Sharp LT1F67AF Datasheet
ELEC-XROMC COMI’ONEXTS GROUP
SW CORPORATION
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DEVICE SPECIFICATION FOR
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Light Emitting Diode
MODEL No.
LTlF67AF
1
1. These specification sheets include materials protected under the copyrjght of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without S* consent
2. When using this product, please 0bsen.e the absolute maximum ratin&!q.nd the instructions for use outlined
in these specification sheets, as well as the precautions mentioned bei@%. Sharp assumes no responsibility
for any damage resulting from use of the product which does not
and the instructions inchrded in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the foUowtig application areas;
* OA equipment * Audio visual equipment * Home tippliance
* Telecommunication equipment (Terminal)
* Tooling machines * Computers
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If the use of the product in the above application areas is for equipment listed in paragraphs .
(2) or (3), please be sure to observe the precautions given ixi those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safec design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which d&$nds high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, t@n, automobile etc.)
* Traffic signals * Gas leakage sensor breakers
* Other safety equipment
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(3) Please do not use this product for equipment which require extremely high reliability
and safety in fnnction and precision, such as ;
* Space equipment * Tekcommunication equipment (for trunk lines)
+ Nuclear power control equipment
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(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
* Medical equipment
* Measur@g.equipment
. . .
c&r+&
tith the absolute maximum ratings
Ii:. )
.
3
* R@ue and security equipment
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1 .
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
PRESENTED BY:
Department General Manager of
Enginewing Dept.,BI
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
hp. & I t?b
:
This data sheet is to introduce the light emitting diode device’
Model No. LTlF61.G. delivered
to
l.Structure and characteristics
Structure: CaP gellorgreen chip LED device
Outline dimensions and pin connections:
Taping specification:
Packing specification:
Soldering method:
@ate l.)Duty ratio=l/lO, Pulse width*. lm~
See page 2
See page 3
See page 7
See page 8
4 5 6
(Note 2)Tore!ance: 415%
4. Luminous intensity rank .
(Ta=25”C)
Condition
c 19.7 -
24. 0
H 22.1 - 26. 9
I 24.7 - 30. I mcd
J 27.7 -
K 31.0
L 34.7 -
- 37. 0
33.7 .
42. 4
IF=201n4
t
.olerance; f 15?
Cvote 3)Measured by SH.UP EC&C ~lODEL660 (RadiometeriPhotometersystem)
1. Plated.
j!:.;
ReqJ area
2.
Pin Conection
area
M
bxq
0 Cathode
@ Anode
0-0
3. Unspecified tel. to be
Outline dimensions and
terminal connections
iO.1
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