SGS Thomson Microelectronics STU7NB90 Datasheet
®
N - CHANNEL 900V - 1.2Ω - 7.3A - Max220
TYPE V
DSS
STU7NB90 900 V < 1.45 Ω 7.4 A
■
TYPICAL R
■
EXTREMELY HIGH dv/dt CAPABILITY
■
30V GATE TO SOURCE VOLTAGE RATING
±
■
100% AVALANCHE TESTED
■
LOW INTRINSIC CAPACITANCE
■
GATE CHARGE MINIMIZED
■
REDUCED VOLTAGE SPREAD
DS(on)
= 1.2
R
DS(on)
I
D
Ω
STU7NB90
PowerMESH MOSFET
PRELIMINARY DATA
3
2
1
DESCRIPTION
Using the latest high voltage MESH OVERLAY
Max220
process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending st rip
layout coupled with the Company’s proprietary
edge termination structure, gives the lowest
RDS(on) per area, exceptional avalanche and
INTERNAL SCHEMATIC DIAGRAM
dv/dt capabilities and unrivalled gate charge and
switching characteristics.
APPLICATIONS
■
HIGH CURRENT, HIGH SPEED SWITCH ING
■
SWITCH MODE POWER SUPPLY (SMPS)
■
DC-AC CONVERTER FOR WELDING
EQUIPMENT AND UNINTERRUPTA BLE
POWER SUPPLY AND MOTOR DRIVE
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
DM
P
dv/dt
T
(•) Pulse width limited by safe operating area (1) ISD
April 1999
Drain-source Voltage (VGS = 0) 900 V
DS
Drain- gate Voltage (RGS = 20 kΩ)
DGR
Gate-source Voltage ± 30 V
GS
I
Drain Current (continuous) at Tc = 25 oC7.4A
D
I
Drain Current (continuous) at Tc = 100 oC4.7A
D
900 V
(•) Drain Current (pulsed) 29 A
Total Dissipation at Tc = 25 oC 160 W
tot
Derating Factor 1.28 W/
Peak Diode Recovery voltage slope 4 V/ns
(1)
Storage Temperature -65 to 150
stg
T
Max. Operating Junction Temperature 150
j
≤7.4 Α,
di/dt ≤ 200 A/µs, VDD ≤ V
(BR)DSS
, Tj ≤ T
JMAX
o
C
o
C
o
C
1/5
STU7NB90
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERIST ICS
Symbol Parameter Max Value Unit
I
AR
E
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25 oC, ID = IAR, V
j
max)
j
DD
= 50 V)
0.78
62.5
0.5
300
7.4 A
600 mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
= 25 oC unless otherwise specified)
(T
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
900 V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125
DS
o
C
V
= ± 30 V
GS
1
50
± 100 nA
ON (∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold
V
= VGS ID = 250 µA
DS
345V
Voltage
R
DS(on)
Static Drain-source On
VGS = 10 V ID = 4 A 1.2 1.45 Ω
Resistance
I
D(on)
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
7.4 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗) Forward
fs
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID = 4 A 1.5 8.9 S
= 0 2200
GS
230
25
µA
µA
pF
pF
pF
2/5
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