SGS Thomson Microelectronics TDA7268 Datasheet

2 x 2W STEREO AUDIO AMPLIFIER

WIDE OPERATING RANGE FROM 4.5V TO 18V
P

= 2W @ THD 10% 12V/8

OUT

INTERNAL FIXED GAIN 32dB
NO FEEDBACK CAPACITOR
NO BOUCHEROT CELL
THERMAL PROTECTION
AC SHORT CIRCUIT PROTECTION
SVR CAPACITOR FOR BETTER RIPPLE

REJECTION
LOW TURN-ON/OFF POP
VERY FEW EXTERNAL COMPONENTS
STAND -BY MODE (I

ST-BY

< 300µA)

DESCRIPTION

The device TDA7268 is a new technology stereo
Audio Amplifier in DIP package specially de-

BLOCK DIAGRAM

Ω

TDA7268

POWERDIP (8+8)

ORDERING NUMBER:

TDA7268

signed for TV application.
Thanks to the fully complementary output configu-

ration the device delivers a rail to rail voltage
swing without need of boostrap capacitor.

IN1

IN2

SVR

4

5

3

S-GND

+

-

+

-

69÷16

P-GND

1

2

8

7

V

S1

OUT1

V

S2

OUT2

D94AU167B

March 1998

1/5

TDA7268

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

V

S

I

O

T

op

T

j

T

stg

PIN CONNECTION

Operating Supply Voltage 18 V
Output Peak Current 1.5 A
Operating Temperature Range 0 to 70 °C
Junction Temperature 150 °C
Storage Temperature Range -40 to 125 °C

V

S1

OUT1

SVR

IN1
IN2

S-GND

OUT2

V

S2

1
2
3
4
5
6
7

16
15
14
13
12
11
10

8 PGND9

D94AU164A

PGND
PGND
PGND
PGND
PGND
PGND
PGND

THERMAL DATA

Symbol Parameter Value Unit

R

th j-amb

R

th j-case

Rth with "on Board" Square Heat Sink vs. Copper

Thermal Resistance Junction to ambient (on PCB) Max. 70 °C/W
Thermal Resistance Junction to case Max. 15 °C/W

Example of heatsink using PC board copper

Area

54
52
50
48
46
44
42
40
38
36
34

THERMAL RESISTANCE JUNCTION TO AMBIENT(˚C/W)

024681012

ON BOARD HEAT-SINK AREA (sq.cm)

2/5

D98AU830