Sharp LT1W67A Datasheet

Full Color Leadless Chip LED Device

1.6

0.3

0.5

0.3

Relative luminous intensity(%)

Relative luminous intensity(%)

LT1W67A

(Under Development)

LT1W67A

1616 Size, 0.8mm Thickness,
Compact Full Color Leadless
Chip LED Device

■ Outline Dimensions

±0.15

1.6

1.0

3

±0.15

1.6
4

(0.4)

(0.6)

2

1

1.2

1.0

0.8

Recommended PWB pattern for soldering

Soldering area

1.2 1.20.6

1.Plating area
Resist

2.Pin connections
1 Anode(Yellow-green)
2 Anode(Red)
3 Anode(Blue)
4 Cathode(Common)

3.Unspecified tolerance:±0.2

(Unit : mm) (Ta=25˚C)

■ Radiation Diagram

-40˚

Yellow-green

-60˚

-80˚

-40˚

-60˚

-80˚

-20˚ +20˚

-20˚ +20˚

0˚

100

80

60

40

20

X

0˚

100

80

60

40

20

+40˚

Red

+60˚

+80˚

+40˚

Blue

+60˚

+80˚

X

Y

■ Absolute Maximum Ratings

Model No.

LT1W67A

Radiation color

Blue
Yellow-green
Red

Power dissipation

Radiation material

GaN on SiC
GaP
GaAsP on GaP

*1

P

(mW)

200

84
84

Forward current

IF

(mA)

30
30
30

Peak forward current

IFM

(mA)

100

50
50

*1 The value is specified under the condition that either color is lightened separately.
When all diodes are lightened simultaneously, the power dissipation of each diode should be less than 30% of the value specified in this table.
*2 Duty ratio=1/10, Pulse width=0.1ms
*3 For 3s or less at the temperature of hand soldering. Temperature of reflow soldering is shown on the below page.

*2

Derating factor

(mA/˚C)

DC Pulse

0.67

1.33

0.40

0.67

0.40

0.67

Reverse voltage

VR

(V)

5
5
5

Operating temperature

Topr

(˚C)

-30 to +85

-30 to +85

Storage temperature

Tstg

(˚C)

-40 to +100

-40 to +100

-30 to +85 -40 to +100

■ Electro-optical Characteristics

Lens

type

Milky

diffusion

Model No.

LT1W67A

Radiation

color

Blue
Yellow-green

Red

Forward voltage

VF(V)

TYP MAX

4.4

2.1

2.0

Peak emission wavelength

λp(nm)

TYP

5.6

2.8

2.8

430
565
635

I

F

(mA)

20
20
20

Luminous intensity

I

V(mcd)

TYP

6.5

13.0

8.5

IF

(mA)

20
20
20

Spectrum radiation bandwidth

∆λ(nm)

TYP

(mA)

70
30
35

Reverse current

IF

20
20
20

I

R(µA)

MAX

10
10
10

V

(V)

R

4
4
4

Terminal capacitance

C

t(pF)

(MH

TYP

50
35
20

(T

Soldering temperature

Tsol

(˚C)

260
260
260

(Ta=25˚C)

characteristics

Z)

1
1
1

a=25˚C)

*3

Page for

diagrams

----

----

----

(Notice) ¡
(Internet) ¡Data for sharp's optoelectronic/power device is provided for internet.(Address http://www.sharp.co.jp/ecg/)

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.