SHARP LPE202 Technical Report

Date: Sep. 12, 1994
LASER PRINTER: JX-9400
No. : LPE-202
CHANGES TO ICU PWB UNIT
1.Model name: JX-9400
2.General: We have made various changes to the ICU PWB and parts change due to EMI.
3.Description: Change of the ICU PWB unit of each destination is as diagram below. Please see the
following items (1), (2), (3), the attached circuit diagram and the parts list for more information.
Destination Current New
UE4*
BG* CPWBX0056GC53 CPWBX0063GC52 ’94/3
Except for
UE4 and BG
CPWBX0056GC51 CPWBX0063GC51 ’94/3
CPWBX0063GC51 CPWBX0063GC54 ’94/6
Same as new CPWBX0063GC51 ’94/3 (2) Parts change due to application of EMI
Effective
Description
(1) Changes due to improvement of
productivity
(2) Changes due to application of EMI (3) Addition of IC socket (1) Changes due to improvement of
productivity
(2) Changes due to application of EMI
* Destination code UE4: For special version (Voltage/Frequency=220V/50, Cassette, A4)
BG : Europe
(1)Announcements of change of specifications and discontinuation of parts production
Discontinuation of 16.000 MHz crystal (RCRS-1014ACZZ).In order to change the CPU clock from 8 MHz to 9.83 MHz, the CPU has been
changed to a 10 MHz unit (VHI68EC000-10 68pin PLCC).
Mass production circuit board (CPWBX0056GC51)
19.660MHz
19.66MHz CF78057 CF78057
16.000MHz
16MHz
New circuit board (CPWBX0063GC51)
19.66MHz
19.66MHz
19.66MHz
CPU 64pin DIP
8MHz
1
Discontinued crystal.
CPU 68pin PLCC
2
9.83MHz
CPU changed.
SHARP CORPORATION Printer and Scanner Division
1/12
Orange
C
The program ROM has been changed from two 1M mask ROM (VHI27C0121EGC /
VHI27C0122EGC) units to one 2M mask ROM (VHILH532G65-1) unit.
1M mask ROM Upper 8bit
1M mask ROM Lower 8bit
CPU CPU
16 bit DATA
2M mask ROM 16bit
3
The CG ROM has been changed from two 2M mask ROM (VHILH532HG3-1 /
VHILH532HG4-1) units to one 4M mask ROM (VHILH534FHJ-1) unit.
2M mask ROM Upper 8bit
2M mask ROM Lower 8bit
CPU CPU
16bit DATA
4M mask ROM 16bit
4
Change in 256K DRAM.
Due to a production halt by the maker, the part corresponding to VHIMN41464A08 (location No. IC 1, 2) has been changed to VHILH2464-10C, a part with the same specifications.
Discontinuation of CPU pull down resistance.
The new circuit board does not have block resistance installed in locations no. RA 8, 12, 15, 17, or 19 (refer to the figure below).
Not installed.
2/12
Addition of capacitors.
1. Two 1µF capacitors (RC-K1E104HCZZ) have been added between Vcc and GND of LS244 (CG address).
+ 5v
IC26 LS294
IC27 LS244
CGA (8) CGA (18 : 22)
CGA (0 : 7)
2. A 330 pF capacitor (VCKYPU1HB331K) has been added between Vcc and GND of the photo card.
+ 5V
Added
330
pF
Vcc IC23 LS244 GND
0.1µF
+ 5v
Vcc IC24 LS244 GND
60
Vcc
32
GND
CN501
CGA (8) CGA (18 : 22)
CGA (0 : 7)
Discontinuation and change of screws.
1. The screw (RCORF1005ACZR 41A01) on the GND side of the 7.601 MHz crystal and 19.660 MHz crystal has been eliminated.
2. The screw (RCORF1005ACZR) on the Vcc side of the 7.601 MHz crystal has been changed to RCORF1009ACZZ (32A06).
+ 5V
+ 5V
0.1
12
0.1
+ 5V
19.660 MHz
14
41A01
7.601 MHz
6
41A01
34
41A01
41A0141A01
GND
58
0.1µ
32A06
0.1µ
7.601 MHz
12
+ 5V
0.1µ
41A01
0.1µ
6
19.660 MHz
1
41A01
41A01
39
58
4
GND
3/12
(2)Parts change due to improvement of EMI
To improve the level of EMI, we have made changes to the ICU PWB resistance and its condenser. Changes are shown in following chart.
Description Placing No. Current New
Change resistance from 22
to 33 Addition of the condenser
100pF Change the condenser from
330pF to 120pF Addition of the condenser
330pF
R43, 53~60 VRS-TP2BD220J VRS-TP2BD330J
C4 VCCCTV1HH101J
CN501 VCKYPU1HB331K VCKYPU1HB121K
CN505 VCKYPU1HB331K
(3)Addition of the IC socket for IC3 to the UE4 ICU PWB for specific countries
We have added the IC socket (QSOCZ0002GCZZ) to the mask ROM section of IC3 to improve its function as shown in the illustration below. We also have changed the parts code of the ICU PWB along with this change.
<Current> <New> ICU PWB unit CPWBX0063GC51 CPWBX0063GC54
Addition of IC socket (QSOCZ0002GCZZ)
4.Action: From March 1994 production (Changes due to improvement of productivity and EMI) From June 1994 production (Addition of IC socket for EU4)
4/12
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