SHARP LQ315T3LZ23 Specification

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RECORDS OF REVISION

MODEL No : LQ315T3LZ23
SPEC No : LD-17408

Date Revised No. PAGE SUMMARY NOTE

2005.05.10 - - 1st Issue

2005.05.17 A

P.12

Changed the sentence P.10

Deleted the sentence
(When vertical period is very long, ~)
Added the vertical frequency

2nd Issue

(Reliability and lifetime ~ -> Display works ~)

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1. Application

This specification applies to the color TFT-LCD module LQ315T3LZ23.

* These specification sheets are proprietary products of SHARP CORPORATION (“SHARP”) and include materials
protected under copyright of SHARP. Do not reproduce or cause any third party to reproduce them in any form or by
any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of
SHARP.

* In case of using the device for applications such as control and safety equipment for transportation (aircraft, trains,

automobiles, etc.), rescue and security equipment and various safety related equipment which require higher
reliability and safety, take into consideration that appropriate measures such as fail-safe functions and redundant
system design should be taken.

* Do not use the device for equipment that requires an extreme level of reliability, such as aerospace applications,

telecommunication equipment (trunk lines), nuclear power control equipment and medical or other equipment for
life support.

* SHARP assumes no responsibility for any damage resulting from the use of the device which does not comply with

the instructions and the precautions specified in these specification sheets.

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LD- 17408-1

* Contact and consult with a SHARP sales representative for any questions about this device.

2. Overview

This module is a color active matrix LCD module incorporating amorphous silicon TFT (T
composed of a color TFT-LCD panel, driver ICs, control circuit, power supply circuit, inverter circuit and back light

system etc. Graphics and texts can be displayed on a 1366×RGB×768 dots panel with 16,777,216 colors by
using LVDS (Low Voltage Differential Signaling) to interface, +5V of DC supply voltages and supply voltage for
back light.
This module also includes the DC/AC inverter to drive the CCFT . (+24V of DC supply voltage)
And in order to improve the response time of LCD, this module applies the O/S (over shoot) driving technology for
the control circuit .In the O/S driving technology, signals are being applied to the liquid crystal according to a
pre-fixed process as an image signal of the present frame when a difference is found between image signal of the
previous frame and that of the current frame after comparing them.
By using the captioned process, the image signals of this LCD module are being set so that image response can be
completed within one frame, as a result, image blur can be improved and clear image performance can be realized.

3. Mechanical Specifications

Parameter Specifications Unit

Display size

Active area 697.69 (H) x 392.26 (V) mm
Pixel Format 1366 (H) x 768 (V)

Pixel pitch 0.51075(H) x 0.51075 (V) mm
Pixel configuration R, G, B vertical stripe
Display mode Normally black
Unit Outline Dimensions *1 780.0(W) x 450.0(H) x Max 48.0(D) mm
Mass 6.4 +/- 0.3 kg
Surface treatment Anti-glare, low reflection coating

Hard coating: 2H
Haze: 23 +/- 5%

80.04 （Diagonal

31.5 （Diagonal

1pixel = R + G + B dot

（

）

）

）

hin Film Transistor). It is

cm

inch

pixel

(*1 )Outline dimensions are shown in Fig.1

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4. Input Terminals

4-1. TFT panel driving

CN1 (Interface signals and +5V DC power supply)

Using connector ：FI-X30SSL-HF (Japan Aviation Electronics Ind. , Ltd.)or

SM30B-LDYGLS-01(Japan Solderless Terminals MGF. Co., Ltd)

Mating connector ：FI-X30H,FI-X30C or FI-X30M (Japan Aviation Electronics Ind. , Ltd.)

Mating LVDS transmitter：THC63LVDM83A or equivalent device

Pin No. Symbol Function Remark

1 VCC +5VPower Supply
2 VCC +5VPower Supply
3 VCC +5VPower Supply
4 VCC +5VPower Supply
5 GND
6 GND
7 GND
8 GND
9 SELLVDS

10 NC
11 GND
12 RIN0­13 RIN0+
14 GND
15 RIN1­16 RIN1+
17 GND
18 RIN2­19 RIN2+
20 GND
21 CLKIN­22 CLKIN+
23 GND
24 RIN3­25 RIN3+
26 GND
27 R/L

28 U/D
29 Reserved

30 Reserved

Note

【



】

1. Shield case on the module’s back surface connects the GND of internal circuit.

2. It is recommend to connect all the GND terminals because of stable operation.

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(Shown in Fig.1)

Select LVDS data order 【Note1

Negative (-) LVDS differential data input
Positive (+) LVDS differential data input

Negative (-) LVDS differential data input
Positive (+) LVDS differential data input

Negative (-) LVDS differential data input
Positive (+) LVDS differential data input

ClockSignal(-)
ClockSignal(+)

Negative (-) LVDS differential data input
Positive (+) LVDS differential data input

Horizontalshiftdirection

Verticalshiftdirection

【

【

Note 2
Not Available
Not Available

Note 2

】

】

】

LD- 17408-2

Pull up

DefaultH:3.3V

LVDS
LVDS

LVDS
LVDS

LVDS
LVDS

LVDS
LVDS

LVDS
LVDS

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r

)

)

)

㪣㪚㪛㩷㪧㪘㪥㪜㪣
㪈㪊 㪍㪍㬍㪊㩿㪩㪞㪙㪀㬍㪎㪍㪏

㪁㫇 㪸㫅 㪼㫃㩷㪹㪸㪺 㫂

㪪㫆 㫌㫉㪺 㪼㩷 㪛 㫉㫀㫍㪼 㫉

㪞㪸㫋㪼㩷㪛㫉㫀㫍㪼㫉

㪚㫆 㫅 㫋㫉㫆 㫃㩷 㪧㪮㪙

㪠㫅 㫍㪼 㫉㫋㪼 㫉

㪙㪸 㪺㫂㩷㪣 㫀㪾㪿 㫋㩿㪚 㪚㪝 㪫㪀

㪠㫅 㫇㫌 㫋㩷 㪪㫀㪾㫅㪸 㫃

㪧㫆 㫎㪼 㫉㩷㪪 㫌㫇㫇㫃㫐

㪧㫆 㫎㪼 㫉㩷㪪 㫌㫇㫇㫃㫐

㪠㫅 㫇㫌 㫋㩷 㪪㫀㪾㫅㪸 㫃

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LD- 17408-3

【

Note1

SELLVDS

】

Transmitte

Pin No Data

51 TA0
52 TA1
54 TA2
55 TA3
56 TA4

3 TA5
4 TA6
6 TB0

7 TB1
11 TB2
12 TB3
14 TB4
15 TB5
19 TB6
20 TC0
22 TC1
23 TC2
24 TC3
27 TC4
28 TC5
30 TC6
50 TD0

2 TD1

8 TD2
10 TD3
16 TD4
18 TD5
25 TD6

SELLVDS

=L(GND)

R0(LSB)

R1
R2
R3
R4
R5

G0(LSB)

G1
G2
G3
G4
G5

B0(LSB)

B1
B2
B3
B4
B5

NC NC

(RSV1) (RSV1)

DE DE

R6 R0(LSB)

R7(MSB) R1

G6 G0(LSB)

G7(MSB) G1

B6 B0(LSB)

B7(MSB) B1

(NA) (NA)

=H(3.3V) or Open

R2
R3
R4
R5
R6

R7(MSB

G2
G3
G4
G5
G6

G7(MSB

B2
B3
B4
B5
B6

B7(MSB

㪚㪣㪢㪠㪥㪂
㪚㪣㪢㪠㪥㪄
㪩㪠㪥㪇㪄
㪩㪠㪥㪇㪂
㪩㪠㪥㪈㪄
㪩㪠㪥㪈㪂
㪩㪠㪥㪉㪄
㪩㪠㪥㪉㪂
㪩㪠㪥㪊㪄
㪩㪠㪥㪊㪂

㪩㪆㪣
㪬㪆㪛
㪪㪜㪣㪣㪭㪛㪪

㪝㫉㪸㫄㪼
㪦㪆㪪㫊㪼㫋
㪫㪼㫄㫇㩷㪊
㪫㪼㫄㫇㩷㪉
㪫㪼㫄㫇㩷㪈

㪂㪌㪭㩷㪛㪚

㪭

㪦㪥

㪭

㪙㪩㪫

㪂㪉㪋㪭㩷㪛㪚

㪂㪈㪉㪭㩷㪛㪚

㪚㪥㪈㪚㪥㪉

㪚㫆㫅㫋㫉㫆㫃㩷㪪㫀㪾㫅㪸㫃

㪧㫆㫎㪼㫉㩷㪪㫌㫇㫇㫃㫐
㪚㫀㫉㪺㫌㫀㫋

㪚㪥㪊

㪚㪥㪋㪃㪌

Block Diagram (LCD Module)

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LD- 17408-4

Internal circuits

R7

䱊

R0

8

LCD side)

-

(TFT

B7

G7

䱊

䱊

B0

G0

8

8

ENAB

CK

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↑

TTL

LVDS

PLL

䯵

side

ＴＶ

䯴

Rx1IN0+(13)

8

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G7

G0

Rx1CLKIN+(22)

Rx1IN0-(12)

Rx1IN1+(16)

Rx1IN1-(15)

Rx1IN2+(19)

Rx1IN2-(18)

Rx1IN3+(25)

Rx1IN3-(24)

↑

LVDS

8

8

R7

B7

䱊

R0

䱊

B0

䱊

TTL

ENAB

Rx1CLKIN-(21)

PLL

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CLK

Corresponding Transmitter:THC63LVDM83R(THine) etc.

controller

Interface block diagram

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NAN

NAN

NAN

NAN

SELLVDS= Low(GND)




CLKIN+

CLKIN-

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LD- 17408-5

1 cycle

RIN0+

RIN0-

RIN1+

RIN1-

RIN2+

RIN2-

RIN3+

RIN3-

SELLVDS= High(3.3V) or Open

CLKIN+

G0 R5 R4 R3 R2 R1 R0 R0R1 G0

B1 B0 G5 G4 G3 G2 G1 G1G2 B1

DE

A

A

B7 B6 G7 G6 R7 R6 R6R7

B5 B4 B3 B2 B2B3

DE

1 cycle

CLKIN-

RIN0+

RIN0-

RIN1+

RIN1-

RIN2+

RIN2-

RIN3+

RIN3-

DE: Display Enable

NA: Not Available (Fixed Low)

G2 R7 R6 R5 R4 R3 R2 R2R3 G2

B3 B2 G7 G6 G5 G4 G3 G3G4 B3

DE

A

A

B1 B0 G1 G0 R1 R0 R0R1

B7 B6 B5 B4 B4B5

DE



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Note 2

【

】

Normal (Default)

Ｒ／Ｌ：Ｌ（ＧＮＤ）Ｕ／Ｄ:Ｌ（ＧＮＤ）

ＣＮ１ ＣＮ１

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

Ｒ／Ｌ：Ｈ（３．３Ｖ）Ｕ／Ｄ：Ｌ（ＧＮＤ）

Horizontal reverse image

LD- 17408-6



Vertical reverse image Horizontal and vertical reverse image

Ｒ／Ｌ：Ｌ（ＧＮＤ）Ｕ／Ｄ:Ｈ（３．３Ｖ）  Ｒ／Ｌ：Ｈ（３．３Ｖ）Ｕ／Ｄ:Ｈ（３．３Ｖ）

ＣＮ１

ＣＮ１

CN2(O/S control) -(Shown in Fig 1)

OS Driving Pin No and function

Using connector : SM07B-SRSS-TB-A (JST)

Mating connector : SHR-07V-S or SHR-07V-S-B（JST

）

Pin No. Symbol Function Default

1 Frame Frame frequency setting

H:60Hz, L:50Hz



Pull down0V : (GND)
2 O/S set O/S operation setting H:O/S_ON, L:O/S_OFF Pull down0V : (GND)
3 TEST Fix to Low level usually. Pull down0V : (GND)
4 Temp3 Data3 of panel surface temperature Pull down0V : (GND)
5 Temp2 Data2 of panel surface temperature Pull down0V : (GND)
6 Temp1 Data1 of panel surface temperature Pull down0V : (GND)
7 GND

* L: Low level voltage (GND) H: High level voltage(3.3V)

【

Note

In case of O/S set setting ”L”(O/S_OFF), it should be set the “Temp1~3” and “Frame” to “L”.

】



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a

t




According as the surface temperature of the panel, enter the optimum 3 bit signal into pin No.4,5,6.

Measuring the correlation between detected temperature by the sensor on PWB in users side and actual surface

temperature of panel at center , convert the temperature detected by the sensor to the surface temperature of

panel to enter the 3 bit temperature data.

Pin no.

0-5℃ 5-10℃ 10-15

4 L L L L H H H H
5 L L H H L L H H
6 L H L H L H L H

* L: Low level voltage (GND) H: High level voltage(3.3V)

*For overlapping temperatures (such as 5℃,10℃,15℃,20℃,25℃, 30℃,35℃) select the optimum parameter,

judging from the actual picture image.

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Surface temperature of panel

℃

15-20

℃

20-25

℃

25-30

30-35℃ 35℃ and

℃

LD- 17408-7

above

Temperature
sensor

Microcomputer

䊶Convert temperature data below

1. serial temp. data 㹢 parallel temp.㩷 dat

2. measurement point temp. data

㹢 panel surface temp. data

3bi

LCD I/F

OS Driving ref. circuit

Domain B

Domain A

Domain A

Domain B

There is a LM70(product by NS) etc. as a temperature sensor.

Please perform temperature compensation between a measurement point

and panel surface temperature with a microcomputer.

hysteresis about the change of setting temperature.

Moreover, please give

4-2. Backlight driving

CN3 (Inverter control) Using connector: S6B-PH-SM3-TB(JST) Mating connector: PHR-6 (JST)

Pin No.

1

Symbol

V

ON Inverter ON/OFF 24k ohm

Function Input Impedance Remark

Note 1

【

】

2 Reserved Not Available -
3 Reserved Not Available -
4

V

Brightness Control 100k ohm

BRT

【

Note 2

】

5 Reserved Not Available -
6 GND GND

* GND of an inverter board is not connected to GND of a module chassis and a liquid crystal panel drive part.



Note 1】 Inverter ON/OFF

【

Input voltage Function

3~5V Inverter: ON
0~1V Inverter: OFF

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