SGS Thomson Microelectronics STP9NC65FP, STP9NC65 Datasheet
STP9NC65
STP9NC65FP
N-CHANNEL 650V - 0.75Ω - 8A TO-220/TO-220FP
PowerMesh™II MOSFET
TYPE V
DSS
STP9NC65 650 V < 0.90
STP9NC65FP 650 V < 0.90
■ TYPICAL R
■ EXTREMELY HIGH dv /d t CAPABILITY
■ 100% AVALANCHE TESTED
■ NEW HIGH VOLTAGE BENCHMARK
■ GATE CHARGE MINIMIZED
(on) = 0.75 Ω
DS
R
DS(on)
I
D
Ω
Ω
8 A
8 A
DESCRIPTION
The PowerMESH
generation of MESH OVERLAY
™II is the evolution of the first
™. The layout re-
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lea ding edge for what concerns swithing speed, gate
charge and ruggedness.
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITH MODE POWER SUPPLI ES ( SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVES
TO-220 TO-220FP
(Available Upon Request)
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP9NC65 STP9NC65FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 3.5 V/ns
V
ISO
T
stg
T
j
(•)Pu l se width limite d by safe operating area
(*) Limited only by maximum temperature allowed
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
650 V
650 V
Gate- source Voltage ±30 V
Drain Current (continuos) at TC = 25°C
Drain Current (continuos) at TC = 100°C
(●)
Drain Current (pulsed) 32 32(*) A
Total Dissipation at TC = 25°C
8 8(*) A
5 5(*) A
140 40 W
Derating Factor 1.12 0.32 W/°C
Insulation Withstand Voltage (DC) - 2000 V
Storage Temperature –65 to 150 °C
Max. Operating Junction Temperature 150 °C
(1)ISD ≤8A, di/dt ≤100A/µs, VDD ≤ V
(BR)DSS
, Tj ≤ T
JMAX.
1/9February 2001
STP9NC65/FP
THERMA L D ATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 0.89 3.12 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
Rthc-sink Thermal Resistance Case-sink Typ 0.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
max)
j
Single Pulse Avalanche Energy
(starting T
Drain-source
= 25 °C, ID = IAR, VDD = 50 V)
j
ID = 250 µA, VGS = 0 650 V
8A
850 mJ
Breakdown Voltage
= Max Rating
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
V
DS
V
= Max Rating, TC = 125 °C
DS
V
= ±30V ±100 nA
GS
1µA
50 µA
ON
(1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
= VGS, ID = 250µA
DS
VGS = 10V, ID = 4.5 A
234V
0.75 0.90
Resistance
I
D(on)
On State Drain Current VDS > I
D(on)
x R
DS(on)max,
8A
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS > I
g
fs
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 196 pF
Reverse Transfer
Capacitance
ID= 4.5A
V
DS
D(on)
x R
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
10 S
1400 pF
31 pF
Ω
2/9
STP9NC65/FP
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q
Q
Q
t
r
g
gs
gd
Turn-on Delay Time
Rise Time 15 ns
Total Gate Charge
Gate-Source Charge 10.5 nC
Gate-Drain Charge 19.5 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
t
r(Voff)
t
t
f
f
c
Turn-Off Delay Time
Fall Time 30 ns
Off-voltage Rise Time
Fall Time 12 ns
Cross-over Time 24 ns
= 325 V, ID = 4.5 A
DD
RG= 4.7Ω VGS = 10 V
(see test circuit, Figure 3)
V
= 520V, ID = 9 A,
DD
VGS = 10V
V
= 325V, ID = 4.5 A,
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 3)
V
= 520V, ID = 9 A,
DD
R
=4.7Ω, V
G
GS
= 10V
(see test circuit, Figure 5)
28 ns
44 62 nC
53 ns
15 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cyc l e 1.5 %.
2. Pulse width li mited by safe operating area.
Source-drain Current 8 A
(2)
Source-drain Current (pulsed) 32 A
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge 5.14 µC
ISD = 8 A, VGS = 0
I
= 9 A, di/dt = 100A/µs
SD
V
= 100V, Tj = 150°C
DD
(see test circuit, Figure 5)
610 ns
Reverse Recovery Current 17 A
1.6 V
Safe Operating Area for TO-220 Safe Operating Area for TO-220FP
3/9
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