SGS Thomson Microelectronics STP3NA90FI, STP3NA90 Datasheet

STP3NA90
STP3NA90FI
N - CHANNEL ENHANCEMENT MODE
FAST POWER MOS TRANSISTOR
PRELIMINARY DATA
TYPE V
STP3NA90 STP3NA90FI
TYPICALR
100% AVALANCHETESTED
REPETITIVEAVALANCHEDATAAT 100
LOW INTRINSIC CAPACITANCES
GATECHARGEMINIMIZED
REDUCEDTHRESHOLD VOLTAGESPREAD
DS(on)
DSS
900 V 900 V
=4.4
R
DS(on)
<5.3
<
5.3
I
D
3A
1.9 A
o
C
APPLICATIONS
HIGH CURRENT, HIGH SPEEDSWITCHING
SWITCHMODE POWER SUPPLIES (SMPS)
DC-ACCONVERTERS FOR WELDING
EQUIPMENTANDUNINTERRUPTIBLE POWERSUPPLIESAND MOTOR DRIVE
3
2
1
TO-220 ISOWATT220
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symb o l Parameter Val u e Uni t
ST P3 NA90 ST P3NA 90FI
V
V
DGR
V
I
DM
P
V
T
(•)Pulse width limited by safe operating area
March 1996
Drain-So urce Vol ta ge (Vgs= 0 ) 900 V
DS
Drain-G at e Voltage (Rgs=20KΩ) 900 V Gate-Source Voltage ± 30 V
GS
Drain-Cur rent (cont i nuous ) a t Tc=25oC31.9A
I
D
Drain-Cur rent (cont i nuous ) a t Tc=100oC21.2A
I
D
() Drain-Current (Pulsed) 12 12 A
Tot al Dissipati on at Tc=25oC 100 40 W
tot
Derat ing Factor 1.25 0.32 W/ Ins ulat ion Withstand Vo lt age (DC) - 2000 V
ISO
Stora ge Tem pe ra ture -65 to 150
stg
Max Operating J unction Temperature 150
T
j
o
C
o
C
o
C
1/6
STP3NA90/FI
THERMAL DATA
TO 220 ISOWATT220
R
thj-case
R
thj-amb
R
thc-sin k
T
AVALANCHE CHARACTERISTICS
Symb o l Para met er Max Val ue Uni t
I
AR
E
E
I
AR
Ther mal Resistance Junctio n-c ase Max 0.8 3.12 Ther mal Resistance Junctio n-am bien t Max
Ther mal Resistance Ca s e-s i nk Typ Maximum Lead Temper ature For Solder in g P ur pose
l
Avalanche Current, Repetitiv e or Not-Repe t it ive (pulse width lim i t ed by T
Single Pu lse Avalanc he E nerg y
AS
(starti ng T Repetitive Av alanche Energy
AR
=25oC, ID=IAR,VDD=50V)
j
(pulse width lim i t ed by T
max, δ <1%)
j
max, δ <1%)
j
Avalanche Current, Repetitiv e or Not-Repe t it ive
=100oC, p ulse width lim it ed by Tjmax, δ <1%)
(T
c
62.5
0.5
300
3A
45 mJ
2mJ
2A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unlessotherwise specified)
case
OFF
Symbol Parameter Test Cond itions Min. Typ. Ma x. Unit
V
(BR)DSS
Drain-source
ID= 250 µAV
= 0 900 V
GS
Break dow n Voltage
I
I
DSS
GSS
Zero Gate Voltage Drain Current (V
GS
=0)
Gat e- Source Leakage Current (V
DS
=0)
=MaxRating
V
DS
V
=MaxRatingx0.8 Tc= 125oC
DS
V
= ± 30 V ±100 mA
GS
250
1000µAµA
ON ()
Symbol Parameter Test Cond itions Min. Typ. Ma x. Unit
V
GS(th )
R
DS(on)
I
D(on)
Gat e Thre shold Volt age VDS=V St at ic Drain-source On
Resistance
VGS=10V ID=1.5A
=10V ID=1.5A Tc= 100oC
V
GS
On State Drain Current VDS>I
GS ID
D(on)xRDS(on)max
= 250 µA2.2533.75V
4.4 5.3
10.6
3A
VGS=10 V
DYNAMIC
Symbol Parameter Test Cond itions Min. Typ. Ma x. Unit
g
()Forward
fs
Tr ansc on ductance
C
C
C
Input Capac it an ce
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on)maxID
=1.5A 1.5 2.8 S
VDS=25V f=1MHz VGS= 0 690
80 20
900 105
30
Ω Ω
pF pF pF
2/6
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