®
TDA7267
2W MONO AMPLIFIER
CAN DELIVER 2W THD 10% 12V/8
INTERNAL FIXED GAIN 32dB
NO FEEDBACK CAPACITOR
NO BOUCHEROT CELL
THERMAL PROTECTION
AC SHORT CIRCUIT PROTECTION
SVR CAPACITOR FOR BETTER RIPPLE
REJECTION
LOW TURN-ON/OFF POP
STAND-BY MODE
DESCRIPTION
The device TDA7267 is a new technology Mono
Audio Amplifier in MINIDIP package specifically
designed for TV application.
Thanks to the fully complementary output configu-
BLOCK DIAGRAM
Ω
V
S
MINIDIP (4+4)
ORDERING NUMBER:
ration the device delivers a rail to rail voltage
swing without need of boostrap capacitors.
TDA7267
VS=12V
100µF
June1998
IN
47µF
0.1µF
IN
SVR
S-GND P-GND
+
470µF
-
OUT
8Ω
D94AU165
1/5
TDA7267
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
S
I
O
T
op
T
j
T
stg
Operating Supply Voltage 18 V
Output Put Peak Current 1.5 A
Operating Temperature Range 0 to 70 °C
Junction Temperature 150 °C
Storage Temperature Range -40 to 125 °C
PIN CONNECTION
(Top view)
V
OUT
SVR
IN
S
1
2
3
4 GND
D94AU163
7
6
5
GND8
GND
GND
THERMAL DATA
Symbol Parameter Value Unit
R
th j-amb
R
th j-case
ELECTRICAL CHARACTERISTICS
Thermal Resistance Junction to ambient (on PCB) 80 °C/W
Thermal Resistance Junction to case 15 °C/W
= 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise speci-
(T
amb
fied.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
V
S
I
S
I
sb
V
O
A
V
R
IN
P
O
THD Distortion PO = 1W 1.0 %
SVR Supply Voltage Rejection V
E
I
V
sb
Supply Voltage Range 4.5 18 V
Quiescent Current 20 30 mA
Stand-By Current Pin 3 shorted to GND 0.3 mA
Quiescent Output Voltage 6 V
Voltage Gain 32 dB
Input Impedance 100 KΩ
Output Power THD = 10% 1.8 2 W
= 150mVrms;
ripple
F
= 1KHz
ripple
Input Noise Voltage Rg = 10KΩ; BW = 20Hz to 20KHz 1.5 5 µV
Stand-By Enable Voltage 1 V
50 dB
2/5
APPLICATION CIRCUIT
TDA7267
V
=12V
V
S
100µF
S
0.1µF
IN
STAND-BY
IN
SVR
47µF
P-GND
APPLICATION HINTS:
For 12V supply and 8Ω speaker application, its
maximum power dissipation is about 1W.
Assumming that max ambient temperature is
70°C. Required thermal resistance of the device
and heat dissipating means must be equal to (150
- 70)/1 = 80°C/W.
470µF
OUT
8Ω
D94AU166
Junction to pin thermal resistance of the package
is about 15°C/W. That means external heat sink
of about 65°C/W is required.
Cu ground plane of PCB can be used as heat dissipating means.
Stand-By switches must be able to discharge C
svr
current.
3/5
TDA7267
MINIDIP PACKAGE MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.3 0.130
a1 0.7 0.028
B 1.39 1.65 0.055 0.065
B1 0.91 1.04 0.036 0.041
b 0.5 0.020
b1 0.38 0.5 0.015 0.020
D 9.8 0.386
E 8.8 0.346
e 2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 7.1 0.280
I 4.8 0.189
L 3.3 0.130
Z 0.44 1.6 0.017 0.063
mm inch
4/5
TDA7267
Information furnishe d is beli eved to be accu rate and reliable. However, STMicroelec tronics assumes no res ponsibility for the consequences
of use of such i nformation nor for any i nfringement of patents or ot her rights of third par ties which may result from its use. No license i s
granted by impli cation or otherwis e under any patent or patent righ ts of STMicroelect ronics. Specifica tion mentioned in this publication are
subject to change without notic e. This public ation supers edes and replaces all information prev iously supplied. STMic roelec tronic s products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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