This Power MOSFET is the latest development of
STMicroelectronics unique "Single Feature
Size" strip-based process. The resulting transistor shows extremely high packing density for low
on-resistance, rugged avalanche characteristics
and less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
I
D
STDID5B
STripFET POWER MOSFET
PRELIMINARY DATA
3
1
DPAK
TO-252
(Suffix "T4")
APPLICATIONS
■
DC MOTOR CONTROL
■
DC-DC & DC-AC CONVERTERS
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
I
D
I
DM
P
E
AS
T
(•) Pulse width limited by safe operating area
Drain-source Voltage (VGS = 0)55V
DS
Drain- gate Voltage (RGS = 20 kΩ)55V
DGR
Gate-source Voltage± 20V
GS
(*)Drain Current (continuous) at Tc = 25 oC12A
I
Drain Current (continuous) at Tc = 100 oC8A
D
(•)Drain Current (pulsed)48A
Total Dissipation at Tc = 25 oC35W
tot
Derating Factor0.23W/
(1)
Single Pulse Avalanche Energy25mJ
Storage Temperature-65 to 175
stg
T
Max. Operating Junction Temperature175
j
(1) starting T
o
C, ID =12A , VDD = 30V New R
= 25
j
spec. starting from July ’98
DS(on)
o
C
o
C
o
C
May 2000
1/6
STDID5B
THERMAL DATA
R
thj-case
R
thj-amb
T
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Maximum Lead Temperature For Soldering Purpose
l
4.3
100
275
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
= 25 oC unless otherwise specified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID = 250 µA V
= 055V
GS
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125 oC
DS
= ± 20 V± 100nA
V
GS
1
10
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage V
Static Drain-source On
= VGS ID = 250 µA234V
DS
VGS = 10 V ID = 9.6 A0.10.12Ω
Resistance
I
D(on)
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
12A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID = 10 A4S
= 0 V360
GS
55
25
µA
µA
pF
pF
pF
2/6
STDID5B
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Turn-on Delay Time
Rise Time
t
r
V
= 30 V ID = 6 A
DD
R
= 4.7 Ω VGS = 10 V
G
(Resistive Load, see fig. 3)
Q
Q
Q
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
V
= 48 V ID = 12 A V
DD
= 10 V10
GS
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(off)
Turn-off Delay Time
Fall Time
t
f
V
= 30 V ID = 6 A
DD
R
= 4.7 Ω VGS = 10 V
G
(Resistive Load, see fig. 3)
SOURCE DRAIN DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Source-drain Current
(•)
Source-drain Current
(pulsed)
(∗)Forward On VoltageISD = 12 A VGS = 01.3V
Reverse Recovery
rr
Time
Reverse Recovery
rr
I
= 12 A di/dt = 100 A/µs
SD
V
= 30 V Tj = 150 oC
DD
(see test circuit, fig. 5)
Charge
Reverse Recovery
Current
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granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
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