SGS Thomson Microelectronics STW10NK60Z, STP10NK60Z, STP10NK60ZFP, STB10NK60Z-1, STB10NK60Z Datasheet

STP10NK60Z/FP, STB10NK60Z/-1
STW10NK60Z
N-CHANNEL 600V-0.65-10A TO-220/FP/D2PAK/I2PAK/TO-247
TYPE V
STP10NK60Z STP10NK60ZFP STB10NK60Z STB10NK60Z-1 STW10NK60Z
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
VERY LOW INTRINSIC CAPACITANCES
VERY GOOD MANUFACTURING
600 V 600 V 600 V 600 V 600 V
(on) = 0.65
DS
DSS
R
DS(on)
< 0.75 < 0.75 < 0.75 < 0.75 < 0.75
I
D
10 A 10 A 10 A 10 A 10 A
Pw
115 W
35 W 115 W 115 W 156 W
REPEATIBILITY
DESCRIPTION
The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip­based PowerME SH™ layout. In addition to pushing on-resistance significantly down, special care is tak­en to ensure a very good dv/dt capability for the most demanding applications. Such series comple­ments ST full range of high voltage MOSFETs i n­cluding revolutionary MDmesh™ products.
TO-220
D2PAK
3
1
1
I2PAK
2
TO-220FP
3
TO-247
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
2
1
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
LIGHTING
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP10NK60Z P10NK60Z TO-220 TUBE
STP10NK60ZFP P10NK60ZFP TO-220FP TUBE STB10NK60ZT4 B10NK60Z
STB10NK60Z-1
B10NK60Z
STW10NK60Z W10NK60Z TO-247 TUBE
2
PAK
D
2
I
PAK
TAPE & REEL
TUBE
1/14July 2003
STP10NK60Z-STP10NK60ZFP, STB10NK60Z, ST B10NK60Z -1, S TW10NK 60Z
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
TO-220/
2
PAK/I2PAK
D
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ) 600 V Gate- source Voltage ± 30 V Drain Current (continuous) at TC= 25°C 10 10 (*) 10 A Drain Current (continuous) at TC= 100°C 5.7 5.7 (*) 5.7 A
()
Drain Current (pulsed) 36 36 (*) 36 A Total Dissipation at TC= 25°C
115 35 156 W
I
V
DM
P
V
DGR
V
I I
TOT
DS
GS D D
Derating Factor 0.92 0.28 1.25 W/°C
V
ESD(G-S)
Gate source ESD (HBM-C=100pF, R=1.5KΩ)
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area (1) I
10A, di/dt 200A/µs,VDD≤ V
SD
Insulation Withstand Voltage (DC) Operating Junction Temperature
Storage Temperature
(BR)DSS,Tj≤TJMAX.
- 2500 - V
THERMAL DATA
TO-220
2
PAK
I
Rthj-case Thermal Resistance Junction-case Max 1.09 3.6 0.8 °C/W
Rthj-pcb Thermal Resistance Junction-pcb Max
(Whenmountedon minimum Footprint)
Rthj-amb Thermal Resistance Junction-ambient
Max
T
l
Maximum Lead Temperature For Soldering Purpose
2
PAK
D
60 °C/W
TO-220FP TO-247
600 V
4000 V
-55 to 150 °C
(*)Limited only by maximumtemperatureallowed
TO-220FP TO-247 Unit
62.5 50 °C/W 300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
E
AS
E
AR
Single Pulse Avalanche Energy (starting T
= 25 °C, ID=IAR,VDD=50V)
j
Repetitive Avalanche Energy (Pulse with limited by T
max)
j
max.)
j
9A
300 mJ
3.5 mJ
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain) 30 V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIOD ES
The built-in back -to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb pos sible voltage trans ients that may occas ionally be applied from gate to source. In this respect the Zener v olt age is appropriate to achieve an efficient and cost-effective intervention toprotectthedevice’sintegrity.These integrated Zener diodes thus avoid the usage of external components.
2/14
STP10NK60Z-STP10NK60ZFP, STB10N K60 Z, STB10N K60Z-1, ST W 10N K60Z
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SP ECIFIED)
CASE
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=1mA,VGS= 0 600 V
Breakdown Voltage
I
I
GSS
V
GS(th)
R
DS(on)
DSS
Zero Gate Voltage Drain Current (V
GS
=0)
Gate-body Leakage Current (V
DS
=0) Gate Threshold Voltage Static Drain-source On
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C V
= ± 20V ±10 µA
GS
V
DS=VGS,ID
= 100µA
3 3.75 4.5 V
1
50
VGS=10V,ID= 4.5 A 0.65 0.75
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS=15V,ID= 4.5 A 7.8 S
g
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
(3) Equivalent Output
=25V,f=1MHz,VGS= 0 1370
V
DS
156
37
VGS=0V,VDS= 0V to 480V 90 pF
Capacitance
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q Q Q
Turn-on Delay Time
t
r
g gs gd
Rise Time
Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD=300V,ID=4A RG= 4.7VGS=10V (Resistive Load see, Figure 3)
=480V,ID=8A,
V
DD
V
=10V
GS
20 20
50 10 25
70
µA µA
pF pF pF
ns ns
nC nC nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
Fall Time
VDD= 300 V, ID=4A R
=4.7ΩVGS=10V
G
55 30
(Resistive Load see, Figure 3)
t
r(Voff)
t
f
t
c
Fall Time Cross-over Time
Off-voltage Rise Time
= 480V, ID=8A,
V
DD
RG=4.7Ω, VGS= 10V (Inductive Load see, Figure 5)
18 18 36
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. C
Source-drain Current
(2)
Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
.
V
DSS
ISD=10A,VGS=0 I
SD
VDD=40V,Tj= 150°C (see test circuit, Figure 5)
= 8 A, di/dt = 100A/µs
570
4.3 15
when VDSincreases from 0 to 80%
oss
10 36
1.6 V
ns ns
ns ns ns
A A
ns
µC
A
3/14
STP10NK60Z-STP10NK60ZFP, STB10NK60Z, ST B10NK60Z -1, S TW10NK 60Z
Safe Opera ting Area For TO-220/D2PAK/I2PAK
Thermal Impedance For TO-220/D2PAK/ I2PAK
Thermal Im pedance For TO-220FPSafe Operating Area For TO-220FP
4/14
Thermal Im pedance For TO-247Safe Operating Area For TO-247
STP10NK60Z-STP10NK60ZFP, STB10N K60 Z, STB10N K60Z-1, ST W 10N K60Z
Output Characteristics
Transconductance Static Drain-source On Resistance
Transfer Characteri stic s
Capacitance VariationsGate Charge vs Gate-source Voltage
5/14
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