The TS4855 is a complete low power audio
amplifier solution targeted at mobile phones. It
integrates, into an extremely compact flip-chip
package, an audio amplifier, a speaker driver, and
a headset driver.
The Audio Power Amplifier can deliver 1.1 W
(typ.) of continuous RMS output power into an 8
speaker with a 1% THD+N value . To the headset
driver, the amplifier can deliver 85 mW (typ.) per
channel of continuous average power into stereo
32
Ω bridged-tied load with 0.5% THD+N @ 5 V.
PIN CONNECTIONS (top view)
TS4855IJT - Flip Chip
Ω
Pin Out (top view)
This device features a 32-step digital volume
control and 8 different output selections. The
digital volume and output modes are controlled
through a three-digit SPI interface bus.
APPLICATIONS
•Mobile Phones
ORDER CODE
Part Number
TS4855IJT-40, +85°C
J = Flip Chip Package - only available in Tape & Reel (JT))
April 2003
Temperature
Range
Package
J
•
1/27
TS4855Application Information for a Typical A pp lication
1 APPLICATION INFORMATION FOR A TYPICAL APPLICATION
External component descriptions
ComponentFunctional Description
This is the input coupling capacitor. It blocks the DC voltage at, and couples the input signal to the
amplifier’s input terminals. Cin also creates a highpass filter with the internal input impedance Zin at
Fc = 1 / (2
This is the Supply Bypass capacitor. It provides power supply filtering.
This is the Bypass pin capacitor. It provides half-supply filtering.
π x Zin x Cin).
2/27
C
in
C
s
C
B
SPI Bus InterfaceTS4855
2 SPI BUS INTER FACE
2.1 Pin Descriptions
PinFunctional Description
DATAThis is the serial data input pin
CLKThis is the clock input pin
ENBThis is the SPI enable pin active at high level
2.2 SPI Operation Description
The serial data bits are organized into a field
containing 8 bits of data as shown in
DATA 0 to DATA 2 bits determine the output
mode of the TS4855 as shown in
DATA 3 to DATA 7 bits determine the gain level
setting as illustrated by
Table 3
transfer, the data bits are written to the DATA pin
with the least significant bit (LSB) first. All serial
data are sampled at the rising edge of the CLK
signal. Once all the dat a bi ts h ave been sampled,
ENB transitions from logic-high to logic low to
complete the SPI sequence. All 8 bits must be
received before any data latch can occur. Any
excess CLK and DATA tran sitio ns w ill b e igno red
after the height rising clock edge has occurred.
For any data sequence longer than 8 bits, only the
Table 1
Table 2
. The
. The
. For each SPI
first 8 bits will get loaded into the shift register and
the rest of the bits will be disregarded.
Table 1 : Bit Allocation
DATAMODE S
LSBDATA 0Mode 1
DATA 1Mode 2
DATA 2Mode 3
DATA 3gain 1
DATA 4gain 2
DATA 5gain 3
DATA 6gain 4
MSBDATA 7gain 5
Table 2: Output Mode Selection
Output
Mode #
0000SDSDSD
10 0 1
2010MUTE
30 1 1
4100MUTE
51 0 1
6110MUTE
71 1 1
DATA 2DATA 1DATA 0
SPKR
+12dBxP
+12dBxP
+12dBxP
+12dBxP
out
IHF
IHF
IHF
IHF
R
out
SDSD
G1xP
HS
G1xP
HS
G2xR
in
G2xR
in
G2xR
G2xR
HS
+
in
in
G1xP
G1xPHS+
L
out
G1xP
HS
G1xP
HS
G2xL
in
G2xL
in
G1xPHS+
G2xL
in
G1xPHS+
G2xL
in
(SD = Shut Down Mode,
PHS = Non Filtered Phone In HS, P
= External High Pass Filtered Phone In IHF)
IHF
3/27
TS4855SPI Bus Interface
Table 3: Gain Control Settings
G2: Gain (dB)G1: Gain (dB)DATA 7DATA 6DATA 5DATA 4DATA 3
-34.5-40.500000
-33.0-39.000001
-31.5-37.500010
-30.0-36.000011
-28.5-34.500100
-27.0-33.000101
-25.5-31.500110
-24.0-30.000111
-22.5-28.501000
-21.0-27.001001
-19.5-25.501010
-18.0-24.001011
-16.5-22.501100
-15.0-21.001101
-13.5-19.501110
-12.0-18.001111
-10.5-16.510000
-9.0-15.010001
-7.5-13.510010
-6.0-12.010011
-4.5-10.510100
-3.0-9.010101
-1.5-7.510110
0.0-6.010111
1.5-4.511000
3.0-3.011001
4.5-1.511010
6.00.011011
7.51.511100
9.03.011101
10.54.511110
12.06.011111
4/27
Absolute Maximum RatingsTS4855
2.3 SPI Timing Diagram
3 ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
CCSupply voltage
T
T
R
Operating Free Air Temperature Range-40 to + 85°C
oper
Storage Temperature-65 to +150°C
stg
T
Maximum Junction Temperature150°C
j
Flip Chip Thermal Resistance Junction to Ambient
thja
1
2
6V
166°C/W
PdPower DissipationInternally Limited
ESD
ESD
Human Body Model
Machine Model
4
3
2kV
100V
Latch-up Immunity200mA
Lead Temperature (solde ring, 10sec )250°C
1) All voltage values are measured with respect to the ground pin.
2) Device is protected in case of over temperature by a thermal shutdown active @ 150°C typ.
3) Human body model, 100pF discharged through a 1.5kΩ resistor into pin of device.
4) This is a minimum Value. Machine model ESD, a 200pF cap is charged to the specified voltage, then discharged directly into the IC with no external
series resistor (internal resistor < 5Ω), into pin to pin of device.
5.) All PSRR data limits are guaranteed by evaluation tests.
4 OPERATING CONDITIONS
SymbolParameterValueUnit
V
V
V
Rin/VLin
T
Supply Voltage3 to 5V
CC
to VCC
Maximum Phone In Input Voltage
phin
Maximum Rin & Lin Input Voltage
Thermal Shutdown Temperature150°C
Phone In Volume
BTL maximum GAIN from Phone In HS to R
BTL minimum GAIN from Phone In HS to R
Phone In Volume
BTL maximum gain from Rin, Lin to R
BTL minimum gain from Rin, Lin to R
out
out
, L
, L
out
Phone In Volume
BTL gain from Phone In IHF to SPKR
out
out
out
out
, L
, L
out
out
5.4
-41. 16-40.5
11.4
-35. 112-34.5
6.6
-39.9
12.6
-33.9
11.41212.6dB
dB
dB
ZinPhone In IHF Input Impedance162024kΩ
ZinPhone In HS, Rin & Lin Input Impedance, All Gain setting42.55057.5kΩ
tesEnable Step up Time - ENB20ns
tehEnable Hold Time - ENB20ns
telEnable Low Time - ENB30ns
tdsData Setup Time- DATA20ns
tdhData Hold T ime - DATA20ns
tcsClock Setup time - CLK20ns
tchClock Logic High Time - CLK50ns
tclClock Logic Low Time - CLK50ns
fclkClock Frequency - CLKDC10MHz
T able 5: Electrical characteristics at VCC = +3.0 V, GND = 0 V, Tamb = 25°C
(unless otherwise specified)
SymbolParameterMin.Typ.Max.Unit
I
CC
I
STANDBY
Supply Current, all gain @ max settings
Output Mode 1, Vin = 0 V, no load
Output Mode 1, Vin = 0 V, loaded (8Ω)
Output Mode 2,3,4,5,6,7 Vin = 0 V, no loads
Output mode 2,3,4,5,6,7 Vin = 0 V , loaded (8Ω, 32Ω)
Standby Current
3.5
4.5
7.5
9
10
11
Output Mode 00.12
VooOutput Offset Voltage (differential)
Output Mode 1 to 7, Vin = 0 V, no load, Speaker Out
Output Mode 2 to 7 Vin = 0 V, no loads, Headset Out
Vri ppl e=200 mV Vpp, F= 217 Hz, Input Termi nat ed 50Ω
out
Maximum gain setting, Output Mode 2,3
R
& L
out
Vri ppl e=200 mV Vpp, F= 217 Hz, Input Termi nat ed 50Ω
out
Maximum gain setting, Out put Mode 4,5
R
& L
out
Vri ppl e=200 mV Vpp, F= 217 Hz, Input Termi nat ed 50Ω
out
Maximum gain setting, Out put Mode 6,7
G2Digital Gain Range - Rin & Lin to R
out ,Lout
G1Digital Gain Range - Phone In HS to R
Digital Gain stepsize1.5dB
30020340
25
0.5
1
0.5
0.5
80dB
58
52
49
45
61
55
52
48
-34.512dB
out ,Lout
-40.56dB
mW
%
dB
Stepsize Error± 0.6d B
Phone In Volume
BTL maximum GAIN from Phone In HS to R
BTL minimum GAIN from Phone In HS to R
out
out
, L
, L
out
out
5.4
-41.16-40.5
6.6
-39.9
Phone In Volume
BTL maximum gain from Rin, Lin to R
BTL minimum gain from Rin, Lin to R
out
out
, L
, L
out
out
11.4
-35.112-34.5
12.6
-33.9
Phone In Volume
BTL gain from Phone In IHF to SPKR
out
11.41212 .6
ZinPhone In IHF Input Impedanc e, all gains setting162024kΩ
ZinPhone In HS, Rin & Lin Input Impedance, all gains setting42.55057.5kΩ
tesEnable Step up Time - ENB20ns
tehEnable Hold Time - ENB20ns
telEnable Low Time - ENB30ns
8/27
dB
dB
dB
Electrical CharacteristicsTS4855
T able 5: Electrical characteristics at VCC = +3.0 V, GND = 0 V, Tamb = 25°C
(unless otherwise specified)
SymbolParameterMin.Typ.Max.Unit
tdsData Setup Time- DAT A20ns
tdhData Hold Time - DA TA20ns
tcsClock Setup time - CLK20ns
tchClock Logic High Time - CLK50ns
tclClock Logic Low Time - CLK50ns
fclkClock Frequency - CLKDC10MHz
Index of Graphics
DescriptionFigurePage
THD + N vs. Output Power
THD + N vs. Frequency
Output Power vs. Power Su ppl y Voltage
Output Power vs. Load Resistor
PSRR vs. Frequency
Mute Attenuation vs. Frequency
Frequency Response
-3 dB Lower Cut Off Frequency vs. Input Capacitor
-3 dB Lower Cut Off Frequency vs. Gain Setting
Power Derating Curves
Signal to Noise Ratio vs. Power Supply Voltage
Current Consumption vs. Power Supply Voltage
Power Dissipation vs. Output Power
Note:
In the grap hs that follow, the abbreviation s Spkout = Speake r Output, and HDout = Headphone Output are
used.