package. The VND600 is a monolithic device
designed in| STMicroelectronics VIPower M0-3
Technology. The VNQ600A is intended for driving
any type of multiple loads with one side connected
to ground. This device has four independent
SO-28 (DOUBLE ISLAND)
ORDER CODES
PACKAGETUBET&R
channels and four analog sense outputs which
deliver currents proportional to the outputs
DESCRIPTION
The VNQ600A is a quad HSD formed by
assembling two VND600 chips in the same SO-28
currents. Active current limitation combined with
thermal shut-down and automatic restart protect
the device against overload . Device auto mati call y
turns off in case of ground pin disconnection.
ABSOLUTE MAXIMUM RATING
SymbolParameterValueUnit
V
-V
I
OUT
I
I
V
CSENSE
I
GND
V
ESD
E
MAX
P
T
T
Supply voltage ( continuous)41V
CC
Reverse supply voltage (continuous)-0.3V
CC
Output current ( continuo us), for each channel 15A
Reverse output current (continu ous), for each channel-15A
R
Input current +/- 10mA
IN
Current sense maximum voltage
Ground current at T
< 25°C (continuous)-200mA
pins
-3
+15
Electro static Discharge ( Human Body M odel: R=1.5KΩ; C=100pF)
- INPUT
- CURRENT SENSE
- OUTPUT
- V
CC
Maxim u m Sw itchin g En ergy
(L=0.11m H ; R
Power dissipation (per island) at T
tot
Junction operat ing temperatureInternally Limited° C
j
Storage temperature-55 to 150 °C
stg
=0Ω; V
L
=13.5V ; T
bat
=150ºC ; IL=40A)
jstart
=25°C6.25W
lead
4000
2000
5000
5000
126mJ
V
V
V
V
V
V
(**) See app lication sch em atic at page 9.
June 20 031/18
VNQ600A
BLOCK DIAGRAM
OVERVOLTAGE
UNDERVOLT AGE
1,2
V
CC
INPUT 1
INPUT 2
GND 1,2
INPUT 3
INPUT 4
GND 3,4
OVERTEMP. 1
OVERTEMP. 2
OVERTEMP. 3
OVERTEMP. 4
LOGIC
LOGIC
DRIVER 1
I
OUT1
DRIVER 2
I
OUT2
OVERVOLT AGE
UNDERVOLTAGE
DRIVER 3
I
OUT3
DRIVER 4
I
OUT4
DEMA G 1
I
LIM1
K
DEMAG 2
I
LIM2
K
DEMAG 3
I
LIM3
K
DEMAG 4
I
LIM4
K
OUTPUT 1
CURRENT
SENSE 1
OUTPUT 2
CURRENT
SENSE 2
3,4
V
CC
OUTPUT 3
CURRENT
SENSE 3
OUTPUT 4
CURRENT
SENSE 4
2/18
CURRENT AND VOLTAGE CO NVENTIONS
I
VNQ600A
S1,2
I
IN1
SENSE3
V
IN4
I
SENSE1
I
IN2
I
SENSE2
I
IN3
I
SENSE3
I
IN4
I
SENSE4
V
SENSE4
V
IN1
V
SENSE1
V
IN2
V
SENSE2
V
IN3
V
CONNECTION DIAGRAM ( TOP VIEW)
VCC1,2
GND 1,2
INPUT2
INPUT1
CURRENT
CURRENT SENS E 2
V
CC
V
CC
GND 3,4
INPUT4
INPUT3
CURRENT SE NSE 3
CURRENT SE NSE 4
V
CC
SENSE 1
1,2
3,4
3,4
V
CC1,2
INPUT1
CUR. SENSE1
INPUT2
CUR. SENSE2
INPUT3
CUR. SENSE3
INPUT4
CUR. SENSE4
GND
1,2
1
1415
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
I
GND1,2
V
CC3,4
GND
V
CC3,4
V
CC1,2
I
S3,4
I
OUT1
I
OUT2
I
OUT3
V
OUT3
I
OUT4
V
OUT4
3,4
I
GND3,4
28
V
1,2
CC
V
OUT2
V
OUT1
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 3
OUTPUT 3
OUTPUT 3
OUTPUT 4
OUTPUT 4
OUTPUT 4
V
3,4
CC
3/18
VNQ600A
THERMAL DATA (Per island)
SymbolParameterValueUnit
R
thj-lead
R
thj-amb
R
thj-amb
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at leas t 35µ m thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C<Tj<150°C; unless otherwise specified)
(Per each channel)
POWER
SymbolParame terTest ConditionsMinTypMaxUni t
(**)Operating supply voltage5.51336V
V
CC
(**)Undervoltage sh ut-down345.5V
V
USD
(**)Overvolta ge shut-down36V
V
OV
R
ON
V
clamp
I
(**)Supply cu rrent
S
I
L(off1)
I
L(off 2)
I
L(off 3)
I
L(off4)
Ther m al re si s ta nce Junction-lead 20°C/W
Thermal resistan ce Junction-ambient (one chip ON)60 (*)°C/W
Thermal resistan ce Junction-ambient (two chips ON )46 (*)°C/W
On state res istance
1,2,3,4=5A; Tj=25°C
I
OUT
I
1,2,3,4=5A; Tj=150°C
OUT
I
1,2,3,4=3A; V
OUT
CC
=6V
35
70
120
Clamp Volt ageICC=20mA (see note 1)414855V
Off Stat e; V
Off Stat e; V
T
=25°C
j
On State; V
=3.9K Ω
R
SENSE
Off state output currentVIN=V
OUT
Off State Output Current VIN=0V; V
Off State Output Current VIN=V
Off State Output Current VIN=V