SGS Thomson Microelectronics TS1220-600B Datasheet

®
FEATURES
I
= 12A
T(RMS)
V
DRM/VRRM
= 600V IGT < 200µA HIGH I
= 110A (tp = 10ms)
TSM
DESCRIPTION
TS1220-600B
SENSITIVE SCR
A
A
G
K
The TS1220-600B is us ing a high performance TOPGLASS PNPN technology and is intended for
DPAK
(Plastic)
applications requiring high surge capability (like power tools, crowbar protection, capacitive dis­charge ignition...).
ABSOLUTE RATINGS
(limiting values)
Symbol Parameter Value Unit
V
DRM
V
RRM
I
T(RMS)
= 125°C RGK = 220
T
j
RMS on-state current
600 V
Tc= 105°C12 A
(180° conduction angle)
I
T(AV)
Average on-state current
Tc= 105°C8 A
(180° conduction angle)
I
TSM
Non repetitive surge peak on-state current (T
initial = 25°C )
j
tp = 10 m s 110 A
tp = 8.3 ms 115
2
I
t
2
I
t Value for fusing
tp = 10 m s 40 A
2
s
dI/dt Critical rate of rise of on-state current
= 10 mA dIG /dt = 0.1 A/µs.
I
G
T
stg
T
j
T
May 1998 - Ed: A3
Storage junction temperature range Operating junction temperature range
Maximum temperature for soldering dur ing 10s
50 A/µs
- 40 to + 150
- 40 to + 125 260
°
C
°
C
1/5
TS1220-600B
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth(j-c) Rth(j-a) Junction to ambient (S = 0.5 cm
GATE CHARACTE RIST ICS
P
= 0.2W PGM = 3 W (tp = 20 µs) IGM = 1.2 A (tp = 20 µs)
G (AV)
Junction to case for D.C
(maximum values)
1.5
2
)70
ELECTRICAL CHARACTERI STICS
Symbol Test Conditions Type Value Unit
I
GT
V
GT
V
GD
V
RG
I
H
V
TM
I
DRM
VD=12V RL=140 VD=12V RL=140 VD=12V(DC) RL=33 IRG = 10µA Tj= 25°C MIN 8 V IT=50mA IG=5mA RGK = 1k ITM= 24A tp= 380µs Tj= 25°CMAX 1.6 V VD= V
DRM RGK
= 220
Tj= 25°C MAX 200 Tj= 25°C MAX 0.8 V Tj= 25°C MAX 0.1 V
Tj= 25°C MAX 5 mA
Tj= 25°C MAX 10
°
C/W
°
C/W
µ
A
µ
A
I
RRM
dV/dt V
VR= V
=67%V
D
RGK = 220
RRM
RGK = 220
DRM
ORDERING INFORMATION
TS 12 20 - 600 B
THYRISTOR SENSITIVE
CURRENT
Tj= 125°C MAX 2 mA Tj= 125°CMIN 5 V/µs
Add "-TR" suffix for Tape and Reel shipment
VOLTAGE
S ENSITIVITY
PACKAGE B = DPAK
2/5
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