SGS Thomson Microelectronics STD8N06 Datasheet

STD8N06
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTOR
TYPE V
DSS
R
DS(on)
I
D
STD8N06 60 V < 0.25 8A
TYPICAL R
AVALANCHE RUGGED TECHNOLOGY
100% AVALANCHE TESTED
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
o
175
APPLICATION ORIENTED
C OPERATING TEMPERATURE
DS(on)
= 0.21
o
C
CHARACTERIZATION
THROUGH-HOLE IPAK (TO-251) POWER
PACKAGE IN TUBE (SUFFIX ”-1”)
SURFACE-MOUNTINGDPAK (TO-252)
POWER PACKAGE IN TAPE & REEL (SUFFIX ”T4”)
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SOLENOID AND RELAY DRIVERS
REGULATORS
DC-DC & DC-AC CONVERTERS
MOTOR CONTROL, AUDIO AMPLIFIERS
AUTOMOTIVE ENVIRONMENT (INJECTION,
ABS, AIR-BAG, LAMPDRIVERS, Etc.)
3
2
1
IPAK
TO-251
(Suffix ”-1”)
INTERNAL SCHEMATIC DIAGRAM
1
DPAK
TO-252
(Suffix ”T4”)
3
ABSOLUTE MAXIMUM RATINGS
Symb o l Paramet er Val u e Unit
V
V
V
I
DM
P
T
() Pulsewidth limited bysafe operating area
December 1996
Drain - s ource Voltage (VGS=0) 60 V
DS
Drain- gate Voltage (RGS=20kΩ)60V
DGR
Gate-source Voltage ± 20 V
GS
Drain Current (continuous) at Tc=25oC8A
I
D
Drain Current (continuous) at Tc=100oC5.6A
I
D
(•) Drain Current (pulsed) 32 A
Total Di ssipation at Tc=25oC35W
tot
Derat ing Factor 0.23 W/ St or a ge Tem perature -65 to 175
stg
Max. Operating Junction Temperature 175
T
j
o o
o
C C C
1/10
STD8N06
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Uni t
I
AR
E
E
I
AR
Thermal Resistance Junction - cas e Max Thermal Resistance Junction- ambient Max Thermal Resistance Case-sink Typ Maximum L ead Temperat ur e For Soldering Purpos e
l
Avalanc h e Cu rr ent , Repet itive or Not-R ep et itive (pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng Tj=25oC, ID=IAR,VDD=25V) Repetitive Avalanc he Energ y
AR
(pulse width limited by Tjmax, δ <1%) Avalanc h e Cu rr ent , Repet itive or Not-R ep et itive
(Tc= 100oC, pulse width limited by Tjmax, δ <1%)
4.3
100
1.5
275
8A
40 mJ
10 mJ
5.6 A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwise specified)
case
OFF
Symbol Parameter Test Condition s Min. Typ. Max. Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS=0 60 V
Break d own Volta ge
I
DSS
I
GSS
Zer o Gate Volt age Drain Current (V
GS
Gat e- body Leak age
=0)
=MaxRating
V
DS
V
= Max Rating x 0 .8 Tc=125oC
DS
1
10
VGS= ± 20 V ± 100 nA
Current (VDS=0)
ON ()
Symbol Parameter Test Condition s Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID=250µA234V St at ic Drain-s our ce O n
VGS=10V ID=4A 0.21 0.25
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on)max
8A
VGS=10V
DYNAMIC
Symbol Parameter Test Condition s Min. Typ. Max. Unit
()Forward
g
fs
Tr ansconductance
C C C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=4A 1 3 S
VDS=25V f=1MHz VGS=0 260
90 30
340 120
40
µA µA
pF pF pF
2/10
STD8N06
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Condition s Min. Typ. Max. Unit
t
d(on)
(di/dt)
Q Q Q
Turn-on T im e
t
Rise Time
r
Turn-on C urrent S lope VDD=48V ID=8A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
Symbol Parameter Test Condition s Min. Typ. Max. Unit
t
r(Voff)
t
Off -voltage R ise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAIN DIODE
VDD=30V ID=4A RG=47 Ω VGS=10V
14 75
(see test circuit, figure 3)
240 A/µs RG=47 Ω VGS=10V (see test circuit, figure 5)
VDD=48V ID=8A VGS=10V 13
7 4
VDD=48V ID=8A RG=47 Ω VGS=10V (see test circuit, figure 5)
16 22 45
20
100
20 nC
25 30 60
ns ns
nC nC
ns ns ns
Symbol Parameter Test Condition s Min. Typ. Max. Unit
I
I
SDM
SD
Source-drain Current
()
Source-drain Current
8
32
(pulsed)
V
(∗) F or ward O n Voltage ISD=8A VGS=0 1.5 V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD=8A di/dt=100A/µs VDD=25V Tj=150oC (see test circuit, figure 5)
70
0.18
Charge
I
RRM
Reverse Recovery
5
Current
() Pulsed:Pulse duration = 300 µs, dutycycle 1.5 % () Pulse widthlimited by safeoperating area
Safe Operating Area Thermal Impedance
A A
ns
µC
A
3/10
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