The device TDA7299 is a new technology Mono Audio Amplifier in SO package specially designed for
12V sound cards application.
Thanks to the fully complementary output configura-
BLOCK DIAGRAM
SO8 (4+4)
ORDERING NUMBER:
TDA7299
tion the device delivers a rail voltage swing without
need of boostrap capacitors.
IN
47µF
September 2002
0.1µF
IN
SVR
V
S
100µF
470µF
+
VS=12V
-
OUT
8Ω
GND
D94AU160A
1/7
TDA7299
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
I
O
T
op
T
T
stg
Operating Supply Voltage18V
S
Output Put Peak Current1.5A
Operating Temperature Range0 to 70°C
Junction Temperature150°C
j
Storage Temperature Range-40 to 125°C
PIN CONNECTION
THERMAL DATA
(Top view)
V
S
OUT
SVR
INGND
2
3
4
D94AU162
8
7
6
5
GND1
GND
GND
SymbolParameterValueUnit
R
th j-amb
R
th j-case
ELECTRICAL CHARACTERISTICS
(T
amb
SymbolParameterTest ConditionMin.Typ.Max.Unit
R
Thermal Resistance Junction to ambient (on PCB)80°C/W
Thermal Resistance Junction to case20°C/W
= 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.)
V
Supply Voltage Range4.518V
S
I
Quiescent Current2030mA
S
I
Stand-By CurrentPin 2 shorted to GND0.3mA
sb
V
Quiescent Output Voltage6V
O
Voltage Gain20dB
A
V
Input Impedance50100KΩ
IN
P
Output PowerTHD = 10%1.82W
O
= 4Ω, VS = 8.5V, THD = 10%2W
R
L
2/7
TDA7299
ELECTRICAL CHARACTERISTICS
(T
= 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.)
amb
(continued)
SymbolParameterTest ConditionMin.Typ.Max.Unit
P
ot
Transient Output Power
THDDistortionP
SVRSupply Voltage RejectionV
Input Noise VoltageRg = 10KΩ; BW = 20Hz to 20KHz1.55µV
E
I
V
*) Limited by the RTH of the package
Stand-By Enable Voltage1V
sb
*)
Vi = 400mVp, THD < 2%, RL = 4Ω 2W
= 1W1%
O
= 150mVrms;
ripple
F
= 1KHz
ripple
50dB
Figure 1. Application Circuit
V
=12V
S
STAND-BY
V
S
0.1µF
IN
IN
SVR
47µF
GND
100µF
470µF
OUT
8Ω
V
S
470µF
OUT
8Ω
D94AU161A
STAND-BY
0.1µF
IN
IN
SVR
47µF
GND
APPLICATION HINTS:
For 12V supply and 8Ω speaker application, its maximum power dissipation is about 1.8W.
Assumming that max ambient temperatur e i s 70° C. re quired thermal resistance of the device and heat dissipat-
ing means must be equal to (150 - 70)/1.8 = 45°C/W.
Junction to pin thermal resistance of the package is about 20°C/W. That means external heat sink of about
25°C/W is required.
Cu ground plane of PCB can be used as heat dissipating means.
Stand-By switches must be able to discharge C
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