STMicroelectronics unique “Single Feature Size™”
strip-based process. The resulting transistor shows
extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable
manufacturing reproducibility.
APPLICATIONS
■ BATTERY MANAGMENT IN NOMAD IC
EQUIPMENT
■ POWER MANAGMENT IN CELLULAR PHONES
SO-8
INTERNAL SCHEMATIC DIAGRAM
MOSFET ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
DS
V
DGR
V
GS
I
D
I
(●)
DM
P
TOT
(●)Pulse width limited by safe operating are a
August 2001
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
20V
20V
Gate- source Voltage± 12V
Drain Current (continuos) at TC = 25°C Single Operation
Drain Current (continuos) at TC = 100°C Single Operation
2
1.26
Drain Current (pulsed)8A
Total Dissipation at TC = 25°C Dual Operation
Total Dissipation at TC = 25°C Single Operation
.
Note: For the P-CHANNEL MOSFET actual polarity of Voltages
1.6
2
and current has to be reversed
A
A
W
W
1/6
STS2DPF20V
THERMA L D ATA
Rthj-amb(*)Thermal Resistance Junction-ambient Single Operation
Dual Operation
T
stg
T
j
Storage Temperature -55 to 150°C
Junction-ambient Temperature-55 to 150°C
(*) When Mounted on 0.5 in² of 2 oz. Copper
MOSFET ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
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of use of such informa tion n or for an y infring ement of patent s or other rig hts of third part ies which may resu lt from its use . No l i cen se i s
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
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