This specification applies to the color 31.5” Wide XGA TFT Open-Cell LK315T3HB00X/T/A.
* These specification sheets are proprietary products of SHARP CORPORATION (“SHARP”) and include materials
protected under copyright of SHARP. Do not reproduce or cause any third party to reproduce them in any form or by
any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of
SHARP.
* In case of using the device for applications such as control and safety equipment for transportation (aircraft, trains,
automobiles, etc.), rescue and security equipment and various safety related equipment which require higher
reliability and safety, take into consideration that appropriate measures such as fail-safe functions and redundant
system design should be taken.
* Do not use the device for equipment that requires an extreme level of reliability, such as aerospace applications,
telecommunication equipment (trunk lines), nuclear power control equipment and medical or other equipment for
life support.
* SHARP assumes no responsibility for any damage resulting from the use of the device that does not comply with
the instructions and the precautions specified in these specification sheets.
* Contact and consult with a SHARP sales representative for any questions about this device.
2. Overview
This Open-Cell is a color active matrix LCD module incorporating amorphous silicon TFT (T
It is composed of a color TFT-LCD panel, driver ICs, control circuit, power supply circuit, inverter circuit and back
light system etc. Graphics and texts can be displayed on a 1366×RGB×768 dots panel with 16,777,216 colors by
using LVDS (L
This module also includes the LED-PWB module to drive the LED.
And in order to improve the response time of LCD, this module applies the Over Shoot driving (O/S driving)
technology for the control circuit .In the O/S driving technology, signals are being applied to the Liquid Crystal
according to a pre-fixed process as an image signal of the present frame when a difference is found between image
signal of the previous frame and that of the current frame after comparing them.
By using the captioned process, the image signals of this Open-Cell are being set so that image response can be
completed within one frame, as a result, image blur can be improved and clear image performance can be realized.
3. Mechanical Specifications
Active area 697.69 (H) × 392.26 (V) mm
Pixel Format
Pixel pitch 0.51075(H) × 0.51075 (V) mm
Pixel configuration R,G, B vertical stripe
Display mode Normally black
Unit Outline Dimensions (*1) 709.3(W) × 451.2(H) ×4.8max(D) mm
Mass 1.2 kg
Surface treatment
(*1) Outline dimensions are shown in Fig.1
ow Voltage Differential Signaling) to interface, +12V of DC supply voltages.
Parameter Specifications Unit
Display size
80.039 (Diagonal)
31.5 (Diagonal)
1366 (H) × 768 (V)
(1pixel = R + G + B dot)
Low-Haze Anti Glare
Hard coating: 2H
hin Film Transistor).
cm
inch
pixel
4. Input Terminals
4-1. TFT panel driving
CN1 (Interface signals and +12V DC power supply) (Shown in Fig.1)
Termi n al r e s i s t o r RT - 100 - Ω Differential input
[Note] VCM: Common mode voltage of LVDS driver.
[Note 1]
Input voltage sequences Dip conditions for supply voltage
50μs < t1 ≤ 20ms a) 9.1V ≤ V
< 10.8V
CC
20ms< t2-1 ≤ 5s td ≤ 10ms
20ms< t2-2 ≤ 5s b) V
< 9.1V
CC
0 < t3 ≤ 1s Dip conditions for supply voltage is
t4 ≥ 1s based on input voltage sequence.
t5 ≥ 300ms
0.9V
0.1VCC
CC
Data1
Data
Back light:
CC
t2-1
t1
t2-
t5
ON
INV
OFF
0.9 V
CC
0.1 VCC
t3
0.1V
t
OF
CC
V
9.
7
1
.
V
2
td
Vcc
1
V
0.
5
8V
.
LD-K23Z03 -9
※ Data1: CLKIN±,RIN0±,RIN1±, RIN2±, RIN3±
※ Data2: SELLVDS
※ About the relation between data input and back light lighting, please base on the above-mentioned input
sequence.
When back light is switched on before panel operation or after a panel operation stop, it may not display
normally. But this phenomenon is not based on change of an incoming signal, and does not give damage to a
liquid crystal display.
[Note 2]Typical current situation: 256 gray-bar pattern (V
= +12.0V)
CC
The explanation of RGB gray scale is seen in section 8.
Each basic color can be displayed in 256 gray scales from 8 bit data signals. According to the combination of total
24 bit data signals, the 16,777,216 colors display can be achieved on the screen.
9. Optical characteristics
Parameter Symbol Condition Min. Typ. Max. Unit Remark
θ21
θ22
θ11
θ12
CR ≥ 10
70 88 - Deg.
70 88 - Deg.
Viewing angle
range
Horizontal
Vertical
Contrast ratio CRn3750 5000 - -
Response time
Chromaticity of white
Chromaticity of red
Chromaticity of green
Chromaticity of blue
Luminance of white YL 320 400 - cd/m2
τ
DRV
x 0.252
y 0.258
x 0.604
θ=0 deg.
y 0.323
x 0.279
y 0.601
x 0.123
y
Luminance uniformity δW
- 7 - ms
0.031
0.282
0.288
0.634
0.353
0.309
0.631
0.153
0.061
0.312 -
0.318 -
0.664 -
0.383 -
0.339 -
0.661 -
0.183 -
0.091 -
- - 1.54 - [Note 6]
Measurement condition : Back Light Unit is used for LK315T3LWD0X.
*The measurement shall be executed 60 minutes after lighting at rating.
[Note] The optical characteristics are measured using the following equipment.
Detector (EZ-CONTRAST, Photo Diode)
400mm
Detector (SR-3)
Field=1°
Center of the screen (θ = 0°)
Center of the screen (θ = 0°)
TFT-LCD Module
TFT-LCD Module
Fig.3-1 Measurement of viewing angle range
and response time.
(Viewing angle range: EZ-CONTRAST
Response time: Photo Diode)
Fig.3-2 Measurement of Contrast,
Luminance, and Chromaticity.
LD-K23Z03 -13
Ta = 25°C, Vcc = +12V
[Note1,4]
[Note2,4]
[Note3,4,5]
[Note 4]
[Note 4]
[Note 1] Definitions of viewing angle range :
LD-K23Z03 -14
Normal
θ11
θ21
θ12
θ22
6 o’clock direction
[Note 2] Definition of contrast ratio :
The contrast ratio is defined as the following.
Luminance (brightness) with all pixels white
Contrast Ratio
=
Luminance (brightness) with all pixels black
[Note 3] Definition of response time
The response time (τ
) is defined as the following figure and shall be measured by switching the input
DRV
signal for “any level of gray (0%, 25%, 50%, 75% and 100%)” and “any level of gray (0%, 25%, 50%, 75% and
100%)” at panel surface temperature 45°C.
0%
0%
25%
50%
75%
100%
td: 25%-0%
td: 50%-0% td: 50%-25%
td: 75%-0% td: 75%-25%td: 75%-50%
td: 100%-0% td: 100%-25%td: 100%-50% td: 100%-75%
25% 50% 75%
tr: 0%-25%
tr: 0%-50% tr: 0%-75% tr: 0%-100%
tr: 25%-50%tr: 25%-75% tr: 25%-100%
tr: 50%-75% tr: 50%-100%
t*:x-y...response time from level of gray(x) to level of gray(y)
= Σ(t*:x-y)/20
τ
DRV
[Note 4] This shall be measured at center of the screen.
[Note 5] This value is valid when O/S driving is used at typical input time value .
[Note 6] Definition of white uniformity ;
White uniformity is defined as the following with five measurements. (A~I)
Maximum luminance of Nine points (brightness)
W=
δ
Minimum luminance of Nine points (brightness)
100%
2276831139画素
A
B
C
tr: 75%-100%
D
E
F
pixel
G
H
I
128
384
640
LD-K23Z03 -15
10. Handling Precautions of the module
a) Be sure to turn off the power supply when inserting or disconnecting the cable.
b) Be sure to design the cabinet so that the module can be installed without any extra stress such as warp or
twist.
c) Since the front polarizer is easily damaged, pay attention not to scratch it.
d) Since long contact with water may cause discoloration or spots, wipe off water drop immediately.
e) When the panel surface is soiled, wipe it with absorbent cotton or other soft cloth.
f) Since the panel is made of glass, it may break or crack if dropped or bumped on hard surface. Handle with
care.
g) Since CMOS LSI is used in this module, take care of static electricity and take the human earth into
consideration when handling.
h) Please consider to minimize the influence of EMI and the exogenous noise before designing the grounding of
Open-Cell.
i) The Open-Cell has some printed circuit boards (PCBs) on the side, take care to keep them form any stress or
pressure when handling or installing the module; otherwise some of electronic parts on the PCBs may be
damaged.
j) Observe all other precautionary requirements in handling components.
k) When some pressure is added onto the module from rear side constantly, it causes display non-uniformity
issue, functional defect, etc.. So, please avoid such design.
l) When handling LCD modules and assembling them into cabinets, please be noted that long-term storage in
the environment of oxidization or deoxidization gas and the use of such materials as reagent, solvent,
adhesive, resin, etc. which generate these gasses, may cause corrosion and discoloration of the LCD
modules.
11. Reliability test item
No. Test item Condition
1 High temperature storage test Ta=60°C 500h
2 Low temperature storage test Ta=-25°C 500h
3
4
5
High temperature and high humidity
operation test
High temperature operation test Ta=50°C 500h
Low temperature operation test Ta=0°C 500h
Vibration test
6
(Cell Box with Open-Cells)
(non-operation)
Shock test
7
(Cell Box with Open-Cells)
(non-operation)
Ta=40°C ; 95%RH 500h
(No condensation)
(The panel surface temperature of this time is MAX60 ℃)
(The panel surface temperature of this time is MIN0 ℃)
X and Y direction: 15min, Z direction: 60min.
5Hz to 50Hz acceleration velocity: 1.0G
Sweeping ratio: 3min
Maximum acceleration: 490m/s
2
Pulse width: 11ms, sinusoidal half wave
Direction: +/-X, +/-Y, +/-Z, once for each direction.
To: SHARP Corporation
pp
go.j
f
Report on Environmental Impact Substances Contained in Parts
and Materials
We guarantee the following verified results on the environmental impact substances:
2. Ozone-depleting substances contained in the part or used in manufacturing:
No.Substances
Ozone-depleting substances(regulated by the
1
Montreal Protocol (Class I and II))(*1)
Note: When the verified results show the substances are “present”, the part or material is prohibited by the SHARP standard.
Not contained in part/materials. However, use of the refrigerant (HCFC) for
air-conditioners is considered as object exclusion.
Not used in the rinse process. (Object: PWBs, )
(Even if you select "Not use" that means you didn’t use these substances to rinse
process, you have to describe rinse solution and method of the rinse process.)
Details (Criteria)
3. Presence of banned substances in the part (material)
No.Substances
Hexavalent chromium compound Content is 1000ppm or less. Not intentionally added. (*3)
1
Bis(tri-n-butyltin) oxide
2
Tri-substiituted organostannic compounds Content is 1000ppm or less. Not intentionally added.
3
Polybrominated biphenyls (PBBs)
4
Polybrominated diphenyl ethers
5
(PBDEs)
Polychlorinated biphenyls (PCBs)
13
6
Polychlorinated naphthalene
7
Short chain chlorinated paraffin Not intentionally added. (Only C:10-13 are subject to the regulation.)
8
Asbestos Not intentionally added.
9
Polychlorinated Terphenyls (PCTs)
10
Phenol,2-(2H-benzotriazol-2-yl)-4,6-
11
bis(1,1-dimethylethyl)
Tris (2-chloroethyl) phosphate
12
Hexabromocyclododecane
Diarsenic Pentoxide
14
Cobalt dichloride
15
Dimethyl fumarate
16
Refractory Ceramic Fibres,Aluminosilicate
17
Refractory Ceramic Fibres,
18
Zirconia Aluminosilicate
Note: When the verified results show the substances are “present”, the part or material is prohibited by the SHARP standard.
Content is 1000ppm or less. Not intentionally added.Not present
Content is 1000ppm or less. Not intentionally added.Not present
Content is 1000ppm or less. Not intentionally added.
Not intentionally added.Not present
Not intentionally added.(Only poly chlorinated naphthalene with
three chlorines and more is subject to the regulation.)
Not intentionally added.Not present
Not intentionally added.
Content is 1000ppm or less. Not intentionally added.Not present
Content is 1000ppm or less. Not intentionally added.Not present
Content is 1000ppm or less. Not intentionally added.Not present
Content is 1000ppm or less. Not intentionally added.Not present
Content is 1000ppm or less. Not intentionally added.Not present
Not intentionally added.Not present
Not intentionally added.Not present
Details (Criteria) (*2)Verified Result
Verified Result
Not present
Not use/Use
Rinse solution:
Rinse method:
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
4. Presence of banned substances depending on application
When the verified result of criteria shows the substances are "present",
please complete and return the “CONFIRMATION OF USE” form which details use of each substance.
No.Substances
Cadmium and its compound Content is 100ppm or less. Not intentionally added. (*3)
1
Lead and its compoundPresent
2
Mercury and its compound Content is 1000ppm or less. Not intentionally added. (*3)
3
Beryllium and its compound Content is 1000ppm or less. Not intentionally added.
4
Azo colorants Not intentionally added. Content is 30ppm or less.
5
Polyvinyl Chloride Not intentionally added.
6
Phthalates Content is 1000ppm or less. Not intentionally added.
7
Radioactive substances Not intentionally added.
8
Perfluorooctane sulfonate(PFOSs)
9
and its salt(*4)
Formaldehyde
10
Nickel
11
Perchlorates Not intentionally added.(The object of survey is only battery)
12
Diarsenic trioxide Content is 1000ppm or less. Not intentionally added.
13
Arsenic and its compound (except Diarsenic
14
Pentoxide and Diarsenic trioxide)
Boric acid Content is 1000ppm or less. Not intentionally added.
15
Disodium tetraborate,anhydrous
16
Tetraboron disodium heptaoxide, hydrate
Dibutyltin (DBT) compounds Content is 1000ppm or less of tin in a material. Not Intentionally added.
17
Dioctyltin (DOT) compounds Content is 1000ppm or less of tin in a material. Not Intentionally added.
18
*1) Regarding Ozone-depleting substances, object substances are CFC, 1,1,1-trichloroethane, Carbon tetrachloride, Bromomethane,Halon HBFC, and HCFC.
*2) Unit for calculating content rate is homogenious material.
*3) For packaging part and packaging material, the total concentration of these 4 heavy metals in part/material, ink and paint which constitute a package
is 100ppm or less each.
*4) Concerning "Perfluorooctane sulfonate(PFOSs) and its salt", please refer to the Web Site of Ministry of Economy, Trade and Industry of Japan.
URL: http://www.meti.
*5) When the verified result shows the substances are "present", please complete and return the attachment 1 “CONFIRMATION OF USE FORM” which details use of
each substance.
p/policy/chemical_management/03kanri/96list.pd
Approved:
Not intentionally added. Content in plastics is 300ppm or less.
Content in others is 1000ppm or less. (*3)
Not intentionally added, and Content in substance/preparation is 50ppm or less,
content of sub-product/article etc. except substance/preparation is
m or less, content of coating agent is 1μg/m2 or less.
1000
Wood component: atmospheric concentration is 0.1ppm or less
(by the chamber method).
Plastics/fibers: content is 75ppm or less.
Not intentionally added.Present
Content is 1000ppm or less. Not intentionally added.
Content is 1000ppm or less. Not intentionally added.
SHIGEKI TANAKA
Details (Criteria)(*2)Verified Result(*5)
Written by:
YOSHITAKE NAKAMURA
Not present
Not present
Present
Present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Not present
Signature:Signature:
Ver.5.3Revised: June, 2011
y
To: SHARP Corporation
Attachement 1 "CONFIRMATION OF USE FORM"
(Parts and materials which are usable or prohibited according to application)
This form is to be completed when the verified results in the form 'Report on Environmental Impact Substances Contained in Partsand Materials' have shown the presence of banned substances with restrictions depending on application.
1. Information on survey applicable part
1) Part NameTFT Open-Cell
2) Sharp Part Code NumberR1LK315T3HB00X
3) Manufacturer’s Part Code NumberLK315T3HB00X/T/A
2.Detail of verified result
Please indicate with a "O" in the verified results column if an
of the restricted substances are used for the following reasons.
No.SubstancesCheck point ( criteria )
(1) Used for electric point
Cadmium
1
and its compound
Lead
2
and its compound
Mercury
3
and its compound
Beryllium and its
4
compound
5 Azo colorants
6 Polyvinyl Chloride
7 Phthalate esters
Radioactive
8
substances
Perfluorooctane
9
sulfonate(PFOSs)
and its salt
10 Formaldehyde
11 Nickel
12 Perchlorates
13 Diarsenic trioxide
Arsenic and
14
its compound
15 Boric acid
Disodium tetraborate,
anhydrous Tetraboron
16
disodium heptaoxide,
hydrate
Dibutyltin (DBT)
17
compounds
Dioctyltin (DOT)
18
compounds
Note: When the verified results correspond to "banned", the part or material is prohibited by the SHARP standard.
(2) Used in filter glass.
(3) Used in a thermal cutoff of a one shot pellet type
(4) Battery is compliant with the EU Battery Directive (98/101/EC).
(5) Used in every application other than the above (1-4).
(1) Used in high-melting point solder (lead-based alloys containing 85 % by weight or more lead)
(2) Used in electrical and electronic components in a glass or ceramic other than dielectric ceramic in capacitors,
(3) Used less than 0.2% by weight in glass of a fluorescent tube
(4) Contained in alloy component. (Lead content should be less than 0.35 Wt%, 0.4 Wt% and 4Wt% in steel material,
aluminum material and copper material, respectively.)
(5) Used in solder consisting of more than two types of elements for connecting microprocessor pins and package containing
(6) Used in solder for connecting semiconductor dies and carriers in flip chip IC packages
(7) Used in white glass or filter glass used for an optical purpose
(8) Used in coating material for thermal conduction module C-rings
(9) Used in shell (exterior casing) or bushing (a cylindrical component fitted inside a hole) of a bearing for a compressor
(10) Used in dielectric ceramic used in a capacitor with rated voltage of 125V AC or 250V DC or larger
(11) Used in a dielectric ceramic used in a capacitor with rated voltage less than 125V AC or 250V DC
(12) Used in glass used for flat fluorescent lamps used for LCD, designing, or lighting for industrial purpose
(13) Used in finishing agents of 0.65 mm or finer pitch components other than connectors
(14) Used for stabilizer or additive for non-electrolytic gold or nickel plating
(15) Battery is compliant with the EU Battery Directive (98/101/EC).
(16) Used in products for children 12 and under, containing lead exceeding 300ppm per surveying unit.
(17) Used in parts/material used in toys, containing lead above 0.009% per surface treatment layer such as coating.
(18) Used in the other than the above (1-15).
(1) Used in single-capped fluorescent lamp that does not exceed the following limitations (per burner):
(a) For general illumination less than 30W: 5mg, (b) For general illumination of 30W or higher and less than 50W: 5 mg
(c) For general illumination of 50W or higher and less than 150W: 5 mg, (d) For general illumination of 150W or higher: 15mg
(e) Having a circular or square structure, 17mm or less in tube diameter, and for general illumination: 7mg, (f) For a specific use: 5 mg
(2) Used in double-capped strip fluorescent lamp (in each lamp) for general purposes that does not exceed the following limitations:
(a) A three-wavelength phosphor of less than 9mm in tube diameter (e.g., T2) with normal lifetime: 5mg
(b) A three-wavelength phosphor of 9mm or larger and of 17mm or less in tube diameter (e.g., T5) with normal lifetime: 5mg
(c) A three-wavelength phosphor of over 17mm and 28mm or less in tube diameter (e.g., T8) with normal lifetime: 5mg
(d) A three-wavelength phosphor of over 28mm in tube diameter (e.g., T12) with normal lifetime: 5mg
(e) A three-wavelength phosphor with long lifetime (> 25,000 h) : 8mg
(3) Used in double-capped fluorescent lamp (in each individual lamp) not for general purposes under the following conditions:
(a) A linear white lamp of 28mm in tube diameter (e.g., T10 and T12): mercury that does not exceed 10mg
(b) Nonlinear white lamps of all shapes: mercury that does not exceed 15mg
(c) Mercury contained in a nonlinear three-wavelength phosphor lamp of 17mm or larger (e.g., T9)
(d) Mercury contained in a lamp for any other general illumination or specific purposes (e.g., induction lamps)
(4) Used in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL)
for special purposes not exceeding (per lamp):
(a)Short length (≤ 500 mm): 3.5mg, (b)Medium length (> 500 mm and ≤ 1500 mm): 5mg, (c)Long length (> 1500 mm): 13mg
(5) Used in low pressure discharge lamps (per lamp) other than the above(1-4)
(6) Used in extra-high voltage sodium (vapor) lamp for general illumination with an improved color rendering index over 60
(7) Used in extra-high voltage sodium (vapor) lamp for general illumination
(8) Used in high-pressure mercury vapor lamp (HPMV)
(9) Used in high-pressure mercury vapor lamp (HPMV)
(10) Used in metal halide lamp (MH)
(11) Battery is compliant with the EU Battery Directive (98/101/EC).
(12) Used in every application other than the above (1-11).
(1) Used in the exception items. (exception items: alloy, ceramics, glass, semiconductor)
(2) Used in the parts excluding exception items
(1) Used in a contact part with human body of a product (ex:electric carpet, earphone, strap and etc.) which is manufactured
based on the premise that the product continuously contacts human body, and may produce amine when discomposed.
(2) Used in every application other than the above (1). (Used in a part which does not continuously contact with human body.)
(1) Used in packaging material and packaging part for Sharp product.
(2) Used for the other than the above (1).
(1) Bis(2-ethylhexyl)phthalate:DEHP/DOP is used intentionally.
(2) Dibutyl phthalate:DBP, or Bis(butylbenzyl) phthalate:BBP, or Diisobutyl phthalate:DIBP is used.
(3) Dinonyl phthalate:DINP, or Diisodecyl phthalate:DIDP, or Di-n-octyl phthalate:DNOP is used
in parts/materials that is used in products for children 12 and under.
(4) Bis(2-ethylhexyl)phthalate:DEHP/DOP is contained as impurities (Not intentionally added)
(5) Used in the other than the above (1-3).
(1) Used in the magnetron of a microwave oven. (Only Thorium is subject to the regulation.)
(2) Used in the electric bulb of a LCD projector. (Only Krypton 85 is subject to the regulation.)
(3) Used in the other than the above (1-2).
(1)Used in photoresists and rantireflection coating for the photolithography process.
(2) Used in photo coating used in pringing plates, film, and documents.
(3) Used in mist suppressants for hard chrome plating, and moistening agent used in equipment for plating.
(4) Used in every application other than the above (1-3).
(1) Used in wooden parts.
(2) Used in a direct human body contact part of a product which is intended to continuously contact with human body.
(ex: electric carpet, earphone, strap and etc.)
(3) Used in every application other than the above (1-2).
(1) Used in parts which continuously contact with human skin for a long time.
(2) Used in the other than the above (1).
(1) Contained above 6ppb by weight per battery
(2) Contained less than 6ppb by weight per battery
(1) Used in the lamp of LCD projector.
(2) Used in the other than the above (1).
(1) Used for the exception items. (exception items: semiconductor, resist, magnet filter, copper foil and battery)
(2) Used in the other than the above (1).
(1) Used in the polarizers(made of PVA) of LCD panel and glass.
(2) Used in adhensive agent.
(3) Used for the other than the above (1-2).
(1) Used in the polarizers(made of PVA) of LCD panel and glass.
(3) Used for the other than the above (1-2).
(1) Used for one-component and two-component room temperature vulcanisation sealants (RTV-1 and RTV-2 sealants) and adhesives
(2) Used for paints and coatings containing DBT compounds as catalysts when applied on articles
(3) Used in stabilizer of soft polyvinyl chloride (PVC) for outdoor purpose
(4) Used in catalyst for polymerization of resin for toner. Content as a metal tin is 1000ppm or less.
(5) Used for the other than the above (1-4).
(1) Used for two-component room temperature vulcanisation moulding kits (RTV-2 moulding kits)
(2) Used for the other than the above (1).
Approved:
SHIGEKI TANAKA
less than 85wt% and more than 80wt% of lead.
containing coolant for heating,ventilation, air-conditioning, refrigeration, chilling, and HVACR
(2) Used in adhensive agent and fibers.
Signature:Signature:
e.g. piezoelectronic devices, or in a glass or ceramic matrix compoundcompounds
Written by:
Date: Jan,06,2012
Company Name:
VerifiedAdaptability under the
ResultsSHARP standard
SHARP CORPRATION
Department:
LIQUID CRYSTAL DISPLAY GROUP
○
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○
YOSHITAKE NAKAMURA
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statement
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1/1
Ver.5.3Revised: June, 2011
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