SGS Thomson Microelectronics STS17NF3LL Datasheet

STS17NF3LL
N-CHANNEL 30V - 0.0045 - 17A SO-8
STripFET™ II MOSFET FOR DC-DC CONVERSION
TYPE
STS17NF3LL 30 V <0.0055
TYPICAL R
CONDUCTION LOSSES REDUCED
SWITCHING LOSSES REDUCED
V
DSS
(on) = 0.0045 @ 10V
DS
(on) x Qg TRADE-OFF @ 4.5V
DS
R
DS(on)
I
D
17 A
DESCRIPTION
This application specific Power MOSFET is the second generation of STMicroelectronis unique
"Single Feature Size™ " strip-based process. T he resulting transistor shows the best trade-off between on-resistance and gate charge. Such features make it the best choice in high efficiency DC-DC converters for Telecom and computer industries.
APPLICATIONS
DC-DC CONVERTERS FOR TELECOM AND
NOTEBOOK CPU CORE
SYNCHRONOUS RECTIFIER
SO-8
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
D
I
D
(
I
DM
P
tot
(
Pulse widt h l i m i ted by safe operating area.
•)
.
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage ± 18 V
Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C
•)
Drain Current (pulsed) 68 A Total Dissipation at TC = 25°C
30 V 30 V
17 A 12 A
3.2 W
1/8March 2003
STS17NF3LL
THERMA L D ATA
Rthj-amb Rthj-lead
T
T
stg
(*)
When Mounted on 1 inch2 FR-4 board, 2 oz of Cu and t [ 10 sec.
(*)
Thermal Resistance Junction-ambient Thermal Resistance Junction-leads Maximum Operating Junction Temperature
j
Storage Temperature
Max Max
47 16
-55 to 175
-55 to 175
°C/W °C/W
°C °C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
= 250 µA, VGS = 0
D
V
= Max Rating
DS
V
= Max Rating TC = 125°C
DS
V
= ± 18 V
GS
30 V
1
10
±100 nA
ON
V
(BR)DSS
I
DSS
I
GSS
(*)
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
Resistance
= VGS I
DS
= 10 V ID = 8.5 A
V
GS
V
= 4.5 V ID = 8.5 A
GS
= 250 µA
D
1V
0.0045
0.0055
0.0055
0.007
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance Reverse Transfer Capacitance
V
= 10 V ID= 8.5 A
DS
= 25V, f = 1 MHz, VGS = 0
V
DS
37 S
2160
614
98
µA µA
Ω Ω
pF pF pF
2/8
STS17NF3LL
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 15 V ID = 8.5 A
t
d(on)
Turn-on Delay Time
t
r
Rise Time
V
DD
R
= 4.7 Ω VGS = 4.5 V
G
(Resistive Load, Figure 1)
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
=24V ID=12.5A VGS=4.5 V
V
DD
(see test circuit, Figure 2)
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 15 V ID = 8.5 A
t
d(off)
Turn-off Delay Time
t
f
Fall Time
V
DD
R
= 4.7Ω, V
G
GS
= 4.5 V
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: P ul se duration = 300 µs, duty cycl e 1. 5 %.
(
•)Pulse width limited by safe operatin g area.
Source-drain Current
(•)
Source-drain Current (pulsed)
(*)
Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
I
= 17 A VGS = 0
SD
= 17 A di/dt = 100A/µs
I
SD
V
= 15 V Tj = 150°C
DD
(see test circuit, Figure 3)
23.5 39
26
7
12
47.5 37
39 45
2.3
35 nC
17 68
1.2 V
ns ns
nC nC
ns ns
A A
ns
nC
A
Safe Operating Area
Thermal Impedance
3/8
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