SGS Thomson Microelectronics STP2HNC60, STP2HNC60FP Datasheet

STP2HNC60
STP2HNC60 FP
N-CHANNEL 600V - 4- 2.2A TO-220/TO-220FP
PowerMesh™II MOSFET
TYPE V
STP2HNC60 STP2HNC60 FP
TYPICAL R
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
DS
DSS
600 V 600 V
(on) = 4
R
DS(on)
< 5 < 5
I
D
Ω Ω
2.2 A
2.2 A
DESCRIPTION
The PowerMESH generation of MESH OVERLAY
II is the evolution of the first
™. The layout re-
finements introduced greatly improve the Ron*area figure of merit while keeping the device at the lea d­ing edge for what concerns swithing speed, gate charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLI ES ( SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVER
3
2
1
TO-220
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP2HNC60 STP2HNC60FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt Peak Diode Recovery voltage slope 3.5 V/ns V
ISO
T
stg
T
j
(•)Pu l se width limite d by safe operat i ng area
.
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ)
600 V 600 V
Gate- source Voltage ± 30 V
Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C
()
Drain Current (pulsed) 8.8 8.8(*) A Total Dissipation at TC = 25°C
2.2 2.2(*) A
1.4 1.4(*) A
60 30 W
Derating Factor 0.48 0.24 W/°C
Insulation Withstand Voltage (DC) -- 2000 V Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(1)ISD ≤ 2.2A, di/dt ≤100A/µs, VDD ≤ V
(*).Limited only by maximum temperature allowed
(BR)DSS
, Tj ≤ T
JMAX
1/9May 2001
STP2HNC60/STP2HNC60FP
THERMA L D ATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 2.1 4.1 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source
= 25 °C, ID = IAR, VDD = 50 V)
j
ID = 250 µA, VGS = 0 600
2.2 A
110 mJ
Breakdown Voltage Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
V
= Max Rating
DS
V
= Max Rating, TC = 125 °C
DS
V
= ±30V ±100 nA
GS
A
50 µA
V
ON
(1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
= VGS, ID = 250µA
DS
VGS = 10V, ID = 1 A
234V
45
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS > I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 40 pF Reverse Transfer
Capacitance
ID=1A
V
DS
D(on)
x R
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
2S
258 pF
6pF
2/9
STP2HNC60/STP2HNC60F P
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Turn-on Delay Time
t
r
Rise Time
= 300V, ID = 1 A
V
DD
RG= 4.7Ω VGS = 10V (see test circuit, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
= 480V, ID = 2 A,
V
DD
VGS = 10V
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 480V, ID = 2 A,
t
r(Voff)
t
t
f
c
Fall Time Cross-over Time
Off-voltage Rise Time
V
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1.5 %.
2. Pulse width li mited by safe operating area .
Source-drain Current 2.2 A
(2)
Source-drain Current (pulsed) 8.8 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge 1032 nC
ISD = 2.2 A, VGS = 0 I
= 2A, di/dt = 100A/µs,
SD
V
= 100V, Tj = 150°C
DD
(see test circuit, Figure 5)
Reverse Recovery Current 4.3 A
9
8.5
11.3
15.5 nC
2.8 5
18
9
27
1.6 V
480 ns
ns ns
nC nC
ns ns ns
Safe Operating Area
Safe Operating Area For TO-220FP
3/9
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