Soldering temperature
*2
*1
I
F
V
R
IT(rms)
I
surge
VDRM
VDSM
dIT/dt
f
V
iso
(rms)
T
opr
T
stg
T
sol
mA
V
A
A
V
V
A/µs
Hz
kV
˚C
˚C
˚C
*3
*3
*4
50
6
8
80
400
600
400
600
50
45 to 65
4.0
−25 to +100
−30 to +125
260
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave, T
j
=25˚C start
S102S02
S202S02
S102S02
S202S02
S102S02 Series
S202S02 Series
Soldering area
1.5mm
Sheet No.: D4-A02401EN
Shipping Package
Model No.
Case
200pcs/case
S102S02F
I
FT
[mA]
(V
D
=6V,
R
L
=30Ω)
MAX.8
400
S202S02F
MAX.8
600
V
DRM
[V]
5
Please contact a local SHARP sales representative to see the actual status of the production.
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
■ Model Line-up (1) (Lead-free terminal components)
■ Model Line-up (2) (Lead solder plating components)
Shipping Package
Model No.
Case
200pcs/case
S102S02
I
FT
[mA]
(V
D
=6V,
R
L
=30Ω)
MAX.8
400
S202S02
MAX.8
600
V
DRM
[V]
6
S102S02 Series
S202S02 Series
0
60
50
40
30
20
10
Forward current I
F
(mA)
Ambient temperature Ta (˚C)
−25 1251007550250
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Sheet No.: D4-A02401EN
−25 0
25
50 75 100 125
0
1
2
3
4
5
6
7
8
9
10
RMS ON-state current I
T
(rms)(A)
Ambient temperature Ta (˚C)
(2)(3)(4)
(5)
(6)
(1)
(1) With infinite heat sink
(2) With heat sink (200×200×2mm Al plate)
(3) With heat sink (100×100×2mm Al plate)
(4) With heat sink (75×75×2mm Al plate)
(5) With heat sink (50×50×2mm Al plate)
(6) Without heat sink
(Note) In natural cooling condition, please locate Al plate
vertically, spread the thermal conductive silicone
grease on the touch surface of the device and tighten
up the device in the center of Al plate at the torque
of 0.4N•m.
100
10
1
0 1.0 2.0
Forward current I
F
(mA)
Forward voltage VF (V)
Ta=100˚C
25˚C
50˚C
75˚C
0˚C
−25˚C
Fig.4 Forward Current vs. Forward VoltageFig.3 RMS ON-state Current vs.
Case Temperature
0
2
4
6
8
10
RMS ON-state current I
T
(rms)(A)
Case temperature Tc (˚C)
−25 0 25 50 75 100 125
7
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
10
−9
10
−8
10
−7
10
−6
10
−4
10
−5
−25 0 25 50 75 100
Repetitive peak OFF-state current I
DRM
(A)
Ambient temperature Ta (˚C)
V
D
=400V
(S102S02)
V
D
=600V
(S202S02)
S102S02
S202S02
Remarks : Please be aware that all data in the graph are just for reference.
Fig.7 Minimum Trigger Current vs.
Ambient Temperature
Fig.6 Maximum ON-state Power Dissipation
vs. RMS ON-state Current
0
2
4
6
8
10
−25 0 25 50 75 100
Minimum trigger current I
FT
(mA)
Ambient temperature Ta (˚C)
V
D
=6V
R
L
=30Ω
024681012
0
12
10
8
6
4
2
RMS ON-state current I
T
(rms)(A)
Maximum ON-state power dissipation (W)
Ta=25˚C
Fig.5 Surge Current vs. Power-on Cycle
10
0
20
40
60
80
100
1
100
f=50Hz
T
j
=25˚C Start
Surge current I
surge
(A)
Power-on cycle (Times)
8
S102S02 Series
S202S02 Series
■ Design Considerations
In order for the SSR to turn off, the triggering current (lF) must be 0.1mA or less.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation,
please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit vales to start with : Cs=0.022µF and Rs=47Ω. The operation of the SSR
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly.
When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops
in current are not accompanied by large instantaneous changes in voltage across the Triac.
This fast change in voltage is brought about by the phase difference between current and voltage.
Primarily, this is experienced in driving loads which are inductive such as motors and solenoids.
Following the procedure outlined above should provide sufficient results.
For over voltage protection, a Varistor may be used.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main output triac as possible.
Particular attention needs to be paid when utilizing SSRs that incorporate zero crossing circuitry.
If the phase difference between the voltage and the current at the output pins is large enough, zero crossing
type SSRs cannot be used. The result, if zero crossing SSRs are used under this condition, is that the SSR
may not turn on and off irregardless of the input current. In this case, only a non zero cross type SSR should
be used in combination with the above mentioned snubber circuit selection process.
The load current should be within the bounds of derating curve. (Refer to Fig.2)
Also, please use the optional heat sink when necessary.
In case the optional heat sink is used and the isolation voltage between the device and the optional heat sink
is needed, please locate the insulation sheet between the device and the heat sink.
When the optional heat sink is equipped, please set up the M3 screw-fastening torque at 0.3 to 0.5N•m.
In order to dissipate the heat generated from the inside of device effectively, please follow the below suggestions.
● Design guide
Sheet No.: D4-A02401EN
● Recommended Operating Conditions
Parameter
S102S02
S202S02
Symbol Unit
Input
Output
Input signal current at ON state
Input signal current at OFF state
Load supply voltage
Load supply current
Frequency
Operating temperature
I
F
(ON)
IF(OFF)
V
OUT
(rms)
I
OUT
(rms)
f
T
opr
mA
mA
V
mA
Hz
˚C
−
−
−
Locate snubber circuit between output terminals
(Cs=0.022µF, Rs=47Ω)
−
−
Conditions
(∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
16
0
80
80
0.1
47
−20
24
0.1
120
240
I
T
(rms)
×80%(
∗
)
63
80
MIN. MAX.
9
S102S02 Series
S202S02 Series
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
● Standard Circuit
Tr1
R
1
D
1
V
1
+V
CC
AC Line
Load
Z
S
ZS : Surge absorption circuit (Snubber circuit)
SSR
3
4
1
2
S102S02
S202S02
Sheet No.: D4-A02401EN
● Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
(a) Make sure there are no warps or bumps on the heat sink, insulation sheet and device surface.
(b) Make sure there are no metal dusts or burrs attached onto the heat sink, insulation sheet and device sur-
face.
(c) Make sure silicone grease is evenly spread out on the heat sink, insulation sheet and device surface.
Silicone grease to be used is as follows;
1) There is no aged deterioration within the operating temperature ranges.
2) Base oil of grease is hardly separated and is hardly permeated in the device.
3) Even if base oil is separated and permeated in the device, it should not degrade the function of a device.
Recommended grease : G-746 (Shin-Etsu Chemical Co., Ltd.)
: G-747 (Shin-Etsu Chemical Co., Ltd.)
: SC102 (Dow Corning Toray Silicone Co., Ltd.)
In case the optional heat sink is screwed up, please solder after screwed.
In case of the lead frame bending, please keep the following minimum distance and avoid any mechanical
stress between the base of terminals and the molding resin.
Some of AC electromagnetic counters or solenoids have built-in rectifier such as the diode.
In this case, please use the device carefully since the load current waveform becomes similar with rectangular waveform and this results may not make a device turn off.
4.4mm MIN.
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering (No solder bathing)
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please solder within one time.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
11
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
● Presence of ODC
■ Package specification
12
Molt plane
Partition
Pad
Packing case
Cushioning material
Product
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
Package materials
Packing case : Corrugated cardboard
Partition : Corrugated cardboard
Pad : Corrugated cardboard
Cushioning material : Polyethylene
Molt plane : Urethane
Package method
The product should be located after the packing case is partitioned and protected inside by 4 pads.
Each partition should have 5 products with the lead upward.
Cushioning material and molt plane should be located after all products are settled (1 packing contains 200
pcs).
Package composition
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
13
■ Important Notices
S102S02 Series
S202S02 Series
Sheet No.: D4-A02401EN
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