SGS Thomson Microelectronics STS2NF100 Datasheet
STS2NF100
N-CHANNEL 100V - 0.23 Ω - 6A SO-8
STripFET™ II POWER MOSFET
TYPE
V
DSS
STS2NF100 100 V <0.26
■ TYPICAL R
■ EXCEPTIONAL dv/d t CAPABILITY
■ 100 % AVALANCHE TESTED
■ APPLICATION ORIENTED
(on) = 0.23 Ω
DS
R
DS(on)
I
D
Ω
6 A
CHARACTERIZATION
DESCRIPTION
This MOSFET series realized with STMicroelectronics
unique STripFET process has specifically been designed
to minimize input capacitance and gate charge. It is
therefore suitable as primary switch in advanced highefficiency, high-frequency isolate d DC-DC c onverters for
Telecom and Computer a pplications. It is also intended
for any applications with low gate drive requirements.
APPLICATIONS
■ HIGH-EFFICIENCY DC-DC CONVERTERS
■ UPS AND MOTOR CONTROL
SO-8
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
(
I
•)
D
I
D
(
I
••)
DM
P
tot
dV/dt
E
AS
T
stg
T
j
(
Pulse wi dth limited by safe operating area.
••)
(
Current limited by the package
•)
.
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
100 V
100 V
Gate- source Voltage ± 20 V
Drain Current (continuous) at TC = 25°C
Drain Current (continuous) at TC = 100°C
2A
1.3 A
Drain Current (pulsed) 8 A
Total Dissipation at TC = 25°C
2.5 W
Derating Factor 0.016 W/°C
(1) Peak Diode Recovery voltage slope 40 V/ns
(2)
Single Pulse Avalanche Energy 200 mJ
Storage Temperature
Max. Operating Junction Temperature
≤2A, di/dt ≤300A/µs , VDD ≤ V
(1) I
SD
(2) Starting Tj = 25 oC, ID = 3A, VDD = 50V
-65 to 175 °C
, Tj ≤ T
(BR)DSS
JMAX
1/8October 2002
STS2NF100
THERMAL DATA
Rthj-amb
T
T
stg
(*)
Mounte d on F R-4 board (t [ 10 se c.)
(*)Thermal Resistance Junction-ambient
Thermal Operating Junction-ambient
j
Storage Temperature
50
-55 to 150
-55 to 150
°C/W
°C
°C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
V
(BR)DSS
Drain-source
= 250 µA, VGS = 0
D
100 V
Breakdown Voltage
V
= Max Rating
DS
V
= Max Rating TC = 125°C
DS
V
= ± 20 V
GS
1
10
±100 nA
ON
(*)
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
= VGS I
DS
V
= 10 V ID = 1 A
GS
= 250 µA
D
234V
0.23 0.26
V
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS>ID(on)xRDS(on)max ID
= 25V, f = 1 MHz, VGS = 0
V
DS
=1 A
0.5 S
280
45
20
µA
µA
Ω
pF
pF
pF
2/8
STS2NF100
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 50 V ID = 1 A
t
d(on)
Turn-on Delay Time
t
r
Rise Time
V
DD
R
= 4.7 Ω VGS = 10 V
G
(Resistive Load, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
= 80V ID= 1A VGS=10V
V
DD
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 50 V ID = 1 A
t
d(off)
Turn-off Delay Time
t
f
Fall Time
V
DD
R
= 4.7Ω, V
G
GS
= 10 V
(Resistive Load, Figure 3)
6
10
10
2.5
4
20
3
ns
ns
nC
nC
nC
ns
ns
t
r(Voff)
t
t
Off-Voltage Rise Time
f
c
Fall Time
Cross-over Time
= 80 V ID = 1 A
V
clamp
R
G
= 4.7
Ω
V
= 10 V
GS
(Inductive Load, Figure 5)
19
8
15
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: P ul se duration = 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by s afe operating area.
Safe Operating Area
Source-drain Current
(•)
Source-drain Current (pulsed)
(*)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
= 2 A VGS = 0
SD
= 2 A di/dt = 100A/µs
I
SD
V
= 10 V Tj = 150°C
DD
(see test circuit, Figure 5)
Thermal Impedance
6
24
1.3 V
70
175
5
ns
ns
ns
A
A
ns
nC
A
3/8
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