SGS Thomson Microelectronics STP5N30FI, STP5N30 Datasheet

STP5N30
STP5N30FI
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTOR
TYPE V
STP 5N30 STP 5N30FI
TYPICAL R
AVALANCHE RUGGED TECHNOLOGY
REPETITIVE AVALANCHE DATA AT 100
APPLICATION ORIENTED
DS(on)
DSS
300 V 300 V
= 1.2
R
DS(on)
I
D
<1.4 <1.45A3.5 A
o
C
CHARACTERIZATION
APPLICATIONS
HIGH SPEED SWITCHING
SWITCH MODE POWERSUPPLIES (SMPS)
CHOPPER REGULATORS, CONVERTERS,
MOTOR CONTROL, LIGHTING FOR INDUSTRIAL AND CONSUMER ENVIRONMENT
PARTICULARLY SUITABLE FOR
ELECTRONIC FLUORESCENT LAMP BALLASTS
3
2
1
TO-220 ISOWATT220
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symb o l Paramet er Val u e Unit
STP5N30 STP5N30FI
V
V
V
I
DM
P
V
T
() Pulsewidth limited bysafe operating area
December 1996
Drain - s ource Voltage (VGS=0) 300 V
DS
Drain- gate Voltage (RGS=20kΩ)300V
DGR
Gate-source Voltage ± 20 V
GS
Drain Current (continuous) at Tc=25oC53.5A
I
D
Drain Current (continuous) at Tc=100oC3.2 2.2A
I
D
(•) Drain Current (pulsed) 20 20 A
Total Di ssipation a t Tc=25oC7535W
tot
Derat ing Factor 0.6 0.28 W/ Ins ulation Withs t and Voltage (DC) 2000 V
ISO
St or a ge Tem perature -65 t o 150
stg
Max. Operating Jun ction T emperature 150
T
j
o o
o
C
C C
1/10
STP5N30/FI
THERMAL DATA
TO-220 ISOW ATT 220
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Uni t
I
AR
E
E
I
AR
Thermal Resistance Junction - cas e M ax 1.67 3.57 Thermal Resistance Junction- ambient Max
Thermal Resistance Case-sink Typ Maximum Lead Temperature For So ldering Purpose
l
Avalanc h e Cu rr ent , Repet itive or Not-Rep etitive (pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng T Repetitive Avalanc he Energ y
AR
=25oC, ID=IAR,VDD=50V)
j
(pulse width limited by Tjmax, δ <1%) Avalanc h e Cu rr ent , Repet itive or Not-Rep etitive
(Tc= 100oC, pulse width l imited by Tjmax, δ <1%)
62.5
0.5
300
5A
50 mJ
1.5 mJ
3.2 A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwisespecified)
case
OFF
Symbol Parameter Test Co ndi tions Min. Typ. Max. Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS= 0 300 V
Break d own Volta ge
I
DSS
I
GSS
Zer o G at e V oltage Drain Current (VGS=0)
Gat e- body Leakage Current (V
DS
=0)
VDS=MaxRating VDS= Max Rating x 0.8 Tc=125oC
= ± 20 V ± 10 0 nA
V
GS
10
100
ON (∗)
Symbol Parameter Test Co ndi tions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID=250µA234V St at ic Drain-s our ce O n
VGS=10V ID= 2.5 A 1.2 1.4
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on)max
5A
VGS=10V
DYNAMIC
Symbol Parameter Test Co ndi tions Min. Typ. Max. Unit
()Forward
g
fs
Tr ansconductance
C C C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=2.5A 2 3.1 S
VDS=25V f=1MHz VGS=0 500
80 16
700 110
25
µA µA
pF pF pF
2/10
STP5N30/FI
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Co ndi tions Min. Typ. Max. Unit
t
d(on)
(di/dt)
Q Q Q
Turn-on T ime
t
Rise Time
r
Turn-on Current S lope VDD=240V ID=5A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
Symbol Parameter Test Co ndi tions Mi n. Ty p. Max. Unit
t
r(Voff)
t
Off -voltage Rise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAINDIODE
VDD=150V ID=2.5A RG=50 Ω VGS=10V
45 30
(see test circuit, figure 3)
330 A/µs RG=50 Ω VGS=10V (see test circuit, figure 5)
VDD= 240 V ID=5A VGS=10V 20
6 8
VDD=240V ID=5A RG=50 Ω VGS=10V (see test circuit, figure 5)
35 20 60
60 40
30 nC
50 30 80
ns ns
nC nC
ns ns ns
Symbol Parameter Test Co ndi tions Mi n. Ty p. Max. Unit
I
I
SDM
SD
Source-drain C urrent
()
Source-drain C urrent
5
20
(pulsed)
V
(∗) Forward On Voltage ISD=5A VGS=0 1.6 V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD=5A di/dt=100A/µs VDD= 100 V Tj=150oC (see test circuit, figure 5)
300
1.7
Charge
I
RRM
Reverse Recovery
13
Current
() Pulsed:Pulse duration = 300 µs, dutycycle 1.5 % () Pulse widthlimited by safeoperating area
Safe Operating Areas For TO-220 Safe Operating Areas For ISOWATT220
A A
ns
µC
A
3/10
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