SGS Thomson Microelectronics STPS20150CT, STPS20150CR, STPS20150CFP, STPS20150CG Datasheet

®
STPS20150CT/CG/CR/CFP
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
RRM
T
j
V
(max) 0.75 V
F
2x10A
150 V
175°C
FEATURES AND BENEFITS
HIGH JUNCTION TEMPERATURE CAPABILITY
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP LOW LEAKAGE CURRENT
AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Dual center tap schottky rectifier designed for high frequency Switched Mode Power Supplies.
A1
A2
K
A2
A1
D2PAK
STPS20150CG
A1
TO-220AB
STPS20150CT
K
K
A2
K
A1
I2PAK
STPS20150CR
A1
A2
K
A2
K
TO-220FPAB
STPS20150CFP
ABSOLUTE RATINGS (limiting values, per diode)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
Repetitive peak reverse voltage 150 V RMS forward current 30 A Average forward current
δ = 0.5
TO-220AB D2PAK/I2PAK
Tc = 155°C Per diode 10 A
TO-220FPAB Tc = 135°C Per device 20
P
I
FSM
ARM
T
T
Surge non repetitive forward current tp = 10 ms sinusoidal 180 A Repetitive peak avalanche power tp = 1µs Tj = 25°C 6700 W Storage temperature range - 65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
j
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
July 2003 - Ed: 6D
1/7
STPS20150CT/CG/CR/CFP
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th(j-c)
R
th(c)
When the diodes 1 and 2 are used simultaneously :
Tj(diode 1) = P(diode1) x R
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
V
F
Pulse test : * tp=5ms,δ<2%
To evaluate the conduction losses use the following equation: P=0.64xI
Junction to case TO-220AB / D2PAK/I2PAK Per diode 2.2 °C/W
TO-220FPAB 4.5 TO-220AB / D
2
PAK/I2PAK Total 1.3 TO-220FPAB 3.5 TO-220AB / D2PAK/I2PAK Coupling 0.3 TO-220FPAB 2.5
(Per diode) + P(diode 2) x R
th(j-c)
* Reverse leakage current Tj = 25°C VR=V
th(c)
RRM
5.0 µA
Tj = 125°C 5.0 mA
** Forwardvoltage drop Tj = 25°CI
Tj = 125°C I Tj=25°CI Tj = 125°C I
** tp = 380 µs, δ <2%
+ 0.011 I
F(AV)
F2(RMS)
= 10 A 0.92 V
F
= 10 A 0.69 0.75
F
=20A 1
F
= 20 A 0.79 0.86
F
2/7
STPS20150CT/CG/CR/CFP
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
P (W)
F(AV)
10
9 8 7 6 5 4 3 2
1
0
0123456789101112
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 3: Normalized avalanche power derating ver­sus pulse duration.
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Fig. 2: Average forward current versus ambient temperature (δ = 0.5, per diode).
I (A)
F(AV)
12 11 10
9 8 7 6 5 4 3 2 1 0
0 25 50 75 100 125 150 175
δ
T
=tp/T
R =15°C/W
th(j-a)
tp
R =R (TO-220AB, I PAK and D PAK)
th(j-a) th(j-c)
R =R (TO-220FPAB)
th(j-a) th(j-c)
T (°C)
amb
22
Fig. 4: Normalized avalanche power derating versus junction temperature.
P(t)
ARM p
P (25°C)
ARM
1.2 1
0.8
0.6
0.4
0.2 0
0 25 50 75 100 125 150
T (°C)
j
Fig. 5-1: Non repetitive surge peak forward cur-
rent versus overload duration (maximumvalues, per diode). TO-220AB, I²PAK and D²PAK
I (A)
M
150
125
100
75
50
IM
25
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
22
TO-220AB, I PAK and D PAK
T =50°C
C
T =75°C
C
T =125°C
C
Fig. 5-2: Non repetitive surge peak forward cur­rent versus overload duration (maximumvalues, per diode). TO-220FPAB
I (A)
M
100
90 80 70 60 50 40 30
IM
20 10
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
TO-220FPAB
T =50°C
C
T =75°C
C
T =125°C
C
3/7
Loading...
+ 4 hidden pages