SGS Thomson Microelectronics STP8NC50 Datasheet

STP8NC50
STP8NC50FP
N-CHANNEL 500V - 0.7Ω - 8A TO-220/TO-220FP
PowerMeshII MOSFET
TYPE V
DSS
R
DS(on)
I
D
STP8NC50 500 V < 0.85 8A STP8NC50FP 500 V < 0.85 8A
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
(on) = 0.7
DESCRIPTION
The PowerMESHII is the evolution of the first generation of MESH OVERLAY. The layout re­finements introduced greatly improve the Ron*area figure of merit while keeping the device at the lead­ing edge for what concerns swithing speed, gate charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGHSPEED SWITCHING
SWITH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FORWELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES ANDMOTOR DRIVES
3
2
1
TO-220
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP8NC50 STP8NC50FP
V
DS
V
DGR
V
GS
I
D
I
D
I
()
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 3 V/ns
V
ISO
T
stg
T
j
()Pulse width limitedby safe operating area (*) Limited only by maximum temperature allowed
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
500 V
500 V Gate- source Voltage ±30 V Drain Current (continuos) at TC=25°C Drain Current (continuos) at TC= 100°C
8 8(*) A
5.4 5.4(*) A Drain Current (pulsed) 32 32(*) A TotalDissipation at TC=25°C
135 40 W
Derating Factor 1 0.32 W/°C
Insulation Withstand Voltage (DC) - 2000 V Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(1)ISD≤8A, di/dt ≤100A/µs, VDD≤ V
(BR)DSS,Tj≤TJMAX.
1/9May 2000
STP8NC50/FP
THERMAL DATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 0.93 3.12 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
Rthc-sink Thermal Resistance Case-sink Typ 0.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
Gate-body Leakage Current (V
=25°C, ID=IAR,VDD=50V)
j
I
= 250 µA, VGS=0
D
= Max Rating
V
DS
=0)
DS
GS
=0)
V
= Max Rating, TC= 125 °C
DS
= ±30V
V
GS
500 V
8A
600 mJ
1 µA
50 µA
±100 nA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage Static Drain-source On
Resistance
On StateDrain Current
V
DS=VGS,ID
= 10V, ID=4A
V
GS
V
DS>ID(on)xRDS(on)max,
= 250µA
VGS=10V
234V
0.7 0.85
8A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
g
(1)
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance 165 pF Reverse Transfer
Capacitance
DS>ID(on)xRDS(on)max,
ID=2A
V
= 25V, f = 1 MHz, VGS=0
DS
7.5 S
1050 pF
25 pF
2/9
STP8NC50/FP
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q Q Q
t
r
gs gd
Turn-on Delay Time Rise Time 14 ns TotalGate Charge
g
Gate-Source Charge 5 nC Gate-Drain Charge 18.2 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
t
f
c
Off-voltage Rise Time Fall Time 15 ns Cross-over Time 26 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 8 A
(2)
Source-drain Current (pulsed) 32 A
(1)
Forward On Voltage Reverse Recovery Time Reverse Recovery Charge 3.2 µC Reverse Recovery Current 13.7 A
V
= 250 V,ID=4A
DD
= 4.7VGS=10V
R
G
(see test circuit, Figure 3)
V
= 400V,ID=8A,
DD
= 10V
V
GS
V
= 400V,ID=8A,
DD
=4.7Ω, VGS= 10V
R
G
(see test circuit, Figure 5)
ISD= 8 A, VGS=0 I
=8 A, di/dt = 100A/µs
SD
= 100V,Tj= 150°C
V
DD
(see test circuit, Figure 5)
19 ns
36 46 nC
13 ns
1.6 V
470 ns
Safe Operating Area for TO-220 SafeOperating Area for TO-220FP
3/9
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