SGS Thomson Microelectronics STP4NB50FP, STP4NB50 Datasheet

STP4NB50
STP4NB50FP
N-CHANNEL 500V - 2.5- 3.8A - TO-220/TO-220FP
PowerMesh™ MOSFET
PRELIMINARY DATA
TYPE V
STP4NB50 STP4NB50FP
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
DS
DSS
500 V 500 V
(on) = 2.5
R
DS(on)
< 2.8 < 2.8
I
D
3.8 A
2.5 A
DESCRIPTION
Using the latest high voltage ME SH OVERLAY™ process, STMicroelectronics has designed an a d­vanced family of power MOSFETs with outstanding performances. The new patent pending strip lay out coupled with the Company’s proprieraty edge termi­nation structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteris­tics.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE
3
2
TO-220
1
TO-220FP
1
INTERNAL SCHEMATIC DIAGRAM
3
2
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP4NB50 STP4NB50FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt Peak Diode Recovery voltage slope 4.5 V/ns
V
ISO
T
stg
T
j
(•)Pulse width limited by safe operating area
April 2003
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
500 V
500 V Gate- source Voltage ±30 V Drain Current (continuous) at TC= 25°C Drain Current (continuous) at TC= 100°C
()
Drain Current (pulsed) 15.2 15.2 A Total Dissipation at TC= 25°C
3.8 2.5 A
2.4 1.6 A
80 35 W
Derating Factor 0.64 0.28 W/°C
Insulation Withstand Voltage (DC) - 2500 V Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(1)ISD≤4A,di/dt≤200A/µs, VDD≤ V
(BR)DSS,Tj≤TJMAX
1/7
STP4NB50 - ST P4N B 50FP
THERMAL DATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 1.56 3.57 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source
= 25 °C, ID=IAR,VDD=50V)
j
ID= 250 µA, VGS= 0 500 V
3.8 A
220 mJ
Breakdown Voltage
= Max Rating
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
=0)
=0)
V
DS
VDS= Max Rating, TC= 125 °C V
= ±30V ±100 nA
GS
A
50 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
V
DS=VGS,ID
VGS=10V,ID= 1.9 A
= 250µA
234V
2.5 2.8
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 62 pF Reverse Transfer
Capacitance
D(on)xRDS(on)max,
ID= 1.9 A
V
=25V,f=1MHz,VGS=0
DS
2.3 S
400 pF
7.5 pF
2/7
STP4NB50 - STP4NB50FP
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 8 ns Total Gate Charge
Gate-Source Charge 6.5 nC Gate-Drain Charge 5 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time 5 ns Cross-over Time 14 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 3.8 A
(2)
Source-drain Current (pulsed) 15.2 A Forward On Voltage Reverse Recovery Time Reverse Recovery Charge 980 nC Reverse Recovery Current 9 A
= 250V, ID= 1.9 A
DD
R
=4.7ΩVGS= 10V
G
(see test circuit, Figure 3) V
= 400V, ID= 3.8 A,
DD
VGS= 10V
V
= 400V, ID= 3.8 A,
DD
= 4.7Ω, VGS=10V
R
G
(see test circuit, Figure 5)
ISD= 3.8 A, VGS=0 I
= 3.8 A, di/dt = 100A/µs,
SD
VDD= 100V, Tj= 150°C (see test circuit, Figure 5)
11 ns
15 21 nC
8ns
1.6 V
245 ns
3/7
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