SGS Thomson Microelectronics STW20NA50 Datasheet

STW20NA50
N - CHANNEL ENHANCEMENT MODE
FAST POWER MOS TRANSISTOR
TYPE V
DSS
R
DS(on)
I
D
STW20NA50 500 V < 0.27 20 A
TYPICAL R
± 30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
LOW INTRINSIC CAPACITANCES
GATE GHARGE MINIMIZED
REDUCED THRESHOLD VOLTAGE SPREAD
DS(on)
= 0.22
o
C
DESCRIPTION
This series of POWER MOSFETS represents the most advanced high voltage technology. The op­timized cell layout coupled with a new proprietary edge termination concur to give the device low R
and gate charge, unequalled ruggedness
DS(on)
and superior switching performance.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITCH MODE POWERSUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE
3
2
1
TO-247
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symb o l Paramet er Val u e Unit
V
V
V
I
DM
P
T
() Pulsewidth limited bysafe operating area
December 1996
Drain - s ource Voltage (VGS= 0) 500 V
DS
Drain- gate Voltage (RGS=20kΩ) 500 V
DGR
Gate-source Voltage ± 30 V
GS
Drain Current (continuous) at Tc=25oC20A
I
D
Drain Current (continuous) at Tc=100oC12.7A
I
D
(•) Drain Current (pulsed) 80 A
Total Di ssipation at Tc=25oC 250 W
tot
Derating F actor 2 W/ St or a ge Tem perature -65 to 150
stg
Max. Operating Junction Temperature 150
T
j
o
C
o
C
o
C
1/9
STW20NA50
THERMAL DATA
R
thj-case
R
thj-amb
R
thj-amb
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Valu e Uni t
I
AR
E
E
I
AR
Thermal Resistance Junction - cas e Max Thermal Resistance Junction- ambient Max Thermal Resistance Case-sink Typ Maximum L ead Temperat ur e For Soldering Purpos e
l
Avalanc h e Cu rr ent , Repet itive or Not-R ep et itive (pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng Tj=25oC, ID=IAR,VDD=50V) Repetitive Avalanc he Energ y
AR
(pulse width limited by Tjmax, δ <1%) Avalanc h e Cu rr ent , Repet itive or Not-R ep et itive
(Tc= 100oC, pulse width limited by Tjmax, δ <1%)
0.5 30
0.1
300
20 A
1000 mJ
8mJ
12.7 A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwise specified)
case
OFF
Symbol Parameter Test Condition s Min. Typ. Max. Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS= 0 500 V
Break d own Volta ge
I
DSS
I
GSS
Zer o Gate Volt age Drain Current (V
GS
Gat e- body Leak age
=0)
=MaxRating
V
DS
V
= Max Rating x 0 .8 Tc=125oC
DS
25
250
VGS= ± 30 V ± 100 nA
Current (VDS=0)
ON ()
Symbol Parameter Test Condition s Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID=250µA 2.25 3 3.75 V St at ic Drain-s our ce O n
VGS=10V ID= 10 A 0.22 0.27
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on)max
20 A
VGS=10V
DYNAMIC
Symbol Parameter Test Condition s Min. Typ. Max. Unit
()Forward
g
fs
Tr ansconductance
C C C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
= 10 A 10 17.5 S
VDS=25V f=1MHz VGS= 0 3600
490 140
4700
650 180
µA µA
pF pF pF
2/9
STW20NA50
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Condition s Min. Typ. Max. Unit
t
d(on)
(di/dt)
Q Q Q
Turn-on T im e
t
Rise Time
r
Turn-on C urrent S lope VDD=400V ID=20A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
Symbol Parameter Test Condition s Min. Typ. Max. Unit
t
r(Voff)
t
Off -voltage R ise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAIN DIODE
VDD=250V ID=10A RG=4.7 Ω VGS=10V
30 55
(see test circuit, figure 3)
160 A/µs RG=47 Ω VGS=10V (see test circuit, figure 5)
VDD= 400 V ID=20A VGS=10V 150
18 72
VDD=400V ID=20A RG=4.7 Ω VGS=10V (see test circuit, figure 5)
40 25 75
40 75
195 nC
55 35
100
ns ns
nC nC
ns ns ns
Symbol Parameter Test Condition s Min. Typ. Max. Unit
I
I
SDM
SD
Source-drain Current
()
Source-drain Current
20 80
(pulsed)
V
(∗) Forward On Volt age ISD=20A VGS=0 1.6 V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD= 20 A di/dt = 100 A/µs VDD= 100 V Tj=150oC (see test circuit, figure 5)
610
10.1
Charge
I
RRM
Reverse Recovery
33
Current
() Pulsed:Pulse duration = 300 µs, dutycycle 1.5 % () Pulse widthlimited by safeoperating area
Safe Operating Areas Thermal Impedance
A A
ns
µC
A
3/9
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