THERMAL DATA
TO-220 ISOW ATT 220
R
thj-case
Thermal Resistance Junction -c as e M ax 1 3.33
o
C/W
R
thj-amb
R
thc-sink
T
l
Thermal Resistance Junction- ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead T emperature For Soldering Purpos e
62.5
0.5
300
o
C/W
o
C/W
o
C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Uni t
I
AR
Avalanc h e Cu rr ent , Repet itive or Not-R epetitiv e
(pulse width limited by Tjmax, δ <1%)
50 A
E
AS
Single Pul se Avalanche Ener gy
(starti ng T
j
=25oC, ID=IAR,VDD=25V)
400 mJ
E
AR
Repetitive Avalanc he Energ y
(pulse width limited by Tjmax, δ <1%)
100 mJ
I
AR
Avalanc h e Cu rr ent , Repet itive or Not-R epetitiv e
(Tc= 100oC, pulse wid th limited by Tjmax, δ <1%)
35 A
ELECTRICAL CHARACTERISTICS (T
case
=25oC unless otherwise specified)
OFF
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
V
(BR)DSS
Drain - source
Break d own Voltage
ID=250µAVGS=0 60 V
I
DSS
Zer o Gate Voltage
Drain Current (VGS=0)
VDS=MaxRating
VDS= Max R ating x 0.8 Tc=125oC
250
1000µAµA
I
GSS
Gat e- body Leakage
Current (V
DS
=0)
V
GS
= ± 20 V ± 100 nA
ON (∗)
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage VDS=VGSID=250µA22.94V
R
DS(on)
St at ic Drain-s ourc e O n
Resistance
VGS=10V ID=25A
VGS=10V ID=25A Tc= 100oC
0.022 0.028
0.056ΩΩ
I
D(on)
On St ate Dra in Current VDS>I
D(on)xRDS(on)max
VGS=10V
50 A
DYNAMIC
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
g
fs
(∗)Forward
Tr ansconduct anc e
VDS>I
D(on)xRDS(on)maxID
=25A 17 22 S
C
iss
C
oss
C
rss
Input Capacitance
Out put Capacitance
Reverse Transfer
Capaci tance
VDS=25V f=1MHz VGS= 0 1700
630
200
2200
850
260
pF
pF
pF
STP50N06/FI
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