Datasheet TYN808, TYN1008, TYN608, TS820-700H, TS820-700B Datasheet (SGS Thomson Microelectronics)

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®

TN8, TS8 and TYNx08 Series

SENSITIVE & STANDARD 8A SCRs

April 2002 - Ed: 4A

MAIN FEATURES:

DESCRIPTION

Available either in sensitive (TS8) or standard
(TN8 / TYN) gate triggering levels, the 8A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.

Symbol Value Unit

I

T(RMS)

8A

V

DRM/VRRM

600 to 1000 V

I

GT

0.2 to 15 mA

ABSOLUTE RATINGS (lim iting values)

Symbol Parameter Value Unit

I

T(RMS)

RMS on-state current (180° conduction angle)

Tc = 110°C 8

A

IT

(AV)

Average on-state current (180° conduction angle)

Tc = 110°C 5

A

TS8/TN8 TYN

I

TSM

Non repetitive surge peak on-state
current

tp = 8.3 ms

Tj = 25°C

73 100

A

tp = 10 ms 70 95

I

²

tI

²

t Value for fusing

tp = 10 ms Tj = 25°C 24.5 45

A

2

S

dI/dt

Critical rate of rise of on-state current
I

G

= 2 x IGT , tr ≤ 100 ns

F = 60 Hz Tj = 125°C 50 A/µs

I

GM

Peak gate current tp = 20 µs Tj = 125°C 4 A

P

G(AV)

Average gate power dissipation Tj = 125°C 1 W

T

stg

Tj

Storage junction temperature range
Operating junction temp erature range

- 40 to + 150

- 40 to + 125

°C

V

RGM

Maximum peak reverse gate voltage (for TN8 & TYN only) 5

V

A

K

G

A

G

A

K

DPAK
(TS8-B)
(TN8-B)

A

A

K

G

IPAK
(TS8-H)
(TN8-H)

A

A

K

G

G

A

A

K

TO-220AB

(TS8-T)

TO-220AB

(TYNx)

TN8, TS8 and TYNx08 Series

2/9

ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)

■ SENSITIVE

■ STANDARD

THERMAL RESISTANCES

S= copper surface under tab

Symbol Test Conditions TS820 Unit

I

GT

VD = 12 V RL = 140 Ω

MAX. 200

µA

V

GT

MAX. 0.8 V

V

GD

VD = V

DRM

RL = 3.3 kΩ RGK = 220 Ω

Tj = 125°C MIN.

0.1 V

V

RG

IRG = 10 µA

MIN.

8V

I

H

I

T

= 50 mA RGK = 1 kΩ

MAX. 5 mA

I

L

IG = 1 mA RGK = 1 kΩ

MAX. 6 mA

dV/dt

V

D

= 65 % V

DRM

RGK = 220 Ω

Tj = 125°C MIN. 5 V/µs

V

TM

ITM = 16 A tp = 380 µs

Tj = 25°C MAX. 1.6 V

V

t0

Threshold voltage Tj = 125°C MAX. 0.85 V

R

d

Dynamic resistance Tj = 125°C MAX. 46 mΩ

I

DRM

I

RRM

V

DRM

= V

RRM

RGK = 220 Ω

Tj = 25°C MAX. 5 µA

Tj = 125°C 1 mA

Symbol Test Conditions TN805 TN815 TYNx08 Unit

I

GT

VD = 12 V RL = 33 Ω

MIN. 0.5 2 2 mA

MAX. 5 15 15

V

GT

MAX. 1.3 V

V

GD

VD = V

DRM

RL = 3.3 kΩ

Tj = 125°C MIN.

0.2 V

I

H

IT = 100 mA Gate open

MAX. 25 40 30 mA

I

L

IG = 1.2 I

GT

MAX.

30 50 70

mA

dV/dt

V

D

= 67 % V

DRM

Gate open

Tj = 125°C MIN. 50 150 150 V/µs

V

TM

ITM = 16 A tp = 380 µs

Tj = 25°C

MAX.

1.6

V

V

t0

Threshold voltage Tj = 125°C

MAX.

0.85

V

R

d

Dynamic resistance Tj = 125°C

MAX.

46

mΩ

I

DRM

I

RRM

V

DRM

= V

RRM

Tj = 25°C MAX. 5 µA

Tj = 125°C 2

mA

Symbol Parameter Value Unit

R

th(j-c)

Junction to case (DC)

20

°C/W

R

th(j-a)

Junction to ambient (DC) TO-220AB 60 °C/W

IPAK 100

S = 0.5 cm

²

DPAK 70

/T

TN8, TS8 and TYNx08 Series

3/9

PRODUCT SELECTOR

ORDERING INFORMATION

Part Number

Voltage (xxx)

Sensitivity

Package

600 V 700 V 800 V 1000 V

TN805-xxxB X X 5 mA DPAK
TN805-xxxH X X 5 mA IPAK
TN815-xxxB X X 15 mA DPAK
TN815-xxxH X X 15 mA IPAK
TS820-xxxB X X 0.2 mA DPAK
TS820-xxxH X X 0.2 mA IPAK
TS820-xxxT X X 0.2 mA TO-220AB
TYNx08 X X X 15 mA TO-220AB

TN 8 05 - 600 B (-TR)

STANDARD
SCR
SERIES

CURRENT:8A

SENSITIVITY:
05: 5mA
15: 15mA

VOLTAGE:
600: 600V
800: 800V

PACKAGE:
B: DPAK
H: IPAK

PACKING MODE:
Blank:Tube

-TR: DPAKTape & Reel

TS 8 20 - 600 B (-TR)

SENSITIVE
SCR
SERIES

CURRENT: 8A

SENSITIVITY:
20: 200µA

VOLTAGE:
600: 600V
700: 700V

PACKAGE:
B: DPAK
H: IPAK
T:TO-220AB

PACKING MODE:
Blank:Tube

-TR: DPAKTape & Reel

VOLTAGE:

6: 600V
8: 800V

10: 1000V

STANDARD
SCR
SERIES

CURRENT: 8A

TYN 6 08 (RG)

PACKING MODE
Blank: Bulk
RG:Tube

TN8, TS8 and TYNx08 Series

4/9

OTHER INFORMATION

Note: x = voltage

Part Number Marking Weight Base Quantity Packing mode

TN805-x00B TN805x00 0.3 g 75 Tube
TN805-x00B-TR TN805x00 0.3 g 2500 Tape & reel
TN805-x00H TN805x00 0.4 g 75 Tube
TN815-x00B TN815x00 0.3 g 75 Tube
TN815-x00B-TR TN815x00 0.3 g 2500 Tape & reel
TN815-x00H TN815x00 0.4 g 75 Tube
TS820-x00B TS820x00 0.3 g 75 Tube
TS820-x00B-TR TS820x00 0.3 g 2500 Tape & reel
TS820-x00H TS820x00 0.4 g 75 Tube
TS820-x00T TS820x00T 2.3 g 50 Tube
TYNx08 TYNx08 2.3 g 250 Bulk
TYNx08RG TYNx08 2.3 g 50 Tube

Fig. 1: Maximum average power dissipation
versus average on-state current.

Fig. 2-1: Average and D.C. on-state current
versus case temperature.

Fig. 2-2: Average and D.C. on-state current
versus ambient temperature (device mounted o n
FR4 with recommended pad layout) (DPAK).

Fig. 3-1: Relative variation of thermal impedance
junction to case versus pulse duration.

0123456

0

1

2

3

4

5

6

7

8

P(W)

α = 180°

IT(av)(A)

360°

α

0 25 50 75 100 125

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

10.0

IT(av)(A)

DC

α = 180°

Tcase(°C)

0 25 50 75 100 125

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

IT(av)(A)

α =180°

DC

Tamb( °C)

1E-3 1E-2 1E-1 1E+0

0.1

0.2

0.5

1.0

K = [Zth(j-c)/Rth(j-c)]

tp(s)

TN8, TS8 and TYNx08 Series

5/9

Fig. 3-2: Relative variation of thermal impedance
junction to ambient versus pulse duration
(recommended pad layout, FR4 PC board for
DPAK).

Fig. 4-1: Relative variation of gate trigger current
and holding current versus junction temperature
for TS8 series.

Fig. 4-2: Relative variation of gate trigger current
and holding current versus junction temperature
for TN8 & TYN series.

Fig. 5: Relative variation of holding current
versus gate-cathode resistance (typical values)
for TS8 series.

Fig. 6: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values)
for TS8 series.

Fig. 7: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical values)
for TS8 series.

1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

0.01

0.10

1.00

K = [Zth(j-a)/Rth(j-a)]

DPAK

TO-220AB

tp(s)

-40 -20 0 20 40 60 80 100 120 140

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

IGT,IH,IL [T j] / IG T,IH,IL [Tj = 25°C]

IGT

IH & IL

Rgk = 1kΩ

Tj(°C)

-40 -20 0 20 40 60 80 100 120 140

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

IGT,IH,IL [T j] / IG T,IH,IL [Tj = 25°C]

IGT

IH & IL

Tj(°C)

IH[Rgk] / IH[Rgk = 1k ]Ω

Rgk(k )Ω

Rgk(k )Ω

dV/dt[Rgk] / dV/dt [Rgk = 220 ]Ω

0 20 40 60 80 100 120 140 160 180 200 220

0.0

2.5

5.0

7.5

10.0

12.5

15.0

VD = 0.67 x VDRM

Tj = 125°C

Rgk = 220Ω

dV/dt[Cgk] / dV/d t [R g k = 22 0 Ω]

Cgk(nF)

TN8, TS8 and TYNx08 Series

6/9

Fig. 8: Surge peak on-state current versus
number of cycles. TS8/TN8/TYN.

Fig. 9: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width

tp < 10 ms, and corresponding values of I²t.

Fig. 10: On-state characteristics (maximum
values).

Fig. 11: Thermal resistance junct ion to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 µm)
(DPAK).

1 10 100 1000

0

10

20

30

40

50

60

70

80

90

100

ITSM(A)

TYN

TS8/TN8

Non repetitive

Tj initial = 25°C

Repetitive

Tcase = 110°C

Number of c

ycles

One cycle

tp = 10ms

0.01 0.10 1.00 10.0

0

10

100

1000

ITSM(A),I2t(A2s)

Tj initial = 25°C

ITSM

I2t

dI/dt

limitattion

TYN

TS8/TN8

TYN

TS8/TN8

tp(ms)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

0.1

1.0

10.0

50.0

ITM(A)

Tj max.:
Vto = 0.85V
Rd = 46mΩ

Tj = Tj max.

Tj = 25°C

VTM(V)

02468101214161820

0

20

40

60

80

100

Rth(j-a) ( °C/W)

S(cm2)

TN8, TS8 and TYNx08 Series

7/9

PACKAGE MECHANICAL DAT A

DPAK (Plastic)

REF.

DIMENSIONS

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039

R 0.2 typ. 0.007 typ.
V2 0° 8° 0° 8°

R

R

FOOTPRINT DIMENSIONS (in millimete r s )
DPAK (Plastic)

6.7

6.7

3

3

1.61.6

2.32.3

TN8, TS8 and TYNx08 Series

8/9

PACKAGE MECHANICAL DAT A

IPAK (Plastic)

TO-220AB (Plastic - with notches)

REF.

DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. T yp. Max.

A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051

B 0.64 0.9 0.025 0.035
B2 5.2 5.4 0.204 0.212
B3 0.85 0.033
B5 0.3 0.035
B6 0.95 0.037

C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023

D 6 6.2 0.236 0.244

E 6.4 6.6 0.252 0.260

G 4.4 4.6 0.173 0.181

H 15.9 16.3 0.626 0.641

L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2 0.8 1 0.031 0.039
V1 10° 10°

H

L

L1

G

B5

B
V1

D

C

A1

A3

A

C2

B3

B6

L2

E

B2

REF.

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

G1 2.40 2.70 0.094 0.106

H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0. 511 0.5 51
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.6 20
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

A

C

D

L7

Dia

L5

L6

L9

L4

F

H2

G

G1

L2

F2

F1

E

M

TN8, TS8 and TYNx08 Series

9/9

PACKAGE MECHANICAL DAT A

TO-220AB (Without notches)

REF.

DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551

B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051

C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0. 019 0.027
c2 2.40 2.72 0. 094 0.107

e 2.40 2.70 0.094 0.106

F 6.20 6.60 0. 244 0.259

I 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.10 2

M

B

l4

C

b2

a2

l2

c2

l3

b1

a1

A

F

L

I

e

c1

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