SGS Thomson Microelectronics STU10NA50 Datasheet
N - CHANNEL ENHANCEMENT MODE
FAST POWER MOS TRANSISTOR
TYPE V
DSS
STU10NA50 500 V < 0.6 Ω 10.2 A
R
DS(on)
I
D
STU10NA50
PRELIMINARY DATA
■ TYPICAL R
■ ± 30V GATE TO SOURCE VOLTA G E RATING
■ REPETITIVE AVA LANCHE TESTE D
■ LOW INTRINSIC CAPACITANCE
■ 100% AVALANCHE TESTED
■ GATE CHARGE MINIMIZED
■ REDUCED THRESHOLD VO LTA GE SPREA D
DESCRIPTION
The Max220
TM
= 0.5 Ω
DS(on)
package is a new high volume
power package exibiting the same footprint as the
industry standard TO-220, but designed to
accomodate much larger silicon chips, normally
supplied in bigger packages. The increased die
capacity makes the device ideal to reduce
component count in multiple paralleled TO-220
designs and save board space with respect to
larger packages.
APPLICATIONS
■ HIGH CURRENT, HIGH SPE ED SWI TCHING
■ SWITC H MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVE RTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SU PP LIE S (UPS)
3
2
1
Max220
TM
INTER NAL SCH E M ATI C DIAG RA M
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
IDM(•) Drain Current (pulsed) 40.8 A
P
T
(•) Pulse width limited by safe operating area
October 1997
DS
DGR
GS
I
D
I
D
tot
stg
T
j
Drain-source Voltage (VGS = 0) 500 V
Drain- gate Voltage (RGS = 20 kΩ)
500 V
Gate-source Voltage ± 30 V
Drain Current (continuous) at Tc = 25 oC 10.2 A
Drain Current (continuous) at Tc = 100 oC 6.4 A
Total Dissipation at Tc = 25 oC 145 W
Derating Factor 1.16 W/oC
Storage Temperature -65 to 150
Max. Operating Junction Temperature 150
o
C
o
C
1/5
STU10NA50
THERMAL DATA
R
thj-case
Rthj-amb
R
thc-si n k
T
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
I
AVALANCHE CHARACTERI S TICS
Symbol Parameter Max Value Unit
I
AR
E
E
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
Repetitive Avalanche Energy
AR
= 25 oC, ID = IAR, V
j
(pulse width limited by T
ma x, δ < 1%)
j
DD
ma x, δ < 1%)
j
Avalanche Current, Repetitive or Not-Repetitive
= 100 oC, pulse width limited by Tj max, δ < 1%)
(T
c
= 50 V)
0.86
30
0.1
300
10.2 A
520 mJ
24 mJ
6.8 A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
= 25 oC unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
500 V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating x 0.8 Tc = 100 oC
DS
V
= ± 30 V
GS
250
1000µAµA
± 100 nA
ON (∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold
V
= VGS ID = 250 µA
DS
2.25 3 3.75 V
Voltage
R
DS(on)
I
D(on)
Static Drain-source On
Resistance
VGS = 10 V ID = 5 A
V
= 10 V ID = 5 A Tc = 100oC
GS
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
0.5 0.6
1.2
10.2 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs (∗) Forward
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID = 5 A 6 9 S
= 0 1750
GS
250
80
2500
370
130
Ω
Ω
pF
pF
pF
2/5
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