GP2W0104YP
IrDA Data Sheet
FEATURES
• Built-in Photodiode
• Operating voltage 2.4 V to 5.5 V
• Conforms to eye safety IEC60825-1, without external resistor
• This product shall not contain the following materials, and these materials shall not be used in the production process for this product.
–CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBO
INTRODUCTION
This specification applies to the outline and characteristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2
kbps, low power option compliant).
NOTES
• Caution should be taken to prevent the detector sur-
face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immediate or potential defects.
– Cleaning solvent: The cleaning shall be carried out
with ethyl alcohol, methyl alcohol, isopropyl alcohol.
• In order to prevent electrostatic damage to the inte-
grated circuit, handle this device in a static-free environment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn
around time from transmit to receive should be
designed by considering 0.5 ms or more that is specified by IrDA. This turn around time means the time
and PBBS are not used in this device.
S
115 kbps Transceiver
that this device does not temporarily detect the
inconsistent signal, since the transmitted light from
the transmitter side reaches the detector side of the
same transceiver.
• When designing the system (program), consider that
0.3 ms or more (at T
essary to return from shut-down mode to readyoperation mode. In addition, thoroughly confirm the
operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than signal output may be generated as noise on output terminal of the transceiver.
Consider the layout and structure in your design to
minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method which is specified by ‘Serial Infrared Physical
Layer Link Specification’ published by the Infrared
Data Association. Faulty operation may occur, if a signal method other than that specified is used.
• RXD pinout remains at high-level output in shutdown
mode. The RXD pinout is CMOS output, and other
CMOS outputs must not be directly connected to this
pinout, as it does not conform to tri-state output.
• In circuit designs, make allowance for the degradation
of the light emitting diode output that results from longterm continuous operation (50% degradation/5 years).
1NC2NC3
+
CX
COMPONENTS
CX 10 µF/6.3 V (NOTE 1)
NOTES:
1. Choose the most suitable CX according to the
noise level and noise frequency of power supply.
2. Pin 1 and Pin 2 are not connected internally.
Figure 1. Recommended External Circuit
= 25°C, no input signal) is nec-
A
4
V
DD
V
DD
RECOMMENDED VALUES
5SD6
GND
GND SD RXD TXD
RXD7TXD8LEDA
GP2W0104YP-1
IrDA Data Sheet 1
GP2W0104YP 115 kbps Transceiver
CX
+
UART
SD INPUT PERFORMANCE
LOW Normal Mode
3T/16
T
0
Shutdown
Mode
T
10 1
HIGH
1
1
ENCODER
CIRCUIT
DECODER
5
NOTES:
1 Transmitting data waveform
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0104YP receiver output waveform
Receiving data waveform
5
CIRCUIT
2
TXD
4
RXD
SD
Figure 2. System Example
Recommended Size of
Solder Cream Paste
Open the solder mask as shown in Figure 4. The
size of solder cream paste for this device before reflow
soldering must be as large as one of the foot pattern
land, indicated in Figure 5.
LEDA
GP2W0104YP
GND
V
DD
3
3
GP2W0104YP-2
2
1.55
3
1.1
4
5
NOTES:
1 Transmitting data waveform
Encoder circuit output waveform
2
3 Transmitter output optical signal waveform
4 GP2W0104YP receiver output waveform
Receiving data waveform
5
T =
Data Rate
Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps,
0
1
57.6 kbps, 115.2 kbps
10 1
Figure 3. Signal Waveform Example
GP2W0104YP-3
0.6
NOTES:
1. Dimensions are in mm.
2. Dimensions are for reference.
3. Soldering paste area
0.475
1.425
Figure 4. Solder Cream Size
2.375
3.325
2.0
GP2W0104YP-5
0.1
1.55
2 IrDA Data Sheet
115 kbps Transceiver GP2W0104YP
1.0
1.55
CENTER OF
MOUNTING AREA
1.1
2.0
0.1
1.55
8
7
0.6
PIN
1
2
3
4
5
6
7
8
NOTES:
1. Dimensions are in mm.
2. Dimensions are shown for reference.
3. Connect foot pattern of shield case to GND pattern.
PIN NAME SYMBOL
NC
NC
V
DD
Ground
Shutdown
Receiver Data Output
Transmitter Data Input
LED Anode
NC
NC
V
DD
GND
SD
RXD
TXD
LEDA
Figure 5. Foot Pattern of PCB
6
0.475
4
5
1.425
2.375
3.325
2
3
1
GP2W0104YP-4
IrDA Data Sheet 3
GP2W0104YP 115 kbps Transceiver
1.15 3.9
2.75 ±0.3
CENTER
OF DETECTOR
1
EMBOSSED
2 3
+0.2
8 - 0.4
-0.3
PO .95 x 7 = 6.65
7.9 ±0.3
'S'
4
2.5
5.2
1.15 0.9
CENTER
OF EMITTER
5 6
0.48
1.88
±0.3
2.7
2 ±0.3
φ2.2φ2.2
1.5 ±0.3
1.05 ±0.3
2.15 ±0.3
+0.3
0.8
-0.2
+0.4
0.35
-0.2
8
7
PIN
1
2
3
4
5
6
7
8
PIN NAME SYMBOL
NC
NC
V
DD
Ground
Shutdown
Receiver Data Output
Transmitter Data Input
LED Anode
NC
NC
V
DD
GND
SD
RXD
TXD
LEDA
BOTTOM VIEW
8 - 0.6
NOTES:
1. Dimensions are in mm.
2. Unspecified tolerances are ±0.2
3. Adhesion of resin to the terminal area are allowed MAX. 0.2 mm.
area: Au plating
Figure 6. GP2W0104YP Outline Dimensions
0.6 ±0.3
PO .95 x 7 = 6.65
GP2W0104YP-6
4 IrDA Data Sheet
115 kbps Transceiver GP2W0104YP
RATINGS AND CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER SYMBOL RATINGS UNIT NOTES
Supply voltage V
Peak forward current I
Operating temperature T
Storage temperature T
Soldering temperature T
NOTES:
1. Pulse width: 78.1 µs. Duty ratio: 3/16.
2. Soldering reflow time: 5 seconds.
DD
FM
OPR
STG
SOL
0 to 6.0 V
60 mA 1
-20 to +85 °C
-30 to +85 °C
230 °C2
Recommended Operating Conditions
PARAMETER SYMBOL OPERATING CONDITION UNIT NOTES
Supply voltage V
DD
Data rate BR 2.4 to 115.2 kbps
SD terminal high level input voltage V
SD terminal low level input voltage V
TXD high level input voltage V
TXD low level input voltage V
IHSD
ILSD
IHTXD
ILTXD
2.4 to 5.5 V
VDD -0.5 to V
DD
V1
0.0 to 0.4 V 2
VDD -0.5 to V
DD
V3
0.0 to 0.4 V 4
NOTES:
1. Shut down mode
2. Normal mode
3. LED ON. See Figure 12.
4. LED OFF. See Figure 12.
Electrical Characteristics
TA = 25°C, VCC = 3.3 V unless otherwise specified
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
Current consumption at no input signal I
Current consumption at shut-down mode I
High level output voltage V
Low level output voltage V
Low level pulse width t
Rise time t
Fall time t
DD
DD-S
OH
OL
W
R
F
3.0 V 3
1.0 6.0 µs 5
Maximum reception distance L 20 cm 5
Input irradiance Ee 0.09 W/m
Radiant intensity I
LED peak current I
Rise time t
Fall time t
Peak emission wavelength
E
LED
R
F
p 850 870 900 nm 6
λ
3.6 25 mW/sr 6
14 20 26 mA 6
70 120 µA 1
0.01 1.0 µA 2
0.4 V 4
0.4 µs 5
0.4 µs 5
2
0.6 µs 6
0.6 µs 6
5
4. I
NOTES:
1. No input signal, V
2. No input signal, V
3. See Figures 7, 8, and 9.
= 0 V. Output terminal open.
ILSD
IHSD
= VDD. Output terminal open.
= 400 µA. See Figures 7, 8, and 9.
OL
5. BR = 115.2 kbps, φ ≤ 15°, See Figures 7, 8, and 9.
6. BR = 115.2 kbps, φ ≤ 15°, V
and 12.
= 2.8 V. See Figures 10, 11,
IHTXD
IrDA Data Sheet 5