SGS Thomson Microelectronics STP30NE03L, STP30NE03LFP Datasheet

STP30NE03L
N - CHANNEL 30V - 0.028 - 30A TO-220/TO-220FP
TYPE V
ST P30NE03L ST P30NE03LFP
TYPICALR
100%AVALANCHETESTED
LOW THRESHOLDDRIVE
DS(on)
DSS
30 V 30 V
= 0.028
DESCRIPTION
This PowerMOSFET is the latest developmentof STMicroelectronics unique ”Single Feature Size” strip-based process. The resulting transi­stor showsextremelyhigh packing densityfor low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a re­markablemanufacturingreproducibility.
APPLICATIONS
DC MOTOR CONTROL
DC-DC& DC-ACCONVERTERS
SYNCHRONOUSRECTIFICATION
R
DS(on)
<0.04 <0.04
I
D
30 A 17 A
STP30NE03LFP
STripFET POWER MOSFET
3
2
1
TO-220 TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP30NE03L STP30NE03L FP
V
V
V
I
DM
P
V
T
() Pulse width limited by safe operating area
June 1999
Drain-source Voltage (VGS=0) 30 V
DS
Drain- ga t e Voltage (RGS=20kΩ)30V
DGR
Gate-s ource Volt age ± 20 V
GS
I
Drain Cur rent (cont i nuous) at Tc=25oC3017A
D
I
Drain Cur rent (cont i nuous) at Tc= 100oC2112A
D
() Drain Cur rent (pulse d) 120 68 A
Total Dissipation at Tc=25oC7025W
tot
Derat i ng Fa c t or 0.47 0.17 W/ Ins ula t ion Withst and Voltage (DC) 2000 V
ISO
St orage Tem p er at u re -65 to 175
stg
T
Max. Operating Junction Tem p er at u re 175
j
o
C
o
C
o
C
1/9
STP30NE03L/FP
THERMAL DATA
TO-220 TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Valu e Unit
I
AR
E
Ther mal Resistanc e Junct ion-case Max 2.14 6 Ther mal Resistanc e Junct ion-ambient Max
Ther mal Resistanc e Case-sink Ty p Maximum L ead Temperature For So ldering Purpos e
l
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
Single Pul se Avalanche Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max)
j
62.5
0.5
300
15 A
250 mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=0 30 V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage Drain Curre nt (V
GS
Gat e- bod y Leakag e Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRating Tc= 125oC
V
DS
V
=± 20 V
GS
1
10
100 nA
±
ON()
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250µA 1 1.75 2.5 V Sta t ic Drain-s our c e On
Resistance
VGS=5V ID=15A
=10V ID=15A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.042
0.028
30 A
0.055
0.04
VGS=10V
DYNAMIC
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=15 A 5 15 S
VDS=25V f=1MHz VGS= 0 800
205
70
µA µA
Ω Ω
pF pF pF
2/9
STP30NE03L/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
t
d(on)
Tur n-on Delay Time Rise Time
t
r
VDD=15V ID=14A R
=4.7
G
VGS=5V
19
110
(Resis t iv e Load, see fig. 3)
Q Q Q
Tot al Gate Charge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD=48V ID=30A VGS=5V 20
8
10
28 nC
SWITCHINGOFF
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
t
d(off)
Tur n-of f Dela y Tim e
t
Fall T ime
f
VDD=15V ID=14A
=4.7 VGS=5V
R
G
40 20
(Resis t iv e Load, see fig. 3)
t
r(Voff)
t
t
Off-volt age Rise Time Fall T ime
f
Cross-over Tim e
c
VDD=24V ID=28A
=4.7 VGS=5V
R
G
(Indu ct iv e Load, see fig . 5)
20 38 65
SOURCEDRAIN DIODE
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
I
V
I
SDM
SD
Q
I
RRM
SD
t
Source-drain Current
(•)
Source-drain Current
30
120
(pulsed)
(∗)ForwardOnVoltage ISD=30A VGS=0 1.5 V
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 28 A di/dt = 100 A /µs
=20V Tj=150oC
V
DD
(see test circuit, fig. 5)
30
30 Charge Reverse Recovery
2
Current
ns ns
nC nC
ns ns
ns ns ns
A A
ns
nC
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5% (•) Pulse width limited by safeoperating area
SafeOperating Area for TO-220 SafeOperating Area for TO-220FP
3/9
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