HIGHCURRENT CAPABILITY(UP TO 3.5A)
STAND-BY FUNCTION
AC SHORT CIRCUIT PROTECTION
THERMAL OVERLOAD PROTECTION
=4Ω,VS= 28V
L
TDA7262
DESCRIPTION
The TDA7262is class AB dual Hi-Fi Audio power
amplifier assembled in Multiwatt package, specilally designed for high quality stereo application
as Hi-Fi music centersand TV sets.
Figure1: Stereo Application Circuit with Stand-By
MULTIWATT11
ORDERING NUMBER: TDA7262
March 1995
1/8
TDA7262
ABSOLUTE MAXIMUMRATINGS
SymbolParameterValueUnit
V
I
O
I
O
P
tot
T
stg,Tj
PIN CONNECTION
Supply Voltage35V
S
Output Peak Current(repetitive f > 20Hz)3.5A
Output Peak Current(non repetitive, t > 100µs)4.5A
Power Dissipation (T
=70°C)30W
case
Storage and JunctionTemperature-40 to 150°C
TEST CIRCUIT
2/8
TDA7262
THERMAL DATA
SymbolDescriptionValueUnit
R
th j-case
Thermal Resistance Junction-caseMax2.5°C/W
ELECTRICAL CHARACTERISTICS (Refer to the stereo test circuit, VS= 28V; f = 1KHz; T
amb
unless otherwisespecified)
SymbolParameterTest ConditionMin.Typ.Max.Unit
V
S
V
O
I
d
P
O
Supply Voltage832V
Quiescent Output VoltageVS= 32V15.5V
Total Quiescent CurrentVS= 28V
V
= 32V
S
65
70120
Output Power (eachchannel)Music Power STD rules(T = 1s)
V
= 32V;d = 10%; RL=4Ω28W
S
d =10%
R
=4Ω
L
R
=8Ω10
L
22
13
d=1%
R
R
=4Ω
L
=8Ω
L
18
10
dTotal Harmonic Distortionf = 100Hz to 10KHz
P
CTCross TalkR
G
∆G
e
V
i
R
i
f
L
f
H
V
N
Input Saturation Voltage(Vrms)300mV
Input Resistancef = 1KHz; non invertingInput70200KΩ
Low Frequency roll-off(-3dB)RL=4Ω40Hz
High Frequency roll-off (-3dB)RL=4Ω80KHz
Closed Loop VoltageGainf = 1KHz35.53636.5dB
Closed Loop Gain match0.5dB
The recommended values of the components are those shown on application circuit of Figure 1. Different values can be used;the followingtable can helpthe designer.
Component
R1 and R31.3KΩ
R2 and R418ΩDecrease ofgainIncrease of gain
R5 and R61ΩFrequency stabilityDanger of oscillations
C1 and C22.2µFInput DC decouplinghigher turn-on delay- worse turn-ONpop
C322µF (**)- Ripple rejection
C4100nFSupply settingDanger of oscillations
C51000µFSupply settingworse turn-OFF pop
C6 and C7220µFFeedback input DC
C8 and C90.1µFFrequency stabilityDanger of oscillations
C10 and C111000µFto
(*) Closed loop gain must be higher than 26dB.
(**) 220µF in caseof stand-by utilization.
Recomm.
Value
2200µF
PurposeLarger thanSmaller than
Close loop gain setting (*)
- Stand-by time constant
decoupling
Output DC decouplingHigher low-frequency
Increase of gainDecrease of gain
- higer low freq. cutoff.
Increase of noise
Increase of the
Switch-on time
- Degradation of SVR
- worse turn-OFFpop by
stand-by
cut-off
Figure2: Ouput Power vs. SupplyVoltage
Figure3: Ouput Power vs. SupplyVoltage
4/8
TDA7262
Figure4: Distortion vs. OuputPower
Figure6: QuiescentCurrent vs. SupplyVoltage
Figure5: Distortion vs. OuputPower
Figure7: Supply Voltage Rejectionvs. Frequency
Figure8: Output Attenuationvs. Vpin3
Figure9: Total Power Dissipation & Efficiency
vs. Output Power
5/8
TDA7262
Figure11: TotalPower Dissipation& Efficiency
vs. Output Power
BUILD-INPROTECTIONSYSTEMS
Thermalshut-down
The presence of a thermal limiting circuit offers
the following advantages:
1) an overloadon the output (even if it is permanent), or an excessive ambient temperature
can be easilywithstood.
2) the heatsink can have a smaller factor of
safety compared with that of a conventional
circuit. There is no device damage in the case
of excessive junction temperature; all that
happens is that P
I
are reduced. The maximum allowable
O
( and therefore Ptot) and
O
power dissipation depends upon the size of
the external heatsink (i.e. its thermal resistance); Figure 12 shows this dissipablepower
as a function of ambient temperature for different thermal resistance.
Figure12
Shortcircuit (AC Conditions)
The TDA7262 can withstand accidental short circuits across the speaker made by a wrong connectionduringnormal play operation.
MOUNTING INSTRCTIONS
The power dissipated in the circuit must be removedby adding an external heatsink.
Thanks to the MULTIWATT package attaching
the heatsink is very simple, a screw or a compression spring (clip) being sufficient. between
the heatsink and the package it is better to insert
a layer of silicon grease, to optimize the thermal
contact; no electrical isolation is needed between
the two surfaces.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibilityfor the
consequences of use of such informationnor for any infringement ofpatents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in thispublication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All Rights Reserved
MULTIWATT is aRegistered Trademark of SGS-THOMSON Microelectronics
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil- France - Germany - Hong Kong -Italy- Japan- Korea -Malaysia -Malta- Morocco- The Netherlands- Singapore-
Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom- U.S.A.
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