SHAR
APPROVED BY: DATE:
ELECTRONIC COMPONE
GROUP SHARP CORPORATION
SPECIFICATION
.DEVICE SPECIFICATION FOR
VOLTAGE REGULATOR
I
MODEL No.
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PQ070xz012
1. These specification sheets include materials protected under copyright of Sharp Corporation (‘Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specihcation sheets. as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximrim ratings
and the instructions included in these specification sheets. and the precautions mentioned below.
(Precautions)
(1) This product is designed for use in the following application areas ;
l
OA equipment * Audio visuaI equipment l Home appliances
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines - Computers
[
If the use of the product in the above application areas is for equipment listed in paragraphs
(21 or (3). please be sure to observe the precaulions given in those respective paragraphs.
Applied model name
PQ070XZO 122
1 1 PQO7OXZO IZP 1 1
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(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for
safety in function and precision. such as :
* Transportation control and safety equipment (aircraft. train. automobile etc.)
* TrafIIc signals * Gas leakage sensor breakers * Rescue and security equipment
- Other safety equipment
[
(31 Please do not use this product for equipment which require extremely-high reliability
and safety in function and precision. such as :
s
Space equipment * Telecommunication equipment (for trunk lines)
- Nuclear power control equipment
[
(4) Please contact and consuit with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
I. Please contact and consult with a Sharp sales representative for any questions about this product
CUSTOMER’S APPKOVAL
DATE
BY
eqUi~Jmcr1~
* Medical equipment
which demands high reliability and
DATE
PRESENTED
BY
K. Hachimura.
Department General Managcr of
Enginrerin~ Dept..11
Opto-Electronic Devices Div.
ELECDM Grottp
SHARP CORPORATION
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SHflRP CORPORATION
1. Application
This specification applies to the outline and characteristics of series regulator (linear type),
Model No. PQ070XZO 12.
Usage
PQO7OXZOlZ is the device for stabilization of positive output voltage with built-in
ON/OFF function, the over current protectfon function, the overheat
protection function, adjustable DC output voltage by using external resistance
and low consumption current at OFF-state (stand-by). These devices are possible
to use in power supply circuit up to current capacity l.OA.
Block diagram
Vin
Vadj
CND
2. Outline : Refer to the attached sheet, Page 3.
3. Ratings and characteristics :
Refer to the attached sheet, page 4 to 8.
3.1 Absolute maximum ratings
3.2 Electrical characteristics
3.3 Electrical characteristf cs measuring circuit
3.4 Pd-Ta rating (Typical value)
4. Reliability : Refer to the attached sheet, Page 9. 10.
5. Outgoing inspection : Refer to the attached sheet, Page 10.
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SHRHP CORPORflTION
6. Supplement : Refer to the attached sheet, Page 11 to 17.
6.1 Example of application
6.2 Output voltage adjustment characteristics
6.3 Taping and reel packaging (PQ070XZO IZPI
6.4 Sleeve packaging (PQ070XZO 122)
6.5 ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process
for this product.
Materials for ODS :
CFC,, Halon, Carbon tetrachloride,
1.1-l -Trichloroethane (Methylchloroform)
6.6 Brominated flame retardants
Specific brominated flame retardants such as the PBBOs and PBB, are not used
in this device at all.
6.7 This product is not designed as electromagnetic and ionized-particle radiation resistant.
7. Notes : Refer to the attached sheet, Page 18 to 2 1.
7.1 External connection
7.2 Thermal protection design
7.3 Static electricity
7.4 Soldering
7.5 For cleaning
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SHMP CORPORFITION
2. Outline
Applied
model No.
(,9,,&01z2 r 070xz01 1
Pyo7oxzo 1 ZP
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Marked
model No.
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o7oxzo 1
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h
ii DC inptt (Vin)
,?. ON/OFF control WC)
j-1 DC output (Vo)
4 output voltage
adjust.ment (Vadj)
5. GND
- [ 1 : TYP.
- Unit : mm
*Scale: 5/1
- Lead finish : Solder plating
- Lead material : CII’
* Product mass : 0.3g
SHflRP CtlRPORflTION
3. Ratings and characteristics
3.1 Absolute maximum ratings
Ta=25%
Parameter
Input voltage
ON/OFF control voltage
P 11
Symbol
Vin
vc
Rating Unit Conditions
IO V
10 V
P 1)
Output adjustment pin
voitage
t*u
Output current
Power dissipation
(*a
Junction temperature (*3)
Operating temperature
Storage temperature
Soldering temperature
Vadj
IO
Pd
-Cl
Topr
Tstg
Tsol
8 W Refer to Fig. 1
150
-40 to +85
-40 to +150 %
260 % For 10 s
(* 1) All are open except GND and applicable terminals.
5 V
1 A
%
‘C
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(*2) Pd : With infinite heat sink
(‘31 There is case that over heat protection operates at the condition Tj=125C to 15o’C
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SHARP CORPORATION
Power
dissipation
Pd WI
Fig. 1 Pd - Ta rating
Ambient temperature Ta (C)
Pd : With infinite heat sink
(Note) There is case that over heat protection function operates at oblique line portion.
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SHflRP CORPORflTI ON
3.2 Electrical characteristics
Unless otherwise specified condition shall be
Vin=SV. Vo=3V (Rl=lkQ). Io=O.SA. Vc=2.7V
Ta=25%
Parameter
Input voltage
Output voltage
Load regulation
Line regulation
Ripple rejection
Dropout voItage
Reference voltage
Temperature coefficient
of reference voltage
On-state voltage for
control
On-state current for
control
Symbol MIN. TYP. MAX. Unit Conditions
Vin
vo 1.5 - 7 V
RegL - 0.2 2.6 % Io=FimA to l.OA
RegI - 0.2 1.0 % Vin=4 to 8V
RR 45 60 - dB Refer to Fig.3
Vi-o - - 0.5 v Vin=2.85V, lo=O.tiA
Vref
TcVref - fl.O - % Tj=O to 125%
Vc (on) 2.0 - - V
lc (on) - -
2.35 - 10 V
10=5mA
1.225 1.25 1.275 V
io=5mA
t*41
200 pA
Off-state voltage for
control
Off-state current for
control
Quiescent current
Output off-state
consumption current
(*4) In case of opening control terminal (2th pin), output voltage turns OFF.
vc (on) - - 0.8 V
Ic (OffI - -
19
Iqs - -
1
2
1/
t.
2 mA to:OA
5
Io=OA
Io=OA, Vc=O. 4V
PA
t
vc=o.4v
PA
SHflRP CORPORATION
3.3 Electrical characteristics measuring circuit
Fig. 2 Standard measuring circuit of Regulator portion
Vo=VrefX( l+R2/RI)
~1.25X(1+IU/RlI
(Rl=lkQ, Vref+1.25Vl
Vin
I----+
-
n
/
0, 833
Fig. 3 Standard measuring circuit of critical rate of ripple rejection
f= 120Hz sine wave
ei(rms)=0.5V
Vin=5V
Vo=3V (Rl=IkR)
Io=O.3A
RR=20 1 og (ei(rms)/eo(rms))
I 1
r
r
R2
T T
1 $
vo
V
I:
Q
1
3
T T r
SHARP CORPORATION
Power
dissipation
Pd W’l
3.4 Pd - Ta rating (Typical value)
Ambient temperature Ta (‘Cl
Mounting PCB
Material : Class-cloth epoxy resin
Size : 50 X 50 X 1.6mm
Thickness of copper : 35 pm
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PC6
- Copper foil
SHARP CORPORATION
The reliability of products shall satisfy items listed below.
Contfdence level : 90%
LTPD : 10%/200/6
_ Test items
Temperature
cycling
Humidity
(Steady State1
Damp Heat cyclic
High temp. storage
Low temp. storage -40-C, 1 OOOh
Operation life Ta=25”C. Pd=0.8W, lOOOh
Mechanical shock 15000m/s2, 0.5ms
1 cycle -40C to + 150%
20 cycles test
+60% .9O%RH. lOOOh Vref>UX1.2 n=22. C=O
1 cycle : -20% to 70%
Transfer time between high
and low temp. is 1 h.
40 cycles test. 9O%RH
+150%. lOOOh RR< LX0.8 n=22. C=O
3 times/ +X. +Y. +Z
Test Conditions Failure Judgement
(30min) (30min)
(2hl @h)
Crl teria
Vref<LXO.8 n=22. C=O
RegL>UX 1.2
n=22. c=o
RegI>UX 1.2
n=22. C=O
Vi-o > UX 1.2
n=22. c=o
n=ll. C=O
Vibration
(Variable
frequency]
Electrostatic
discharge
Soldering heat
Robustness of
Termination
(Tensile test)
Robustness of
Termination
(Bending test)
Solderability
200m/s2,
100 to 2000 to lOOHz/4 min
4 times/ X. Y, 2 direction
+25OV, 200pF. OQ
Between GND and each
terminal/ 3 times
260°C. 10 s, Dip up to
0.5mm from resin portion ‘1
Weight: I ON
10 s/ each terminal ‘2
Weight: 2.5N
-go’ -0’ -go’ -0’
On
each terminal ‘3
23Ok5’C. 520.5 s
Use rogin Rux l l
U: Upper
specification
limit
L: Lower n=l1. C=O
specif,Qation i
limit
Failure if it has
breakdown and
loosened pin.
l 4
Failure if solder
shall not be adhere
at the area of 95% n=ll, C=O
or more dipped
portion. l 5
n=ll. C=O
1 I
n=ll. C=O
n=ll. C=O
n=i 1. C=O
SHARP CORPORATION
* 1 SoIdering area is shown
below.
*3 Terminal bending direction
is shown below. *4 Except for the bending of terminal.
OSmm
Weight
*5 Except for the portion within 0.5mm
from the interface between the heat
sink and the resin portion, and
the side surface of heat sink.
J,
Weight
5. Outgoing inspection
TABLE II-A single sampling plans for normal inspection based on&O 285$ is applied.
The AQL according to the inspection items are shown below.
Defect Inspection items AQL (o/o) Judgemen t
.
criteria
Major
defect
Minor
defect
Electrical characteristics
0.1
Unreadable marking
Depend on the
specihcation
Appearance
0.4
Dimensions
SHflRP CORPORATION
6. Supplement
6. I Example of application
DC input
T
Yin/ j-CM
-I-
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ON-OFF signal
R2
Rl
1kQ
High : Output ON
or Open : Output OFF
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T
+
zczco
VO
Load
-
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6.2 Output voltage adjustment characteristics
Rl=?kS2
I 1 I
output
v&age
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6.3 Packing specifications (PQ070XZO UPI
6.3.1 Packing conditions
(1) Tape structure and Dimensions (Refer to Fig. A)
The tape shall have a structure in which a cover tape is sealed heat-
_ pressed on the carrier tape of polystyrene emboss protect against
static electricity. Dimensions are shown Fig. A.
(2) Reel structure and Dimensions (Refer to Fig-B)
The reel shall be made of polystyrene. Dimensions are shown Fig. B.
(3) Direction of product insertion (Refer to Fig. C)
Product direction in carrier tape shall direct to the radiate fin of product at
the hole side on the tape.
6.3.2 Tape characteristics
( 1) Adhesiveness of cover tape
The peel-back force between carrier tape and cover tape shall be
0. IN to O.8N for the angle from 160’ to 180. . (Tape speed : 5mm/s)
(2) Bending strength
Sealed tape : Bended tape radius shall be more than 30mm.
If bended tape radius is less than 30mm.
there is case that cover tape come otf carrier tape.
(3) Carrier tape : Bended tape radius shall be more than 15mm.
6.3.3 Rolling method and quantity
(1) Rolling method
Wind the tape back on the reel so that the cover tape will be outside the tape.
Attach more than 20 pitch of empty cavities to the trailer and attach more than
10 pitch of empty cavities to the leader of the tape and fix the both ends with
adhesive tape.
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(2) Quantity
One reel shall contain 3000 PCS.
SHflRP CORPORATION
6.3.4
Indication
) Reel
(1
The reel shall be pasted
* Model No.
l
labei
with following information.
Number of pieces contained
(2) Package case
The outer packaglng case shall
l
l
Model No.
Number of pieces contained
6.3.5 Storage condition
Taped products
shall
be stored at the temperature lower than 5 to 30-C
and the humidities lower than 7O%RH. If taped products aren’t used
longer than for -10 days, Please rewind the tape pulled
6.3.6 Others
(1) joint of tape
The cover
tape
and carrier tape in one reel shal1 be jointless.
(21 The way to repair taped failure devices
* Production date
be
marked with following information.
* Inspection date
out
and storage.
The way to repair taped failure devices cut a bottom of carrier tape
with a cutter. and after replacing to good devices, the cutting portion
shall be sealed with adhesive tape.
Fig. A Tape structure and Dimensions
-
Dinwnsions :
Unit : mm
‘p/P. ValIW
SHRRP CORPURRTION
Fig. B Reei structure and Dimensions
March 7. 2000
Fig. C Direction of product insertion
Dimensions : TYP. value
Unit : mm
SHARP CORPORATION
6.4 Sleeve pat kaglng (PQ070XZO I ZZ)
6.4.1 Packing conditions
( 1) Sleeve structure and Dimensions (Refer to Fig. D)
The sleeve shall be made of high inpuct polethyiene
. (Plastics wtth preventing static electricity).
Dimensions are shown Fig. D.
(2) The packing case shall be made of corrugated cardboard.
Dimensions are shown Fig. F.
(3) Stopper structure
The stopper shall be made of styrene butadlene rubber.
6.4.2 Packaging method and quantity
(1) Packagfng method
Max. 75pcs. of products shall be packaged in a sleeve and both of
sleeve edges shall be fu<ed by stoppers. Fix the packing case by kraft tape.
(2) Quantity (Refer to Fig. E)
One package shall contain 3OOOpcs./package.
6.4.3 indication
(1) Packing case
The packing case shall be marked with following information.
* Model No. * Number of pieces contained * Inspection date
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Fig. D
2Sleeve
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$Stopper (With pulled portion)
Fig. E
Fig. F
4 0 sleeves ( 1 0 IinesX
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(568)
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’ Inspection date
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SHflRP CORPORRTlON
7. Notes
7.1 External connection
C-MOS or TTL
(11 Please perform shortest wiring for connection between Cin, Co and the
individual terminal or fin. There is case that oscillation occurs easily by kinds
of capacitor and capacity. Before you use this device, you should confirm
output voltage on your use mounting state.
(2) The input terminal for ON/OFF output control : ‘2’ is compatible with LS-TTL.
and direct driving by TTL or C-MOS standard logic (RCA 4000 series) is
also available. In case that ON/OFF terminal is not used. we recommend
to connect the ON/OFF terminal directly to the input terminal : i input voltage.
(3) As voltage application under conditions that the device pin is inserted divergently or
reversely, may occur the degradation of characteristics or breakdown of the device,
please avoid it absolutely.
7.2 Thermal protection design
Internal power dissipation (Pd) of device is obtained by the following eflriation.
Pd=IoX(Vin-Vo)+VinXlq
If the ambient temperature and Pd at the device operating state.
make the thermal design enough to radiate the heat as allows the device to operate
within the safety operation area specified by the derating curve in para. 3.4.
Insufficient radiation gives an unfavorable intluence to the normal operation
and reliability of the device.
In the case of no passage within the safety operational territory illustrated
by the derating curve. the overheat protection circuit operates to
let output fall down, please avoid keeping such condition for a long time.
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Good caution must be exercised against static electricity since this device
consists of a bipolar IC. Following-are some examples of preventive measures
against excessive voltages such as caused by static electricity.
(a) Human body must be grounded to discharge the static electricity from the body
or cloth.
(b) Anything that is in contact with the device such as workbench,
inserter. or measuring instrument must be grounded.
(c) Use a solder dip basin with a minimum leak current
(isolation resistance 10MQ or more) from the commercial power supply.
Also the solder dip basin must be grounded.
7.4 Soldering
(I) Reflow soIdering
It is recommended that within two times soldering be done at the temperature
and the time within the temperature profile as shown in the figure.
(The temperature shown in the figure is fin portion temperature of the device.)
It is recommended that the second reflow become at the device which is the
room temperature.
(a) An infrared lamp used to heat up for soldering may cause a
localized temperature rise in the resin. The temperature of
resin portion should be with in the temperature profile below.
(b) The temperature sloping when soldering-reflow is 4C /s or less.
240°C
180°C
25%
3nnnr Lunrunnl fu(*
(21 Dip soldering
We recommend that solder dip should be 260% (Bolder temp.) 10s or less and 1 time only.
Please obey the note items below concerning solder reflow.
(a) After solder dip. please do cooling naturally.
(bl Please shaIl not give the mechanical stress or the impact stress to the device.
(3) Hand soldering
This device is basically designed for the soldering such as reflow soldering or dip soldering.
In case when hand soldering is reluctantly needed for modification etc.,
it is recommended that only one hand soldering should be done at 260°C or less
of soldering iron edge. temperature. for 10s or less. Please be careful not to touch
soldering iron edge to leads directly etc. in order not to give any stress to the leads.
Even within the above conditions regarding solder reflow, solder dip or hand soldering
there is the possibility that the stress given to the terminals by the deformation of P(X3 makes
the wire in the device package cut. In advance, please confirm fully at the actual application.
7.5 For cleaning
(1) Solvent cleaning : Solvent temperature 45% or less
immersion for 3 min or less
(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size. ultrasonic power
output, cleaning time. PCB size or device mounting
condition etc. Please test it in actual using condition
and confhm that doesn’t occur any defect before starting
the ultrasonic cleaning.
(3) Applicable solvent : Ethyl alcohol. Methyl alcohol, Isopropyl alcohol
In case when the other solvent is used. there are cases that
the packaging resin is eroded. Please use the other solven,t
after thorough confirmation is performed in actual using condition. ’
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SHRRP CORPORfnIUN
7.6 Output voltage fine tuning
Connecting external resistors R1 and R2 to terminals 3 , 4 . 5 ailows
the output voltage to be fine tuned from 1.5V to 7. Refer to the tlgure
below and “Paragraph 6.3 Output voltage adjustment characteristics” when
connecting external resistors t’or
Ane
tuning output voltage.
+R2/RI)
+1.25x( 1+R2/ 1000)
(RI=lkR. Vref+1.25VI
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