SGS Thomson Microelectronics STLVD111BFR, STLVD111BF Datasheet

PROGRAMMABLE LOW VOLTAGE
1:10 DIFFERENTIAL LVDS CLOCK DRIVER
100ps PART-TO PART SKEW
50ps BANK SKEW
DIFFERENTIAL DESIGN
MEETS LVDS SPEC. FOR DRIVER
OUTPUTS AND RECEIVER INPUTS
REFERENCE VOLTAGE AVAILABLE
OUTPUT V
LOW VOLTAGEV
2.625V
HIGH SIGNALLING RATE CAPABILITY
(EXCEEDS 622MHz)
SUPPORT OPEN, SHORT AND
TERMINATED INPUT FAIL-SAFE (LOW OUTPUT STATE)
PROGRAMMABLE DRIVERS POWER OFF
CONTROL
RANGE OF 2.375V TO
CC
STLVD111
TQFP32
DESCRIPTION
The STLVD111 is a low skew program mable 1 to 10 differential LVDS driver, designed for clock distribution. The select signal is fanned out to 10 identical differential outputs. The STLVD111 is provided with a 11 bit shift register with a serial in and a Control Register. The purpose is to enable or power off each output clock c hannel and to s elect the clock input . The
produced with low skew as the key goal. Optimal design and layout serve to minimize gate to gate skew within a device. The net result is a dependable guaranteed low skew dev ice. The STLVD111 can be used for high performanc e clock distribution in 2.5V systems with LVDS levels. Designers can take adv antage of the device’s performance to d istribute low skew clocks across the backplane or the board.
STLVD111 is s pec ific ally designed, modelled and
ORDERING CODES
Type
STLVD111BF -40 to 85 °C TQFP32 (Tray) 250 parts per Tray
STLVD111BFR -40 to 85 °C TQFP32 (Tape & Reel) 2400 parts per reel
Temperature
Range
Package Comments
1/12December 2002
STLVD111
PIN CONFIGURATION
PIN DESCRIPTION
PlN N° SYMBOL NAME AND FUNCTION
1 CK Control Register Clock 2 SI Control Register Serial IN/CLK_SEL
3 CLK0 4 CLK0 Differential Input 5 6 CLK1 7 CLK1 Differential Input 8 EN Device Enable/Program
9 GND Ground 10 Q9 11 Q9 Differential Outputs 12 Q8 13 Q8 Differential Outputs 14 Q7 15 Q7 Differential Outputs 16 17 Q6 18 Q6 Differential Outputs 19 Q5 20 Q5 Differential Outputs 21 Q4 22 Q4 Differential Outputs 23 Q3 24 Q3 Differential Outputs 25 GND Ground 26 Q2 27 Q2 Differential Outputs 28 Q1 29 Q1 Differential Outputs 30 Q0 31 Q0 Differential Outputs 32
2/12
Differential Input
V
BB
Output Reference Voltage Differential Input
Differential Outputs
Differential Outputs
Differential Outputs
V
CC
Supply Voltage Differential Outputs
Differential Outputs
Differential Outputs
Differential Outputs
Differential Outputs
Differential Outputs
Differential Outputs
V
CC
Supply Voltage
STLVD111
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
OSD
ESD Electrostatic Discharge (HBM 1.5KΩ, 100pF)
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is not implied.
THERMAL DATA
Symbol Parameter Value Unit
R
RECOMMENDED OPERATIN G CONDITIONS
Symbol Parameter Min TYP Max Unit
V
CC
V
IC
T
A
T
Supply Voltage
CC
Input Voltage -0.2 to (VCC+0.2)
I
Output Voltage -0.2 to (VCC+0.2)
O
Driver Short Circuit Current
-0.3 to 2.8 V
Continuous
>2 KV
Thermal Resistance Junction-Case
Tj-c
Supply Voltage
2.375 2.625 V
13 °C/W
Receiver Common Mode Input Voltage 0.5(VID) 2-0.5(VID) Operating Free-Air Temperature Range Operating Junction Temperature
J
-40 85 °C
-40 105 °C
V V
V
DRIVER ELECTRICAL CHARACTERISTICS (T
= -40 to 85 °C, VCC= 2.5V ± 5%, unless otherwise
A
specified (Note 1, 2)
Symbol Parameter Test Conditions
Min. Typ. Max.
V
V
V
V
NOTE 1: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. NOTE 2: All typical values are given for V
Output Differential Voltage
OD
(Fig. 2)
ODVOD
OS
OSVOS
I
OS
Magnitude Change 30 mV
Offset Voltage -40 TA≤ 85°C 1.05 1.15 1.25 V
Magnitude Change 30 V
Output Short Circuit Current VO=0V 15 30 mA
RL=100 400 500 600 mV
=0V 7 15
V
OD
=2.5VandTA= 25°C unless otherwise stated.
CC
Value
Unit
RECEIVER ELECTRICAL CHARACTERISTICS (TA=-40to85°C,VCC= 2. 5V ± 5%, unless otherwise
specified (Note 1, 2)
Symbol Parameter Test Conditions
Min. Typ. Max.
V V
NOTE 1: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. NOTE 2: All typical values are given for V
Input Threshold High 100 mV
IDH
Input Threshold Low -100 mV
IDL
Input Current VI= 0V 42 100 µA
I
IN
=0V
V
I
CC
=2.5VandTA= 25°C unless otherwise stated.
CC
Value
Unit
210
3/12
STLVD111
DRIVER ELECTRICAL CHARACTERISTICS (TA= -40 to 85 °C, VCC= 2.5V ± 5%, unless otherwise
specified (Note 1, 2)
Symbol Parameter Test Conditions
Unit
Min. Typ. Max.
Value
Output Reference Voltage VCC= 2.5 V 1.15 1.25 1.35 V
V
BB
I
C
NOTE 1: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. NOTE 2: All typical values are given for V
Power Supply Current All driver enabled and loaded 125 160 mA
CCD
Input Capacitance VI=0VtoV
C
IN
Output Capacitance 5 pF
OUT
Logic Input High Threshold VCC= 2.5 V 2 V
V
IH
V
Logic Input Low Threshold VCC= 2.5 V 0.8 V
IL
Logic Input Current VCC= 2.5 V, VIN=VCCorGND ±10 µA
I
I
=2.5VandTA= 25°C unless otherwise stated.
CC
CC
5pF
LVDS TIMING CHARACTERISTICS (TA= -40 to 85 °C, VCC= 2.5V ± 5%, unless otherwise specified (Note 4)
Symbol Parameter Test Conditions
Min. Typ. Max.
t
TLH,tTHL
t
PHL,tPLH
f
MAX
t
SKEW
Transition Time RL= 100 ,CL= 5 pF, Fig. 5, 6) 220 300 ps Propagation Delay Time (Fig. 5, 6) 2 2.5 ns Maximum Input Frequency 700 900 MHz Bank Skew (Fig. 1) 50 ps
Part to Part Skew (Fig. 2) 100 Pulse Skew (Fig. 3) 50
NOTE 4: Generator waveforms for all test conditions: f=1MHz, ZO=50(unless otherwise specified).
Value
Unit
CONTROL REGISTER TIMING CHARACTERISTICS (TA=-40to85°C,VCC= 2.5V ±5%,EN=H, unless
otherwise specified (Figure 4)
Symbol Parameter Test Conditions
f
MAX
t
Maximum Frequency of Shift
(Fig. 7) 100 150 MHz
Register Clock to SI Setup Time (Fig. 7) 2 ns
t
s
Clock to SI Hold Time (Fig. 7) 1.5 ns
t
h
Enable to Clock Removal Time (Fig. 7) 1.5 ns
rem
Minimum Clock Pulse Width (Fig. 7) 3 ns
t
W
4/12
Min. Typ. Max.
Value
Unit
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