■ Fully Integrated Oscillat or requires no ex ternal
components
■ CMOS Compatible Inputs
■ Fully Integrated Configurable LCD bias voltage
generator with:
• Selectabl e
multiplication factor (up to 6X)
• Effective sensing for High Precision Output
• Eight selectable temperature compensation
coefficients
■ Designed for chip-on-glass (COG) applications
Figure 1. Block Diagram
■ Low Power Consumption, suitable for battery
operated systems
■ Logic Supply Voltage range from 1.7 to 3.6V
■ High Voltage Generator Supply Voltage range
from 1.75 to 4.2V
■ Display Supply Voltage range from 4.5 to 11V
■ Backward Compatibility with STE2001
DESCRIPTION
The STE2002 is a low power CMOS LCD controller
driver. Designed to drive a 81 rows by 128 columns
graphic display, provides all necessary functions in a
single chip, including on-chip LCD supply and bias
voltages generators, resulting in a minimum of externals components and in a very low power consumption. The STE2002 features three standard interfaces
(Seria l, P ar allel & I
host
m
controller.
Bumped WafersSTE2002DIE1
Bumped Dice on Waffle Pack
CIRCUIT DESCRIPTION
Supplies Voltages and Gro un ds
is supply voltages to the internal voltage generator (see below). If the internal voltage generator is
V
DD2
not used, this should be c onnected to V
could be different form V
DD2
.
Internal Supply Voltage Ge nerator
The IC has a fully integrated (no external capacitors required) charge pump for the Liquid Crystal Display
supply voltage generation. The multiplying factor can be programmed to be: Auto, X6, X5, X4, X3, X2, using the ’set CP Multiplication’ Command. If Auto is set, the multiplying factor is automatically selected to
have the lowest current consumption in every condition. This make possible to have an input voltage that
changes over time and a constant V
the V
LCDSENSE
pad. For this voltage, eight different temperature coefficients (TC, rate of change with tem-
LCD
perature) can be programmed using th e bits TC1 and TC0 and T2,T1 & T0. This will ensure no cont rast
degradation over the LCD operating range. Using the internal charge pump, the V
must be connected together. An external supply could be connected to V
using the internal generator. In such event the V
the internal voltage generator must be programmed to zero (PRS = [0;0], Vop = 0 - Reset condition).
Oscillator
A fully integrated oscillator (requires no externa l com ponen ts) is presen t to provi de t he clock f or t he Display System. When u sed the O SC pad must be connec ted to V
used and fed into the OSC pin. An oscillator out is provided on the OSCOUT Pad to cascade two or more
drivers
Bias Levels
To properly drive the LCD, six (Including VLCD and VSS) different voltage (Bias ) levels are generated.
The ratios among these levels and VLCD, s hould be selected acc ording to the MUX ratio (m). They are
established to be (Fig. 4):
DD1
pad. V
supplies the rest of the IC. V
DD1
voltage. The output voltage (V
LDCOUT
and V
LCDSENSE
DD1
supply voltage
DD1
LCDOUT
) is tightly controlled through
and V
LCDIN
to supply the LCD without
LCDIN
LCDOUT
pads
must be connected to GND and
pad. An external oscillator could be
LCD
n3+
,
------------ - V
n4+
LCD
n2+
,
------------ - V
n4+
LCD
Figure 4. Bias level Generator
R
R
nR
R
R
thus providing an 1/(n+4) ratio, with n calculated from:
nm3–=
For m = 81, n = 6 and an 1/10 ratio is set.
For m = 65, n =5 and an 1/9 ratio is set.
2
,
------------ - V
n4+
V
LCD
n + 3
·V
LCD
n + 4
n + 2
·V
LCD
n + 4
2
·V
LCD
n + 4
1
·V
LCD
n + 4
V
SS
D00IN115
LCD
1
,
------------ - V
n4+
LCD,VSS
6/51
STE2002
The STE2002 provides three bits (BS0, BS1, BS2) for programming the desired Bias Ratio as shown below:
BS2BS1BS0n
0007
0016
0105
0114
1003
1012
1101
1110
The following table Bias Level for m = 65 and m = 81 are provided:
Symbolm = 65 (1/9)m = 81 (1/10)
V1V
V28/9*V
V37/9*V
V42/9*V V
V51/9 *V
V6V
LCD
SS
LCD
LCD
LCD
LCD
V
LCD
9/10*V
8/10*V
2/10*V
1/10*V
V
SS
LCD
LCD
LCD
LCD
LCD Voltage Generation
The LCD Voltage at reference temperature (To = 27°C) can be set using the VOP register content according to
the following formula:
Note that the three PRS values produce three adjacent ranges for VLCD. If the V
register and PRS bits are
OP
set to zero the internal voltage generator is switched off.
The proper value for the VLCD is a function of the Liquid Crystal Threshold Voltage (Vth) and of the Multiplexing
Rate. A general expression for this is:
1m+
----------------------------------- - V
V
LCD(to)
op
-----------------------------------------=
V
⋅=
th
1
⋅
21
-------- -–
m
= 6.85 · V
th
6.85 VthAi–⋅()
0.03
For MUX Rate m = 65 the ideal V
than:
LCD
is:
V
LCD
7/51
STE2002
Temperature Coefficient
As the viscosity, and therefore the contrast, of the LCD are subject to change with temperature, there's the need
to vary the LCD Voltage with temperature. The STE2002 provides the possibility to change the VLCD in a linear
fashion against temperature with eight different Temperature Coefficient selectable through the T2, T1 and T0
bits. Only four of them are available with basic instruction set (TC1 & TC0 Bits).
voltage at a given (T) temperature can be calculated as:
LCD
A
7Fh 00h 01h 02h
(T) = V
V
LCD
03h 04h
05h …. 7Ch
PRS = [0;1]
o · [1 + (T-To) · T C]
LCD
7Dh 7Eh 7Fh
2
A
00h 01h 02h 03h 04h
05h 7Ch
….
PRS = [1;0]
7Dh 7Eh 7Fh
O
V
STE2002
Display Data RAM
The STE2002, provides an 104X128 bits Static RAM to store Display da ta. This is organized into 13
(Bank0 to Bank12) banks with 128 Bytes. One of these banks (128 bits wide) can be used for Icons. RAM
access is accomplished in either one of the Bus Interfaces provided (s ee bel ow). Allowed address es are
X0 to X127 (Horizontal) and Y0 to Y12 (Vertical).
When writing to RAM, four addressing mode are provided:
• Normal Horizontal (MX=0 and V=0), having the column with address X= 0 located on the left of the memory map. The X pointer is increased after each byte written. After the last column address (X=X-Carriage), Y address pointer is set to jump to the following bank and X restarts from X=0. (Fig. 6)
• Normal Vertical (MX=0 and V=1), having the column with address X= 0 located on the left of the memory
map. The Y pointer is increased after each byte written. After th e l ast Y bank address (Y =Y-Carriage ),
X address pointer is set to jump to next column and Y restarts from Y=0 (Fig. 7).
• Mirrored Horizontal (MX=1 and V=0), having the column with address X= 0 located on the right of the
memory map. The X pointer is increased af ter each byte written. After the last column address (X=XCarriage), Y address pointer is set to jump to the next bank and X restarts from X=0 (fig. 8).
• Mirrored Vertical (MX=1 and V=1), having the column with address X= 0 located on the right of the memory map. The Y pointer is increased after each byte written. After the last Y bank address (Y=Y-Carriage), the X pointer is set to jump to next column and Y restarts from Y=0 (fig. 9).
After the last allowed address (X;Y)=(X-Carriage; Y-Carriage), the address pointers always jump to the
cell with address (X;Y) = (0;0) (Fi. 10, 11, 12 & 13).
Data bytes in the memory could have the MSB either on top (D0 = 0, Fig.14) or on the bottom (D0=1, Fig.
15).
The STE2002 provides also means to alter the normal output addressing. A mirroring of the Display along
the X axis is enabled setting t o a l ogic one MY bit.This function does n't af fect t he cont ent of the me mory
RAM. It is only related to the visualization process.
When ICON MODE=1 the Icon Row is not mirrored with MY and is not scrolled. When ICON Mode=0 the
Icon Row is like the other graphic lines and is mirrored and scrolled.
Four are the multiplex ratio avai lable when the partial d isplay mode is disabled (MUX 33 , MUX 49, MUX
65 and MUX 81).
Only a subset of writable rows are output on Row drivers.
When Y-Carriage<MUX/8, if Mux 65 is selected only the first 65 m emory r ows are v isualized, if Mux 49 i s
selected only the first 49 memory rows are visualized, if Mux 33 is selected only the first 33 memory rows
are visualized. All unused Row and Column drivers must be left floating.
When Y-Carriage<MUX/8, the icon Bank i s located t o B A NK 10 in MUX 81 Mode, to BANK8 i n M U X 65
Mode, to BANK 6 in MUX 49 Mode and to BANK 4 in MUX 33 Mode.
When Y-Carriage>MUX/8 lines only 33, 49, 65 or 81 lines are visualized but it is possible to select which
lines of DDRAM are connected on the output drivers. The DDRAM rows to visualized can be sel ected in
the 0-Y-Carriage*8 range using the scrolling function.
When Y-Carriage>MUX lines, the icon row is moved in DDRAM to the first row of the Y-CARRIAGE Return BANK even if it is always connected on the same output Driver.
When MY=0, the icon Row is output on R80 in mux 81 mode, on R72 in MUX 65, on R64 in MUX49 and
on R56 in MUX 33.
When MY=1, and ICON MODE=1, the icon Row is output on R80 in mux 81 mode, on R72 in MUX 65, on
R64 in MUX49 and on R56 in MUX 33.
When MY=1, and ICON MODE=0, the icon Row is output on R0 whatever is the MUX Rate.
When ICON MODE =1, the Memory ICON Row content is output on ICON Pad.
If Not Used ICON Pad must be left floating.
9/51
STE2002
Figure 6. Auto m at ic da ta RAM wri t in g sequence with V=0 and Data RAM N or m a l Form a t ( MX= 0 )1
BANK 0
BANK 1
BANK 2
BANK 3
BANK 4
BANK 5
BANK 6
BANK 7
BANK 8
BANK 9
BANK 10
BANK 11
BANK 12
0123124125126127
Figure 7. Auto m at ic da ta RAM wri t in g sequence with V=1 and Data RAM N or m a l Form a t ( MX= 0 )
BANK 0
BANK 1
BANK 2
BANK 3
BANK 4
BANK 5
BANK 6
BANK 7
BANK 8
BANK 9
BANK 10
BANK 11
BANK 12
0123124125126127
Figure 8. Automatic data RAM writing sequence with V=0 and Data RAM Mirrored Format (MX=1)
1
1
127 126 125 1243 21 0
BANK 0
BANK 1
BANK 2
BANK 3
BANK 4
BANK 5
BANK 6
BANK 7
BANK 8
BANK 9
BANK 10
BANK 11
BANK 12
Figure 9. Automatic data RAM writing sequence with V=1 and Data RAM Mirrored Format (MX=1)1
BANK 0
BANK 1
BANK 2
BANK 3
BANK 4
BANK 5
BANK 6
BANK 7
BANK 8
BANK 9
BANK 10
BANK 11
BANK 12
1. X Carriage=127; Y-Carriage = 12
127 126 125 1243 2 1 0
10/51
Figure 10. Automatic data RAM writing sequence with X-Y Carriage Return (V=0; MX=0)
STE2002
BANK 0
0123
BANK 1
BANK 2
Y CARR
BANK 11
BANK 12
X CARR
124 125 126 127
Figure 11. Automatic data RAM writing sequence with X-Y Carriage Return (V=1; MX=0)
BANK 0
0123
BANK 1
BANK 2
Y CARR
BANK 11
BANK 12
X CARR
124 125 126 127
Figure 12. Automatic data RAM writing sequence with X-Y Carriage Return (V=0; MX=1)
X CARR
BANK 0
BANK 1
BANK 2
Y CARR
BANK 11
BANK 12
0
123124125126127
Figure 13. Automatic data RAM writing sequence with X-Y Carriage Return (V=1; MX=1)
X CARR
BANK 0
BANK 1
BANK 2
Y CARR
BANK 11
BANK 12
0
123124125126127
11/51
STE2002
Figure 14. Data RA M Byte or ga n iza ti on with D0 = 0
MSB
BANK 0
BANK 1
BANK 2
BANK 3
LSB
BANK 4
BANK 5
BANK 6
BANK 7
BANK 8
BANK 9
BANK 10
BANK 11
BANK 12
Figure 15. Data RA M Byte or ga n iza ti on with D0 = 1
LSB
BANK 0
BANK 1
BANK 2
BANK 3
MSB
BANK 4
BANK 5
BANK 6
BANK 7
BANK 8
BANK 9
BANK 10
BANK 11
BANK 12
0
1 2 3124 125 126 127
0
1 2 3124 125 126 127
Figure 16. Memory Rows vs. Row drivers mapping with MY=0, MUX81, ICON MODE=0,1
ICON MODE=1 ICON MODE=0
R 0
R 1
R 2
R 3
R 79
R 80
ICON
Figure 17.
ROW DRIVER
ICON MODE=1
R 0
R 1
R 2
R 3
ROW DRIVERROW DRIVER
R 0
R 1
R 2
R 3
R 79
R 80
Memory Row s vs. R ow drivers m apping with MY= 0, MUX 8 1, SCRO LL POIN TER = +3, ICON MODE=1
PHYSICAL MEMORY ROW
ROW 0
ROW 1
ROW 2
ROW 3
PHYSICAL MEMORY ROW
0
ROW 0
ROW 1
ROW 2
123124 125 126 127
ROW 3
ROW 79
ROW 80
0
123124 125 126 127
Y-CARRIAGE
ICON ROW
12/51
R 76
R 77
R 78
R 79
R 80
ICON
ROW 79
ROW 80
Y-CARRIAGE
ICON ROW
STE2002
Figure 18. Memory Rows vs. Row drivers mapping with MY=0, MUX 81, SCROLL POINTER=+3, ICON MODE=0
ROW DRIVER
ICON MODE=0
R 0
R 1
R 2
R 3
PHYSICAL MEMORY ROW
0
ROW 0
123124 125 126 127
ROW 1
ROW 2
ROW 3
Y-CARRIAGE
R 76
R 77
R 78
R 79
R 80
ROW 79
ROW 80
ROW 161
ICON ROW
ICON
Figure 19. Memory Rows vs. Row drivers mapping with MUX 65 Y-CARRIAGE<=8 SCROLL POINTER=0, ICON MODE=1
ROW DRIVER
R 0
R 30
R 31
N.C.
R 40
R 71
PHYSICAL MEMORY ROW
0
ROW 0
ROW 1
ROW 31
ROW 32
ROW 63
ROW 64
123124 125 126 127
Y-CARRIAGE
ICON ROWR 72
N.C.
R 79
R 80
ICON
ROW 96
Figure 20. Memory Rows vs. Row drivers mapping with MUX65, Y-CARRIAGE>8, SCROLL POINTER=0, ICON MODE=1
ROW DRIVER
N.C.
N.C.
R 0
R 31
R 32
R 40
R 71
R 72
R 79
R 80
ICON
PHYSICAL MEMORY ROW
0
ROW 0
ROW 31
ROW 32
ROW 63
ROW 75
ROW 76
ROW 96
123124 125 126 127
ICON ROW
Y-CARRIAGE
13/51
STE2002
Figure 21. Memory Rows vs. Row drivers mapping with MUX65, Y-CARRIAGE>8, SCROLL POINTER=3, ICON MODE=1,
ROW DRIVER
N.C.
N.C.
R 0
R 30
R 31
R 40
R 71
R 72
R 79
R 80
ICON
PHYSICAL MEMORY ROW
0
ROW 0
ROW 1
ROW 2
ROW 33
ROW 34
ROW 66
ROW 75
ROW 76
ROW 96
123124 125 126 127
ICON ROW
Y-CARRIAGE
Figure 22. Memory Rows vs. Row drivers mapping with MY=1, MUX81, ICON MODE 0,1 SCROLL POINTER=0
ROW DRIVER
ICON MODE=1
R 79
R 78
ROW DRIVER
ICON MODE=0
R 80
R 79
PHYSICAL MEMORY ROW
0
ROW 0
ROW 1
ROW 2
ROW 3
123124 125 126 127
Y-CARRIAGE
R 2
R 1
R 0
R 80
ICON
R 3
R 2
R 1
R 0
ICON
ROW 79
ROW 80
ICON ROW
Figure 23. Memory Rows vs. Row drivers mapping with MY=1, MUX81, SCROLL OFFSET= +3, ICON MODE =0
ROW DRIVER
ICON MODE=0
R 80
R 78
R 79
R 77
R 76
R 1
R 0
ICON
PHYSICAL MEMORY ROW
0
ROW 0
123124 125 126 127
ROW 1
ROW 2
ROW 3
ROW 79
ROW 80
Y-CARRIAGE
ICON ROW
14/51
STE2002
Figure 24. Memory Rows vs. Row drivers mapping with MY=1, MUX81, SCROLL OFFSET= +3, ICON MODE =1
ROW DRIVER
ICON MODE=1
R 79
R 78
R 77
R 76
PHYSICAL MEMORY ROW
0
ROW 0
123124 125 126 127
ROW 1
ROW 2
ROW 3
SCROLL OFFSET +3
R 1
R 0
R 80
ROW 79
ROW 80
ICON
Figure 25. Row Drivers vs. LCD Panel Interconnection in MUX81 Mode