SGS Thomson Microelectronics STD2NC50, STD2NC50-1 Datasheet
STD2NC50
STD2NC50-1
N-CHANNEL 500V - 3Ω - 2.2A DPAK/IPAK
PowerMesh™II MOSFET
TYPE V
STD2NC50
STD2NC50-1
■ TYPICAL R
■ EXTREMELY HIGH dv /d t C APABILITY
■ 100% AVALANCHE TESTED
■ NEW HIGH VOLTAGE BENCHMARK
■ GATE CHARGE MINIMIZED
DS
DSS
500 V
500 V
(on) = 3 Ω
R
DS(on)
< 4
< 4
I
D
Ω
Ω
2.2 A
2.2 A
DESCRIPTION
The PowerMESH
generation of MESH OVERLAY
™II is the evolution of the first
™. The layout re-
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lea ding edge for what concerns swithing speed, gate
charge and ruggedness.
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITH MODE POWER SUPPLI ES ( SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVER
3
1
DPAK
IPAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
(1)
j
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
Gate- source Voltage ±30 V
Drain Current (continuos) at TC = 25°C
Drain Current (continuos) at TC = 100°C
Drain Current (pulsed) 8.8 A
Total Dissipation at TC = 25°C
Derating Factor 0.36 W/°C
Storage Temperature –60 to 150 °C
Max. Operating Junction Temperature 150 °C
(1)ISD ≤ 2.2A, di/dt ≤100A/µs, VDD ≤ V
500 V
500 V
2.2 A
1.4 A
45 W
, Tj ≤ T
(BR)DSS
JMAX
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt Peak Diode Recovery voltage slope 3 V/ns
T
stg
T
(•)Pu l se width limite d by safe operat i ng area
1/10May 2001
STD2NC50 / STD2NC50-1
THERMA L D ATA
Rthj-case Thermal Resistance Junction-case Max 2.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
max)
j
Single Pulse Avalanche Energy
(starting T
= 25 °C, ID = IAR, VDD = 50 V)
j
Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (V
GS
= 0)
Gate-body Leakage
Current (V
DS
= 0)
2.2 A
140 mJ
ID = 250 µA, VGS = 0 500
V
= Max Rating
DS
V
= Max Rating, TC = 125 °C
DS
V
= ±30V ±100 nA
GS
1µA
50 µA
V
ON
(1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
V
= VGS, ID = 250µA
DS
VGS = 10V, ID = 1.4 A
234V
34
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS > I
g
fs
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 45 pF
Reverse Transfer
Capacitance
I
D
V
= 1.4A
DS
D(on)
x R
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
2S
260 pF
5pF
Ω
2/10
STD2NC50 / STD2NC50-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Turn-on Delay Time
t
r
Rise Time
= 250V, ID = 1.4 A
V
DD
RG= 4.7Ω VGS = 10V
(see test circuit, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
= 400V, ID = 2.8 A,
V
DD
VGS = 10V
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 400V, ID = 2.8 A,
t
r(Voff)
t
t
Off-voltage Rise Time
f
c
Fall Time
Cross-over Time
V
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1.5 %.
2. Pulse width li mited by safe operating area .
Source-drain Current 2.2 A
(2)
Source-drain Current (pulsed) 8.8 A
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge 2200 nC
ISD = 2.2 A, VGS = 0
I
= 2.8A, di/dt = 100A/µs,
SD
V
= 100V, Tj = 150°C
DD
(see test circuit, Figure 5)
Reverse Recovery Current 11.5 A
10
10
10
13.5 nC
2.5
4.5
10
8
20
1.6 V
380 ns
ns
ns
nC
nC
ns
ns
ns
Safe Operating Area Thermal Impedence
3/10
Loading...