SGS Thomson Microelectronics STD40NF06 Datasheet
STD40NF06
N-CHANNEL 60V - 0.024 Ω - 40A DPAK
STripFET™ II POWER MOSFET
TYPE
V
DSS
STD40NF06 60 V <0.028
■ TYPICAL R
■ EXCEPTIONA L dv/d t CAPABILITY
■ 100% AVALANCHE TESTED
■ SURFACE-MOUNTING DPAK (TO-252)
(on) = 0.024 Ω
DS
R
DS(on)
I
D
40 A
Ω
POWER PACKAGE IN TAPE & REEL
(SUFFIX “T4")
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectron is unique "Single Feature Size™" str ipbased process . The res ulting tran sistor sho ws extrem ely
high packing density for low on-resistance, rugged
avalanche characteristics and less critical alignment
steps therefore a remarkable manufacturing
reproducibility.
APPLICATIONS
■ HIGH CURRENT, HIGH SWITCHING SPEED
■ MOTOR CONTROL , AUDIO AMPLIFIERS
■ SOLENOID AND RELAY DRIVERS
■ DC-DC & DC-AC CONVERTERS
3
1
DPAK
TO-252
(Suffix “T4”)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
D
I
D
(
I
DM
P
tot
dv/dt
E
AS
T
stg
T
j
(
Pulse width l i mited by safe operating area. (1) ISD ≤40A, di/dt ≤300A/ µ s , VDD ≤ V
•)
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
60 V
60 V
Gate- source Voltage ± 20 V
Drain Current (continuous) at TC = 25°C
Drain Current (continuous) at TC = 100°C
•)
Drain Current (pulsed) 160 A
Total Dissipation at TC = 25°C
40 A
28 A
85 W
Derating Factor 0.57 W/°C
(1) Peak Diode Recovery voltage slope 10 V/ns
(2)
Single Pulse Avalanche Energy 250 mJ
Storage Temperature
Operating Junction Temperature
(2) Starting Tj = 25 oC, ID = 20 A, VDD = 30 V
-55 to 175 °C
, Tj ≤ T
(BR)DSS
JMAX
1/9January 2003
STD40NF06
THERMA L D ATA
Rthj-case
Rthj-
T
(#) When M ounted on 1 inch
Thermal Resistance Junction-case
Thermal Resistance Junction-PCB (#)
PCB
Maximum Lead Temperature For Soldering Purpose
l
2
FR-4 boar d, 2 oz Cu.
Max
Max
1.76
50
275
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
V
(BR)DSS
Drain-source
= 250 µA, VGS = 0
D
60 V
Breakdown Voltage
V
= Max Rating
DS
V
= Max Rating TC = 100°C
DS
V
= ± 20 V
GS
1
10
±100 nA
ON
(*)
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
Resistance
= VGS I
DS
V
= 10 V ID = 20 A
GS
= 250 µA
D
24V
0.024 0.028
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
= 30 V ID= 20 A
DS
= 25V, f = 1 MHz, VGS = 0
V
DS
13 S
920
225
80
µA
µA
Ω
pF
pF
pF
2/9
STD40NF06
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 30 V ID = 20 A
t
d(on)
Turn-on Delay Time
t
r
Rise Time
V
DD
R
= 4.7 Ω VGS = 10 V
G
(Resistive Load, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
= 48V ID = 40A VGS= 10V
V
DD
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 30 V ID = 20 A
t
d(off)
Turn-off Delay Time
t
f
Fall Time
V
DD
R
= 4.7Ω, V
G
GS
= 10 V
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: P ul se duration = 300 µs, duty cy cle 1.5 %.
(
•)Pulse width limited by safe operating area.
Source-drain Current
(•)
Source-drain Current (pulsed)
(*)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
= 40 A VGS = 0
SD
= 40 A di/dt = 100A/µs
I
SD
V
= 10 V Tj = 150°C
DD
(see test circuit, Figure 5)
11
50
32
6.5
15
27
11
63
150
4.8
43 nC
40
160
1.3 V
ns
ns
nC
nC
ns
ns
A
A
ns
nC
A
Safe Operating Area Thermal Impedance
3/9
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