SGS Thomson Microelectronics STW10NB60 Datasheet

STW10NB60
N - CHANNEL 600V - 0.69- 10A - TO-247
PowerMESH MOSFET
TYPE V
DSS
R
DS(on)
I
D
ST W 10NB60 600 V < 0. 8 10 A
TYPICALR
EXTREMELYHIGH dv/dtCAPABILITY
100%AVALANCHETESTED
GATECHARGE MINIMIZED
DS(on)
= 0.69
DESCRIPTION
Using the latest high voltage MESH OVERLAY process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company’s proprietary edge termination structure, gives the lowest R
per area, exceptional avalanche
DS(on)
and dv/dt capabilities and unrivalled gate charge and switching characteristics.
APPLICATIONS
SWITCHMODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENTANDUNINTERRUPTIBLE POWERSUPPLIESAND MOTOR DRIVE
HIGHCURRENT, HIGH SPEED SWITCHING
3
2
1
TO-247
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
DM
P
dv/dt(
T
() Pulsewidth limited by safe operating area (1)ISD≤10A, di/dt ≤ 200 A/µs, VDD≤ V
October 1998
Dra in- sour c e Voltage ( VGS= 0) 600 V
DS
Dra in- gate Vol t age (RGS=20kΩ) 600 V
DGR
Gat e-source Voltage
GS
I
Dra in Curr ent (c ont inuous) at Tc=25oC10A
D
I
Dra in Curr ent (c ont inuous) at Tc=100oC6.2A
D
30 V
±
() Dra in Curr ent (p ulsed) 40 A
Tot al Dissipat ion at Tc=25oC 160 W
tot
Der ati ng Factor 1.28 W/
1) P eak Diode Recover y voltage slope 4.5 V/ns
St orage Tem pe rat ure -65 to 150
stg
T
Max. Oper at ing Junction Tem perature 150
j
,TjT
(BR)DSS
JMAX
o
C
o
C
o
C
1/8
STW10NB60
THERMAL DATA
R
thj-case
Rthj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
Ther mal Res istance J unction- cas e Max Ther mal Res istance J unction- ambient Max Ther mal Res istance C ase - sink Ty p Maximum Lead T emperat ur e For S o lder ing Purpose
l
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
Single Pulse A valanche E ner gy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max,δ <1%)
j
0.78 30
0.1
300
10 A
850 mJ
o
C/W
oC/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS= 0 600 V
Break dow n Volt age
I
DSS
I
GSS
Zero Gate Voltage Drain Current (V
GS
Gat e- bod y Leakage Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRating Tc=100oC
V
DS
V
=± 30 V
GS
1
50
100 nA
±
ON()
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID= 250 µA 345V Sta t ic Dr ain -s ource O n
VGS=10V ID=4 A 0.69 0.8
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on)max
10 A
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input C apac i t ance
iss
Out put Capacitance
oss
Reverse T r ansfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on)maxID
=17A 3 6.5 S
VDS=25V f=1MHz VGS= 0 1480
210
25
1924
273
33
µ µA
pF pF pF
A
2/8
STW10NB60
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Time Rise T i me
VDD=300V ID= 4.5 A R
=4.7
G
VGS=10V
25 11
35 15
(see test circuit, figure 3)
Q Q Q
Tot al G at e Char ge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD= 480 V ID=9 A VGS=10V R
=4.7
G
VGS=10V
40
10.5
17.5
56 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
t
Off-voltage Rise T im e Fall T ime
f
Cross-over Time
c
VDD=480V ID=9A
=4.7 Ω VGS=10V
R
G
(see test circuit, figure 5)
12 10 21
17 14 29
SOURCEDRAINDIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300µs, duty cycle 1.5 % () Pulse width limited by safe operating area
Source-drain Current
(•)
Source-drain Current
10 40
(pulsed)
(∗)ForwardOnVoltage ISD=10A VGS=0 1.6 V
Reverse Re covery
rr
Time Reverse Re covery
rr
ISD=9A di/dt=100A/µs
= 100 V Tj=150oC
V
DD
(see test circuit, figure 5)
600
5.4 Charge Reverse Re covery
18
Current
ns ns
nC nC
ns ns ns
A A
ns
µ
A
C
SafeOperating Area ThermalImpedance
3/8
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