SGS Thomson Microelectronics STD3NB30 Datasheet

STD3NB30
N - CHANNEL300V - 1.8Ω - 3.2A - DPAK
PowerMESH MOSFET
TYPE V
DSS
R
DS(on)
I
D
ST D3N B3 0 300 V < 2 3.2 A
TYPICALR
100%AVALANCHETESTED
VERYLOW INTRINSIC CAPACITANCES
GATECHARGE MINIMIZED
ADDSUFFIX ”T4” FORORDERING IN TAPE
DS(on)
=1.8
& REEL (2500 UNITS)
DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company’s proprietary edge termination structure, gives the lowest R
per area, exceptional avalanche
DS(on)
and dv/dt capabilities and unrivalled gate charge and switching characteristics.
APPLICATIONS
SWITCHMODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENTANDUNINTERRUPTIBLE POWERSUPPLIESAND MOTORDRIVE
3
1
DPAK
TO-252
(Suffix ”T4”)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
DM
P
dv/dt(
T
() Pulse width limited by safeoperating area (1)ISD≤3.2A, di/dt ≤ 200 A/µs, VDD≤ V
January 1999
Dra in- sour c e Vol t age (VGS= 0) 300 V
DS
Dra in- gate Volt age ( RGS=20kΩ) 300 V
DGR
Gat e-source Voltage ± 30 V
GS
I
Dra in Current (c ont in uous ) at Tc=25oC3.2A
D
I
Dra in Current (c ont in uous ) at Tc=100oC2A
D
() Dra in Current (puls ed ) 12.8 A
Tot al Dis s ipation at Tc=25oC40W
tot
Der ati ng Factor 0.32 W/
1) Peak Diode Recovery voltage sl ope 5.5 V/ns
St orage Tempe rat ure -65 t o 150
stg
T
Max. O perating Junction Temperatur e 150
j
,Tj≤T
(BR)DSS
JMAX
o
C
o
C
o
C
1/8
STD3NB30
THERMAL DATA
R
thj-case
Rthj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
Ther mal Res istance J unction-ca se Max Ther mal Res istance J unction-am bie nt Max Ther mal Res istance Cas e - sink Ty p Maximum Lead Te mpe ra t ure For Soldering Pur p os e
l
Avalanche Current, R epetitive or Not-Repetitive (pulse width limited by T
Single P ul s e Avalanche Energy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max)
j
3.12 100
1.5
275
3.2 A
50 mJ
o
C/W
oC/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS= 0 300 V
Break dow n Voltage
I
DSS
I
GSS
Zero Gate Voltage Drain Cur rent ( V
GS
Gat e- bod y L eak ag e Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRating Tc=125oC
V
DS
V
=± 30 V
GS
1
10
100 nA
±
ON()
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=V Sta t ic Drain -s ource On
VGS=10V ID=1.6 A 1.8 2
GS
ID= 250 µA345V
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on )max
3.2 A
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capac i t ance
iss
Out put Capacitanc e
oss
Reverse Tr ansfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=1.6 A 0.5 1.3 S
VDS=25V f=1MHz VGS= 0 260
55
7
µ µA
pF pF pF
A
2/8
STD3NB30
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Time Rise Ti m e
VDD=150V ID=3.2A R
=4.7
G
VGS=10V
9 9
12 12
(see test circuit, figure 3)
Q Q Q
Tot al Gat e Charge
g
Gat e- Source Charg e
gs
Gate-Drain Charge
gd
VDD= 240 V ID=3.2 A VGS=10V 12
7.5 3
16 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
t
Off-volt age Rise Time Fall T ime
f
Cross-over Time
c
VDD=240V ID= 3.2 A
=4.7 VGS=10V
R
G
(see test circuit, figure 5)
10 15
14
7
10 20
SOURCEDRAINDIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed:Pulse duration = 300µs, duty cycle 1.5% () Pulse width limited by safe operating area
Source-drain Current
(•)
Source-drain Current
3416A
(pulsed)
(∗)ForwardOnVoltage ISD=3.2A VGS=0 1.5 V
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 3. 2 A di/dt = 100 A/µs
= 100 V Tj=150oC
V
DD
(see test circuit, figure 5)
180
800 Charge Reverse Recovery
9
Current
ns ns
nC nC
ns ns ns
A
ns
nC
A
SafeOperating Area ThermalImpedance
3/8
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