SGS Thomson Microelectronics TDA7267A Datasheet

®
TDA7267A
3W MONO AMPLIFIER
CAN DELIVER 3W THD 10% 14.5V/8
INTERNAL FIXED GAIN 32dB NO FEEDBACK CAPACITOR NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLE
REJECTION LOW TURN-ON/OFF POP STAND-BY MODE
DESCRIPTION
The device TDA7267A is a new technology Mono Audio Amplifier in PowerDIP package specifically designed for TV application.
Thanks to the fully complementary output configu-
BLOCK DIAGRAM
PowerDIP 8+8
ORDERING NUMBER:
TDA7267A
ration the device delivers a rail to rail voltage swing without need of boostrap capacitors.
June 1998
IN
C3
47µF
C1 0.1µF
SVR
V
S
1
4
IN
3
6 9 to 16
S-GND P-GND
+
-
VS=14.5V
C4
100µF
C5 470µF
2
OUT
8
D98AU827
1/7
TDA7267A
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
S
I
O
T
op
T
j
T
stg
Operating Supply Voltage 18 V Output Put Peak Current 1.5 A Operating Temperature Range 0 to 70 °C Junction Temperature 150 °C Storage Temperature Range -40 to 125 °C
PIN CONNECTION
(Top view)
V OUT SVR
IN
N.C.
S-GND
N.C.
S
1 2 3 4 5 6 7 P-GND
N.C. 8 P-GND9
D98AU829
Rth with "on Board" Square Heat Sink vs. Copper Area
54 52 50 48 46 44 42 40 38 36 34
THERMAL RESISTANCE JUNCTION TO AMBIENT(˚C/W)
024681012
ON BOARD HEAT-SINK AREA (sq.cm)
D98AU830
P-GND16 15 14 13 12 11
P-GND
P-GND
P-GND
P-GND
P-GND 10
Example of heatsink using PC board copper
2/7
TDA7267A
THERMAL DATA
Symbol Parameter Value Unit
R
th j-amb
R
th j-case
Thermal Resistance Junction to ambient 70 °C/W Thermal Resistance Junction to case 15 °C/W
= 25°C; VS = 14.5V; RL = 8Ω; f = 1KHz; unless otherwise
(T
amb
specified.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
V
S
I
S
I
sb
V
O
A
V
R
IN
P
O
THD Distortion P SVR Supply Voltage Rejection V
E
I
V
sb
Supply Voltage Range 5 18 V Quiescent Current 23 35 mA Stand-By Current Pin 3 shorted to GND 0.3 mA Quiescent Output Voltage 7.5 V Voltage Gain 31 33 dB Input Impedance 50 100 K Output Power THD = 10% 2.7 3 W
= 1W 0.1 0.3 %
O
= 150mVrms;
ripple
F
= 1KHz
ripple
Input Noise Voltage Rg = 10K; BW = 20Hz t o 2 0KHz 5 10 µV Stand-By Enable Voltage 1 V
50 dB
Figure 1. Application Circuit
=14.5V
V
S
C1 0.1µF
IN
V
S
1
C4
100µF
C5 470µF
4
2
IN
OUT
SVR
8
D98AU828
STAND-BY
C3
47µF
3
6
S-GND
9 to 16
P-GND
APPLICATION HINTS:
For 14.5V supply and 8Ω speaker application, its maximum power dissipation is about 1.8W.
Assumming that max ambient temperature is 70°C, the required thermal resistance of the de­vice mounted on t he PCB with a dissipating area
must be equal to: (150 - 70)/1.8 = 44.4°C/W. Junction to pin thermal resistance of the package
is about 15°C/W. That means external heat sink of about 30°C/W is required.
Cu ground plane of PCB can be used as heat dis­sipating means.
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