INTERNAL FIXED GAIN 32dB
NO FEEDBACK CAPACITOR
NO BOUCHEROT CELL
THERMAL PROTECTION
AC SHORT CIRCUIT PROTECTION
SVR CAPACITOR FOR BETTER RIPPLE
REJECTION
LOW TURN-ON/OFF POP
VERY FEW EXTERNAL COMPONENTS
STAND -BY MODE (I
ST-BY
< 300µA)
DESCRIPTION
The device TDA7268 is a new technology stereo
Audio Amplifier in DIP package specially de-
BLOCK DIAGRAM
Ω
TDA7268
POWERDIP (8+8)
ORDERING NUMBER:
TDA7268
signed for TV application.
Thanks to the fully complementary output configu-
ration the device delivers a rail to rail voltage
swing without need of boostrap capacitor.
IN1
IN2
SVR
4
5
3
S-GND
+
-
+
-
69÷16
P-GND
1
2
8
7
V
S1
OUT1
V
S2
OUT2
D94AU167B
March 1998
1/5
TDA7268
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
S
I
O
T
op
T
j
T
stg
PIN CONNECTION
Operating Supply Voltage18V
Output Peak Current1.5A
Operating Temperature Range0 to 70°C
Junction Temperature150°C
Storage Temperature Range-40 to 125°C
V
S1
OUT1
SVR
IN1
IN2
S-GND
OUT2
V
S2
1
2
3
4
5
6
7
16
15
14
13
12
11
10
8PGND9
D94AU164A
PGND
PGND
PGND
PGND
PGND
PGND
PGND
THERMAL DATA
SymbolParameterValueUnit
R
th j-amb
R
th j-case
Rth with "on Board" Square Heat Sink vs. Copper
Thermal Resistance Junction to ambient (on PCB) Max.70°C/W
Thermal Resistance Junction to case Max.15°C/W
Example of heatsink using PC board copper
Area
54
52
50
48
46
44
42
40
38
36
34
THERMAL RESISTANCE JUNCTION TO AMBIENT(˚C/W)
024681012
ON BOARD HEAT-SINK AREA (sq.cm)
2/5
D98AU830
TDA7268
ELECTRICAL CHARACTERISTICS
= 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless ot herwise s pecified. )
(T
amb
SymbolParameterTest ConditionMin.Typ.Max.Unit
V
S
I
S
I
sb
V
O
A
V
∆A
R
IN
P
O
THDDistortionP
SVRSupply Voltage RejectionV
e
n
Supply Voltage Range4.518V
Quiescent Current4060mA
Stand-By CurrentPin 3 shorted to GND0.150.3mA
Quiescent Output Voltage5.566.5V
Voltage Gain313233dB
Voltage Gain Matching1.0dB
PCB And Components Layout Of The Application Circuit of Figure 1
APPLICATION HINTS:
For 12V supply and 8Ω speaker application, its
maximum power dissipation is about 2W.
Assumming that max ambient temperature is
70°C. Required thermal resistance of the device
and heat dissipating means must be equal to (150
- 70)/2 = 40°C/W.
Junction to pin thermal resistance of the package
is about 15°C/W.
That means external heat sink of about 25°C/W is
required. Stand-By switches must be able to discharge C
current.
svr
4/5
DIP16 PACKAGE MECHANICAL DATA
TDA7268
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
a10.510.020
B0.771.650.0300.065
b0.50.020
b10.250.010
D200.787
E8.50.335
e2.540.100
e317.780.700
F7.10.280
I5.10.201
L3.30.130
Z1.270.050
mminch
5/5
TDA7268
Information furnis hed is believe d to be ac curate and reliabl e. However, SGS-THOMS ON Mi croelect ronics as sumes no res ponsib ility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties w hi ch may result from i ts use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.